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1.发明申请METHOD OF GRINDING SEMICONDUCTOR WAFERS, GRINDING SURFACE PLATE, AND GRINDING DEVICE 有权研磨半导体晶片的研磨方法，研磨表面和研磨装置公开(公告)号：US20090298396A1
公开(公告)日：2009-12-03
申请号：US12470714
申请日：2009-05-22
CPC分类号： B24B37/042 , B24B7/17 , B24B7/228 , B24B37/08 , B24B41/067 , B24B47/12 , B24D7/14
摘要： A method of grinding semiconductor wafers including simultaneously grinding both surfaces of multiple semiconductor wafers by rotating the wafers between a pair of upper and lower rotating surface plates in a state where the wafers are held on a carrier so that centers of the wafers are positioned on a circumference of a single circle, wherein a ratio of an area of a circle passing through the centers of the wafers to an area of one of the wafers is greater than or equal to 1.33 but less than 2.0; surfaces of the fixed abrasive grains comprised in the surface plates are comprised of pellets disposed in a grid-like fashion, with the pellets provided in a center portion and pellets provided in a peripheral portion being larger in size than the pellets provided in an intermediate portion.
摘要翻译： 一种研磨半导体晶片的方法，包括在晶片被保持在载体上的状态下，通过在一对上下旋转表面板之间旋转晶片同时研磨多个半导体晶片的两个表面，使得晶片的中心位于 圆周，其中通过晶片中心的圆的面积与一个晶片的面积的比率大于或等于1.33但小于2.0; 包含在表面板中的固定磨料颗粒的表面由网格状排列的颗粒组成，颗粒设置在中心部分，并且设置在周边部分中的颗粒的尺寸大于设置在中间部分中的颗粒 。
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公开(公告)号：US20090297755A1
公开(公告)日：2009-12-03
申请号：US12471855
申请日：2009-05-26
申请人： Sakae KOYATA , Tomohiro HASHII , Yasunori YAMADA , Satoshi YUKIWAKI , Shinji SAKAMOTO , Tomoko OHMACHI
发明人： Sakae KOYATA , Tomohiro HASHII , Yasunori YAMADA , Satoshi YUKIWAKI , Shinji SAKAMOTO , Tomoko OHMACHI
IPC分类号： B32B5/00
CPC分类号： H01L21/304 , C30B29/06 , C30B33/10 , H01L21/02008 , H01L29/06 , Y10T428/21
摘要： A semiconductor wafer has a diameter of 450 mm and a thickness of at least 725 μm and no greater than 900 μm.
摘要翻译： 半导体晶片的直径为450mm，厚度至少为725μm，不大于900μm。
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公开(公告)号：US20050047083A1
公开(公告)日：2005-03-03
申请号：US10962472
申请日：2004-10-13
申请人： Yoshihiro Kondo , Shigeo Ohashi , Rintaro Minamitani , Takashi Naganawa , Yuji Yoshitomi , Masato Nakanishi , Yasuhiko Sasaki , Tsuyoshi Nakagawa , Osamu Suzuki , Shinji Matsushita , Yasunori Yamada
发明人： Yoshihiro Kondo , Shigeo Ohashi , Rintaro Minamitani , Takashi Naganawa , Yuji Yoshitomi , Masato Nakanishi , Yasuhiko Sasaki , Tsuyoshi Nakagawa , Osamu Suzuki , Shinji Matsushita , Yasunori Yamada
CPC分类号： H05K7/20781 , G06F1/20 , G06F2200/201
摘要： An electronic module which is detachably mounted on electronic equipment. The electronic module includes a board having a heat generator mounted on a surface thereof, and a cooling jacket which is integrally attached to the electronic module. The cooling jacket is thermally coupled to the heat generator and has a passage of a cooling fluid therewithin.
摘要翻译： 一种可拆卸地安装在电子设备上的电子模块。 电子模块包括安装在其表面上的具有发热体的板和与电子模块一体地连接的冷却套。 冷却套与热发生器热耦合，并且在其中具有冷却流体的通道。
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公开(公告)号：US20190039658A1
公开(公告)日：2019-02-07
申请号：US16046424
申请日：2018-07-26
申请人： Yoshimitsu YOKOI , Shinichirou MUROFUSHI , Keisuke SUZUKI , Yasunori YAMADA , Tetsuya SHINOHARA , Kenji TAKADA , Shigeaki KITAMURA , Hironao ITO
发明人： Yoshimitsu YOKOI , Shinichirou MUROFUSHI , Keisuke SUZUKI , Yasunori YAMADA , Tetsuya SHINOHARA , Kenji TAKADA , Shigeaki KITAMURA , Hironao ITO
IPC分类号： B62D25/04 , B62D25/06 , B62D29/00 , B32B3/12 , B32B3/28 , B32B5/20 , B32B15/04 , B32B27/06 , B32B27/34
CPC分类号： B62D25/04 , B32B3/12 , B32B3/28 , B32B5/20 , B32B15/046 , B32B27/065 , B32B27/34 , B32B2266/0271 , B32B2266/0278 , B32B2307/558 , B32B2605/08 , B62D21/157 , B62D25/06 , B62D29/002 , B62D29/005
摘要： A body frame structure forming a side part of an automobile includes an outer panel, an inner panel that forms a closed space elongated in a first direction between the inner panel and the outer panel, a metal outer R/F disposed within the closed space, a resin R/F disposed within the closed space, and a foam disposed within the closed space. The closed space includes a three-layer structure including the outer R/F, the resin R/F, and the foam filling a space between the outer R/F and the resin R/F.
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公开(公告)号：US08092278B2
公开(公告)日：2012-01-10
申请号：US12468308
申请日：2009-05-19
申请人： Yasunori Yamada
发明人： Yasunori Yamada
IPC分类号： B24B1/00
CPC分类号： H01L21/02032 , H01L21/02021
摘要： Chamfer correction is performed to a chamfered portion at least on a front side of a silicon wafer after an incoming inspection. Thereby, a thickness of the chamfered portion on the front side of the wafer is restored, and thus the number of reclamation cycles of the silicon wafer can be increased. In addition, the chamfered portion is not deformed even after reclamation is repeated for a plurality of times.
摘要翻译： 在进入检查之后，至少在硅晶片的前侧对倒角部进行倒角校正。 由此，能够恢复晶片正面的倒角部的厚度，能够提高硅晶片的再生循环次数。 此外，即使在重复多次重复之后，倒角部也不变形。
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公开(公告)号：US20090291621A1
公开(公告)日：2009-11-26
申请号：US12468308
申请日：2009-05-19
申请人： Yasunori YAMADA
发明人： Yasunori YAMADA
IPC分类号： H01L21/463
CPC分类号： H01L21/02032 , H01L21/02021
摘要： Chamfer correction is performed to a chamfered portion at least on a front side of a silicon wafer after an incoming inspection. Thereby, a thickness of the chamfered portion on the front side of the wafer is restored, and thus the number of reclamation cycles of the silicon wafer can be increased. In addition, the chamfered portion is not deformed even after reclamation is repeated for a plurality of times.
摘要翻译： 在进入检查之后，至少在硅晶片的前侧对倒角部进行倒角校正。 由此，能够恢复晶片正面的倒角部的厚度，能够提高硅晶片的再生循环次数。 此外，即使在重复多次重复之后，倒角部也不变形。
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公开(公告)号：US20080059845A1
公开(公告)日：2008-03-06
申请号：US11831117
申请日：2007-07-31
申请人： Yasunori YAMADA
发明人： Yasunori YAMADA
CPC分类号： G06F11/2046 , G06F11/2025 , G06F11/2041
摘要： In a computer system, each personal computer includes a bootup management device managing the start operation thereof. The bootup management device excludes a personal computer that failed to start, and provides a user with another personal computer. The user operates the terminal device connected to a network, and can accomplish his work whichever personal computer is connected to his terminal device. An original bootup disk image is allocated to the personal computer determined to be abnormal and it is checked whether the personal computer can operate normally or not. If the personal computer can operate normally, this personal computer is registered in the bootup management device. If unable to operate normally, the personal computer is registered and notified as needing to be maintained.
摘要翻译： 在计算机系统中，每个个人计算机包括管理其启动操作的启动管理装置。 引导管理装置排除无法启动的个人计算机，并向用户提供另一个个人计算机。 用户操作连接到网络的终端设备，并且可以完成他的工作，无论个人计算机连接到他的终端设备。 将原始的启动盘图像分配给被确定为异常的个人计算机，并检查个人计算机是否能正常运行。 如果个人计算机可以正常运行，则该个人计算机被登记在启动管理装置中。 如果无法正常运行，则个人计算机被注册并通知为需要维护。
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公开(公告)号：US20070165018A1
公开(公告)日：2007-07-19
申请号：US11614175
申请日：2006-12-21
申请人： Yasunori Yamada
发明人： Yasunori Yamada
CPC分类号： G06F1/28
摘要： A client device used by a user is formed by a PC as a first client and a terminal device as a second client. The terminal device is, for example, a portable type and has software capable of inputting/outputting information to/from a personal computer (PC) and being controlled at a remote place. For example, a plurality of PCs are integrated for management. Data used by the user is not stored in the terminal device side but stored in the PC side. The PC includes, for example, a sub processor and a state of the main body is monitored by the sub processor so as to detect abnormality.
摘要翻译： 用户使用的客户端设备由作为第一客户端的PC和作为第二客户端的终端设备形成。 终端装置例如是便携式装置，并且具有能够向个人计算机（PC）输入/输出信息并且被控制在远程位置的软件。 例如，多个PC被集成用于管理。 用户使用的数据不存储在终端设备侧，但存储在PC端。 PC包括例如子处理器，并且主体的状态由子处理器监视以检测异常。
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公开(公告)号：US4280987A
公开(公告)日：1981-07-28
申请号：US53521
申请日：1979-06-29
申请人： Yasunori Yamada , Yuji Shibue
发明人： Yasunori Yamada , Yuji Shibue
摘要： Bayer liquor containing carbon compounds is freed from the carbon compounds by a method which comprises adjusting the molar ratio of the aluminum component to the sodium component in the liquid to a value in the range of from 1 to 5 calculated as Al.sub.2 O.sub.3 /Na.sub.2 O and heating the resultant Bayer liquor.
摘要翻译： 含有碳化合物的拜耳液体通过包括将铝组分与液体中的钠组分的摩尔比调节为以Al 2 O 3 / Na 2计算的1至5的范围的值，并将 结果拜耳酒。
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公开(公告)号：US10703417B2
公开(公告)日：2020-07-07
申请号：US16046424
申请日：2018-07-26
申请人： Yoshimitsu Yokoi , Shinichirou Murofushi , Keisuke Suzuki , Yasunori Yamada , Tetsuya Shinohara , Kenji Takada , Shigeaki Kitamura , Hironao Ito
发明人： Yoshimitsu Yokoi , Shinichirou Murofushi , Keisuke Suzuki , Yasunori Yamada , Tetsuya Shinohara , Kenji Takada , Shigeaki Kitamura , Hironao Ito
IPC分类号： B60J7/00 , B62D25/04 , B62D25/06 , B62D29/00 , B32B3/12 , B32B3/28 , B32B5/20 , B32B27/06 , B32B27/34 , B32B15/04
摘要： A body frame structure forming a side part of an automobile includes an outer panel, an inner panel that forms a closed space elongated in a first direction between the inner panel and the outer panel, a metal outer R/F disposed within the closed space, a resin R/F disposed within the closed space, and a foam disposed within the closed space. The closed space includes a three-layer structure including the outer R/F, the resin R/F, and the foam filling a space between the outer R/F and the resin R/F.
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