公开(公告)号：US09500693B2

公开(公告)日：2016-11-22

申请号：US13676605

申请日：2012-11-14

申请人： Tomoko Monda ,  Kenji Hirohata

发明人： Tomoko Monda ,  Kenji Hirohata

IPC分类号： G01R31/00 ,  G01R31/04

CPC分类号： G01R31/048 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to an embodiment, an electronic apparatus includes a first member serving as a circuit board member; a second member serving as a circuit board member or a semiconductor device; a first electrode formed on the first member; a second electrode formed on a region, of the first member, around a region where the first electrode is formed; and a third electrode formed on the second member. The electronic apparatus also includes a electrical joint configured to bond the first electrode, the second electrode, and the third electrode; and a measuring module configured to measure an electrical characteristic value of a connection path including at least one of the first electrode and the second electrode.

摘要翻译： 根据实施例，电子设备包括用作电路板部件的第一部件; 用作电路板部件或半导体器件的第二部件; 形成在第一构件上的第一电极; 形成在所述第一构件的区域上的第二电极，围绕形成所述第一电极的区域; 以及形成在所述第二构件上的第三电极。 电子设备还包括电接头，其被配置为结合第一电极，第二电极和第三电极; 以及测量模块，被配置为测量包括所述第一电极和所述第二电极中的至少一个的连接路径的电特性值。

公开(公告)号：US08965712B2

公开(公告)日：2015-02-24

申请号：US13051881

申请日：2011-03-18

申请人： Takahiro Omori ,  Kenji Hirohata ,  Tomoko Monda ,  Katsuaki Hiraoka ,  Minoru Mukai

发明人： Takahiro Omori ,  Kenji Hirohata ,  Tomoko Monda ,  Katsuaki Hiraoka ,  Minoru Mukai

IPC分类号： G01B3/44 ,  B23K31/12 ,  B23K1/00 ,  H01L23/00 ,  G06F11/30 ,  G01R31/04 ,  H05K1/02 ,  H05K3/34

CPC分类号： B23K31/125 ,  B23K1/00 ,  G01N2203/0073 ,  G01N2203/0212 ,  G01R31/048 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L2224/131 ,  H01L2224/14515 ,  H01L2224/14517 ,  H01L2224/16225 ,  H01L2224/17517 ,  H01L2924/10253 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K3/3436 ,  H01L2924/014 ,  H01L2924/00

摘要： A life predicting method for a solder joint includes a step of referring to a temperature history of a measurement object having a solder joint, a step of examining at least one physical quantity selected from the group consisting of amplitude, a cycle number, a mean temperature, and a periodic length of a temperature variation with a cycle count method from the temperature history, a step of calculating a strain range by utilizing a previously prepared response surface from the physical quantity examined with the cycle count method, and a step of calculating a strain range increasing rate from a strain range with reference to a previously obtained damage index and a strain variation history of the strain range.

摘要翻译： 用于焊点的寿命预测方法包括参考具有焊接接头的测量对象的温度历史的步骤，检查从由振幅，周期数，平均温度等组成的组中选择的至少一个物理量的步骤 以及来自温度历史的循环计数法的温度变化的周期长度，通过利用由循环计数法检查的物理量利用预先准备好的响应面来计算应变范围的步骤，以及计算 从应变范围的应变范围增加率参考先前获得的损伤指数和应变范围的应变变化历史。

公开(公告)号：US09310414B2

公开(公告)日：2016-04-12

申请号：US13616460

申请日：2012-09-14

申请人： Takahiro Omori ,  Kenji Hirohata ,  Tomoko Monda ,  Kazuyo Narita ,  Toshikatsu Akiba ,  Akihiro Koga ,  Katsumi Hisano

发明人： Takahiro Omori ,  Kenji Hirohata ,  Tomoko Monda ,  Kazuyo Narita ,  Toshikatsu Akiba ,  Akihiro Koga ,  Katsumi Hisano

IPC分类号： G01R31/00 ,  G01R31/02 ,  H01L23/00 ,  G01R31/327

CPC分类号： G01R31/026 ,  G01R31/3274 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/45124 ,  H01L2224/4554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： According to one embodiment, in an electronic apparatus, a first pair of electrodes has a first electrode and a second electrode. A second pair of electrodes is disposed in parallel with the first pair, and has a third electrode and a fourth electrode. A third pair of electrodes is disposed between the first pair and the second pair in parallel with the first pair and the second pair, and has a fifth electrode and a sixth electrode. A first wire electrically connects the first electrode and the second electrode. A second wire electrically connects the third electrode and the fourth electrode. A third wire electrically connects the fifth electrode and the sixth electrode. A gel covers the first wire, the second wire, and the third wire. A first detection unit detects a break status of the first wire or the second wire.

摘要翻译： 根据一个实施例，在电子设备中，第一对电极具有第一电极和第二电极。 第二对电极与第一对平行设置，并具有第三电极和第四电极。 第三对电极与第一对和第二对平行设置在第一对和第二对之间，并且具有第五电极和第六电极。 第一线将第一电极和第二电极电连接。 第二导线电连接第三电极和第四电极。 第三线电连接第五电极和第六电极。 凝胶覆盖第一线，第二线和第三线。 第一检测单元检测第一线或第二线的断开状态。

公开(公告)号：US08884634B2

公开(公告)日：2014-11-11

申请号：US13429762

申请日：2012-03-26

申请人： Kenji Hirohata ,  Minoru Mukai ,  Tomoko Monda

发明人： Kenji Hirohata ,  Minoru Mukai ,  Tomoko Monda

IPC分类号： G01R27/26

CPC分类号： G01R27/16 ,  H01L23/64 ,  H01L2924/0002 ,  H01L2924/00

摘要： According to one embodiment, a semiconductor module comprises a substrate, a first wiring, an electrode pad, a junction, an oscillator, and a detector. The first wiring is disposed on the substrate, and has a characteristic impedance Z0. The electrode pad is connected to the first wiring. The junction is disposed on the electrode pad, and has an impedance Z1. The oscillator is disposed in contact with the first wiring, and oscillates a pulse wave of a voltage toward the junction via the first wiring. The detector is disposed in contact with the first wiring, and detects an output wave of the pulse wave from the junction. The characteristic impedance Z0 and the impedance Z1 satisfy a following relationship (1),  Z ⁢ ⁢ 0 - Z ⁢ ⁢ 1 Z ⁢ ⁢ 0  ≤ 0.05 . ( 1 )

摘要翻译： 根据一个实施例，半导体模块包括衬底，第一布线，电极焊盘，结，振荡器和检测器。 第一布线设置在基板上，并具有特性阻抗Z0。 电极焊盘连接到第一布线。 接点设置在电极焊盘上，并具有阻抗Z1。 振荡器设置成与第一布线接触，并且经由第一布线使得电压脉冲波朝向结。 检测器设置成与第一布线接触，并检测来自结的脉冲波的输出波。 特征阻抗Z0和阻抗Z1满足以下关系式（1），Z⁢0 -Z⁢1 Z⁢0≤0.05。 （1）

公开(公告)号：US20130124118A1

公开(公告)日：2013-05-16

申请号：US13676605

申请日：2012-11-14

申请人： Tomoko Monda ,  Kenji Hirohata

发明人： Tomoko Monda ,  Kenji Hirohata

IPC分类号： G01R31/04

CPC分类号： G01R31/048 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to an embodiment, an electronic apparatus includes a first member serving as a circuit board member; a second member serving as a circuit board member or a semiconductor device; a first electrode formed on the first member; a second electrode formed on a region, of the first member, around a region where the first electrode is formed; and a third electrode formed on the second member. The electronic apparatus also includes a electrical joint configured to bond the first electrode, the second electrode, and the third electrode; and a measuring module configured to measure an electrical characteristic value of a connection path including at least one of the first electrode and the second electrode.

摘要翻译： 根据实施例，电子设备包括用作电路板部件的第一部件; 用作电路板部件或半导体器件的第二部件; 形成在第一构件上的第一电极; 形成在所述第一构件的区域上的第二电极，围绕形成所述第一电极的区域; 以及形成在所述第二构件上的第三电极。 电子设备还包括电接头，其被配置为结合第一电极，第二电极和第三电极; 以及测量模块，被配置为测量包括所述第一电极和所述第二电极中的至少一个的连接路径的电特性值。

公开(公告)号：US08482998B2

公开(公告)日：2013-07-09

申请号：US13446034

申请日：2012-04-13

申请人： Minoru Mukai ,  Kenji Hirohata ,  Tomoko Monda

发明人： Minoru Mukai ,  Kenji Hirohata ,  Tomoko Monda

IPC分类号： G11C7/00

CPC分类号： H05K3/341 ,  H05K3/3436 ,  H05K2201/10151 ,  H05K2201/10159 ,  H05K2203/163 ,  Y02P70/613

摘要： A storage device includes: a printed circuit board; a semiconductor memory package mounted on the printed circuit board via solder joints, the semiconductor memory package incorporating semiconductor memories; a sensor configured to measure a physical quantity relating to a state of the storage device; a database including a damage estimation model base to be used for estimating damage of the solder joints from the physical quantity measured by the sensor; a damage estimating module configured to calculate a damage estimation value of the solder joints from the physical quantity using the damage estimation model base; and a controller configured to control writing, reading, and erasure of electronic data to or from the semiconductor memories based on the damage estimation values calculated by the damage estimating module.

摘要翻译： 存储装置包括：印刷电路板; 半导体存储器封装，其通过焊点安装在所述印刷电路板上，所述半导体存储器封装结合有半导体存储器; 被配置为测量与所述存储装置的状态有关的物理量的传感器; 数据库，包括用于从传感器测量的物理量估计焊点的损坏的损伤估计模型库; 损伤估计模块，被配置为使用所述损伤估计模型基础从所述物理量计算所述焊点的损伤估计值; 以及控制器，其被配置为基于由所述损伤估计模块计算出的损伤估计值来控制对所述半导体存储器的电子数据的写入，读取和擦除。

公开(公告)号：US20120248440A1

公开(公告)日：2012-10-04

申请号：US13429762

申请日：2012-03-26

申请人： Kenji HIROHATA ,  Minoru Mukai ,  Tomoko Monda

发明人： Kenji HIROHATA ,  Minoru Mukai ,  Tomoko Monda

IPC分类号： H01L23/64

CPC分类号： G01R27/16 ,  H01L23/64 ,  H01L2924/0002 ,  H01L2924/00

摘要： According to one embodiment, a semiconductor module comprises a substrate, a first wiring, an electrode pad, a junction, an oscillator, and a detector. The first wiring is disposed on the substrate, and has a characteristic impedance Z0. The electrode pad is connected to the first wiring. The junction is disposed on the electrode pad, and has an impedance Z1. The oscillator is disposed in contact with the first wiring, and oscillates a pulse wave of a voltage toward the junction via the first wiring. The detector is disposed in contact with the first wiring, and detects an output wave of the pulse wave from the junction. The characteristic impedance Z0 and the impedance Z1 satisfy a following relationship (1),  Z   0 - Z   1 Z   0  ≤ 0.05 . ( 1 )

摘要翻译： 根据一个实施例，半导体模块包括衬底，第一布线，电极焊盘，结，振荡器和检测器。 第一布线设置在基板上，并具有特性阻抗Z0。 电极焊盘连接到第一布线。 接点设置在电极焊盘上，并具有阻抗Z1。 振荡器设置成与第一布线接触，并且经由第一布线使得电压脉冲波朝向结。 检测器设置成与第一布线接触，并检测来自结的脉冲波的输出波。 特征阻抗Z0和阻抗Z1满足以下关系式（1），0。。 （1）

公开(公告)号：US08189412B2

公开(公告)日：2012-05-29

申请号：US12509555

申请日：2009-07-27

申请人： Minoru Mukai ,  Kenji Hirohata ,  Tomoko Monda

发明人： Minoru Mukai ,  Kenji Hirohata ,  Tomoko Monda

IPC分类号： G11C29/00

CPC分类号： H05K3/341 ,  H05K3/3436 ,  H05K2201/10151 ,  H05K2201/10159 ,  H05K2203/163 ,  Y02P70/613

摘要： A storage device includes: a printed circuit board; a semiconductor memory package mounted on the printed circuit board via solder joints, the semiconductor memory package incorporating semiconductor memories; a sensor configured to measure a physical quantity relating to a state of the storage device; a database including a damage estimation model base to be used for estimating damage of the solder joints from the physical quantity measured by the sensor; a damage estimating module configured to calculate a damage estimation value of the solder joints from the physical quantity using the damage estimation model base; and a controller configured to control writing, reading, and erasure of electronic data to or from the semiconductor memories based on the damage estimation values calculated by the damage estimating module.

摘要翻译： 存储装置包括：印刷电路板; 半导体存储器封装，其通过焊点安装在所述印刷电路板上，所述半导体存储器封装结合有半导体存储器; 被配置为测量与所述存储装置的状态有关的物理量的传感器; 数据库，包括用于从传感器测量的物理量估计焊点的损坏的损伤估计模型库; 损伤估计模块，被配置为使用所述损伤估计模型基础从所述物理量计算所述焊点的损伤估计值; 以及控制器，其被配置为基于由所述损伤估计模块计算出的损伤估计值来控制对所述半导体存储器的电子数据的写入，读取和擦除。

公开(公告)号：US20100082913A1

公开(公告)日：2010-04-01

申请号：US12509555

申请日：2009-07-27

申请人： Minoru Mukai ,  Kenji Hirohata ,  Tomoko Monda

发明人： Minoru Mukai ,  Kenji Hirohata ,  Tomoko Monda

IPC分类号： G06F12/00 ,  G06F19/00

CPC分类号： H05K3/341 ,  H05K3/3436 ,  H05K2201/10151 ,  H05K2201/10159 ,  H05K2203/163 ,  Y02P70/613

摘要： A storage device includes: a printed circuit board; a semiconductor memory package mounted on the printed circuit board via solder joints, the semiconductor memory package incorporating semiconductor memories; a sensor configured to measure a physical quantity relating to a state of the storage device; a database including a damage estimation model base to be used for estimating damage of the solder joints from the physical quantity measured by the sensor; a damage estimating module configured to calculate a damage estimation value of the solder joints from the physical quantity using the damage estimation model base; and a controller configured to control writing, reading, and erasure of electronic data to or from the semiconductor memories based on the damage estimation values calculated by the damage estimating module.

摘要翻译： 存储装置包括：印刷电路板; 半导体存储器封装，其通过焊点安装在所述印刷电路板上，所述半导体存储器封装结合有半导体存储器; 被配置为测量与所述存储装置的状态有关的物理量的传感器; 数据库，包括用于从传感器测量的物理量估计焊点的损坏的损伤估计模型库; 损伤估计模块，被配置为使用所述损伤估计模型基础从所述物理量计算所述焊点的损伤估计值; 以及控制器，其被配置为基于由所述损伤估计模块计算出的损伤估计值来控制对所述半导体存储器的电子数据的写入，读取和擦除。

公开(公告)号：US09451709B2

公开(公告)日：2016-09-20

申请号：US12505758

申请日：2009-07-20

申请人： Tomoko Monda ,  Minoru Mukai ,  Kenji Hirohata

发明人： Tomoko Monda ,  Minoru Mukai ,  Kenji Hirohata

IPC分类号： G01R31/02 ,  H05K3/34 ,  H05K1/02

CPC分类号： H05K3/3436 ,  H05K1/0268 ,  H05K2201/10204 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2203/163 ,  Y02P70/613

摘要： A damage index predicting system is for predicting a damage-related index of solder joints of an electronic device having the solder joints that electrically connect an electronic component to a mounting circuit board and one or more detection solder joints that are designed so as to have a shorter life than the solder joints. The system includes: a database configured to store a fracture relationship between the detection solder joints and the solder joints; a fracture detector configured to detect fracture of the detection solder joints; and a processor configured to calculate a prediction value of the damage-related index of the solder joints based on information relating to the fracture of the detection solder joints obtained by the fracture detector and the fracture relationship stored in the database.

摘要翻译： 损伤指数预测系统用于预测具有将电子部件电连接到安装电路板的焊点与一个或多个检测焊点的电子器件的焊点的损伤相关指数，该检测焊点被设计成具有 寿命比焊点短。 该系统包括：数据库，配置为存储检测焊点和焊点之间的断裂关系; 断裂检测器，被配置为检测所述检测焊点的断裂; 以及处理器，其被配置为基于与通过裂缝检测器获得的检测焊点的断裂有关的信息和存储在数据库中的断裂关系来计算焊点的损伤相关指数的预测值。