TRANSFORMER INCORPORATED IN ELECTRONIC CIRCUITS
    1.
    发明申请
    TRANSFORMER INCORPORATED IN ELECTRONIC CIRCUITS 有权
    变压器并入电子电路

    公开(公告)号:US20120146758A1

    公开(公告)日:2012-06-14

    申请号:US13325383

    申请日:2011-12-14

    IPC分类号: H01F27/24

    摘要: A vibration-suppressed transformer is fixed to a base plate and includes a magnetic lower core, two or more magnetic upper cores, primary and secondary coils. The lower core is on the base plate. The upper cores are arranged face to face over the lower core. The coils are arranged between the lower and upper cores. Each upper core contacts the lower core, on an outer side of the coils, with a first gap being provided between the upper and lower cores, on an inner side of the coils. The upper cores are extended towards each other from the outer to the inner side of the coils, with a second gap being provided therebetween. The second gap is provided therein with a non-magnetic pressing member to press the lower core against the base plate, on an inner side of the coils.

    摘要翻译: 振动抑制变压器固定在基板上,包括磁性下芯,两个或多个磁性上芯,初级和次级线圈。 下芯在底板上。 上部芯体在下部芯部上面对面布置。 线圈布置在下芯和上芯之间。 每个上芯在线圈的外侧与下芯接触,第一间隙设置在线圈内侧的上芯和下芯之间。 上芯从线圈的外侧向内侧延伸,其间设有第二间隙。 第二间隙在其中设置有非磁性按压构件,以在线圈的内侧将下芯压靠在基板上。

    Video image processing apparatus and recording medium
    3.
    发明授权
    Video image processing apparatus and recording medium 有权
    视频图像处理装置和记录介质

    公开(公告)号:US09565395B1

    公开(公告)日:2017-02-07

    申请号:US15196221

    申请日:2016-06-29

    摘要: A video image processing apparatus including, a generation unit configured to generate a video image frame from an image area to be used included in a video image captured by a camera, a spatial area in the video image being defined by the image area to be used, an encoding unit configured to encode the video image frame into any one of a first video image frame and a second video image frame, and a detection unit configured to detect a trigger for changing the image area to be used to report the detection of the trigger to the generation unit, wherein the encoding unit reports a encoded video image frame type to the generation unit in advance, and in response to receiving the detection of the trigger, the generation unit changes the image area to be used in a video image frame based on the reported type.

    摘要翻译: 一种视频图像处理装置,包括:生成单元,被配置为从由相机捕获的视频图像中包括的要使用的图像区域生成视频图像帧,视频图像中的空间区域由要使用的图像区域定义 编码单元,被配置为将视频图像帧编码为第一视频图像帧和第二视频图像帧中的任一个;以及检测单元,被配置为检测用于改变要用于报告检测到的图像区域的触发 触发到生成单元,其中编码单元预先将编码的视频图像帧类型报告给生成单元,并且响应于接收到触发的检测,生成单元改变要在视频帧中使用的图像区域 基于报告的类型。

    Light emitting element driving circuit
    4.
    发明授权
    Light emitting element driving circuit 有权
    发光元件驱动电路

    公开(公告)号:US09137868B2

    公开(公告)日:2015-09-15

    申请号:US13495618

    申请日:2012-06-13

    IPC分类号: H05B37/00 H05B33/08

    CPC分类号: H05B33/0824 H05B33/0851

    摘要: In accordance with an embodiment, a light emitting element driving circuit includes a comparator having an input connected to smoothing circuit and an output connected to a voltage-dividing circuit through a transistor. A drain-to-source resistance of the transistor is connected in parallel with a portion of the voltage dividing circuit. An output signal of the voltage dividing circuit is connected to another comparator that generates a drive transistor drive signal. The drive transistor is connected to one or more light emitting elements. In accordance with another embodiment, a reference voltage is generated in response to a rectified signal and compared with a sense voltage to generate a drive signal that is used to drive the drive transistor. Light is emitted from the one or more light emitting elements in response to the drive signal and the rectified voltage being greater than the forward voltage drops of the one or more light emitting elements.

    摘要翻译: 根据实施例,发光元件驱动电路包括具有连接到平滑电路的输入的比较器和通过晶体管连接到分压电路的输出。 晶体管的漏极 - 源极电阻与分压电路的一部分并联连接。 分压电路的输出信号连接到产生驱动晶体管驱动信号的另一个比较器。 驱动晶体管连接到一个或多个发光元件。 根据另一实施例,响应于整流信号产生参考电压并与感测电压进行比较以产生用于驱动驱动晶体管的驱动信号。 响应于驱动信号而从一个或多个发光元件发射光,并且整流电压大于一个或多个发光元件的正向电压降。

    Semiconductor device for protecting secondary battery, battery pack, and electronic device using same
    5.
    发明授权
    Semiconductor device for protecting secondary battery, battery pack, and electronic device using same 有权
    用于保护二次电池,电池组和使用其的电子装置的半导体装置

    公开(公告)号:US09048677B2

    公开(公告)日:2015-06-02

    申请号:US13729331

    申请日:2012-12-28

    申请人: Tomoyuki Goto

    发明人: Tomoyuki Goto

    IPC分类号: H01M10/48 H02J7/00

    摘要: A battery pack includes a secondary battery, a discharge-control transistor, a charge-control transistor connected in series with the discharge-control transistor between a negative power source terminal of the secondary battery and a terminal of a load or a negative power source terminal of a charger, and a battery protection semiconductor device including a detection circuit that detects at least one of excessively charged, excessive discharging, overcurrent, short-circuit, and overheating states of the secondary battery, a control circuit that turns on and off the discharge-control transistor and the charge-control transistor, and a charge prevention circuit that prevents the secondary battery from being charged by turning off the charge-control transistor when a voltage of the secondary battery is not greater than a predetermined low-voltage criterial voltage variable by trimming a portion of the charge prevention circuit. The charge prevention circuit includes first and second inverter circuits.

    摘要翻译: 电池组包括二次电池,放电控制晶体管,与放电控制晶体管串联连接在二次电池的负电源端子与负载端子或负电源端子之间的充电控制晶体管 充电器的电池保护半导体装置,以及包括检测电路的电池保护半导体装置,其检测二次电池的过充电,过放电,过电流,短路和过热状态中的至少一个,导通和关断放电的控制电路 控制晶体管和充电控制晶体管;以及充电防止电路,其防止在二次电池的电压不大于预定的低电压标准电压变量时通过关闭充电控制晶体管而对二次电池进行充电 通过修整电荷预防电路的一部分。 充电防止电路包括第一和第二反相器电路。

    SEMICONDUCTOR DEVICE FOR PROTECTING SECONDARY BATTERY, BATTERY PACK, AND ELECTRONIC DEVICE USING SAME
    6.
    发明申请
    SEMICONDUCTOR DEVICE FOR PROTECTING SECONDARY BATTERY, BATTERY PACK, AND ELECTRONIC DEVICE USING SAME 有权
    用于保护二次电池的电子设备,电池组和使用该电池的电子设备

    公开(公告)号:US20130154564A1

    公开(公告)日:2013-06-20

    申请号:US13729331

    申请日:2012-12-28

    申请人: Tomoyuki Goto

    发明人: Tomoyuki Goto

    IPC分类号: H02J7/00

    摘要: A battery pack includes a secondary battery, a discharge-control transistor, a charge-control transistor connected in series with the discharge-control transistor between a negative power source terminal of the secondary battery and a terminal of a load or a negative power source terminal of a charger, and a battery protection semiconductor device including a detection circuit that detects at least one of excessively charged, excessive discharging, overcurrent, short-circuit, and overheating states of the secondary battery, a control circuit that turns on and off the discharge-control transistor and the charge-control transistor, and a charge prevention circuit that prevents the secondary battery from being charged by turning off the charge-control transistor when a voltage of the secondary battery is not greater than a predetermined low-voltage criterial voltage variable by trimming a portion of the charge prevention circuit. The charge prevention circuit includes first and second inverter circuits.

    摘要翻译: 电池组包括二次电池,放电控制晶体管,与放电控制晶体管串联连接在二次电池的负电源端子与负载端子或负电源端子之间的充电控制晶体管 充电器的电池保护半导体装置和包括检测电路的电池保护半导体装置,其检测二次电池的过充电,过放电,过电流,短路和过热状态中的至少一个,导通和关断放电的控制电路 控制晶体管和充电控制晶体管;以及充电防止电路,其防止在二次电池的电压不大于预定的低电压标准电压变量时通过关闭充电控制晶体管而对二次电池进行充电 通过修整电荷预防电路的一部分。 充电防止电路包括第一和第二反相器电路。

    Silicone resin composition for die bonding
    8.
    发明授权
    Silicone resin composition for die bonding 有权
    用于芯片粘合的硅树脂组合物

    公开(公告)号:US07951891B2

    公开(公告)日:2011-05-31

    申请号:US11447100

    申请日:2006-06-06

    摘要: A silicone resin composition for die bonding is provided. The composition includes (A) a straight-chain organopolysiloxane having silicon-bonded alkenyl groups, and with a viscosity of no more than 1,000 mPa·s, (B) a three dimensional network-type organopolysiloxane resin that is either wax-like or solid at 23° C., (C) an organohydrogenpolysiloxane having SiH groups, and (D) a platinum-group metal-based catalyst. The composition produces a cured product with a high hardness, and good heat resistance, transparency, and light transmittance in the low wavelength region.

    摘要翻译: 提供了用于芯片接合的有机硅树脂组合物。 该组合物包括(A)具有硅键合链烯基并且粘度不超过1000mPa·s的直链有机聚硅氧烷,(B)三维网状有机聚硅氧烷树脂,其为蜡状或固体 (C)具有SiH基团的有机氢聚硅氧烷,(D)铂族金属类催化剂。 组合物在低波长区域产生具有高硬度,良好的耐热性,透明性和透光性的固化产物。

    Polyimide resin soluble in aqueous alkaline solution, composition comprising the resin and cured coating prepared from the composition
    9.
    发明授权
    Polyimide resin soluble in aqueous alkaline solution, composition comprising the resin and cured coating prepared from the composition 失效
    可溶于碱性水溶液的聚酰亚胺树脂,包含树脂的组合物和由组合物制备的固化涂层

    公开(公告)号:US07638259B2

    公开(公告)日:2009-12-29

    申请号:US11892244

    申请日:2007-08-21

    IPC分类号: G03F7/04 G03F7/30 C08G69/48

    摘要: A polyimide resin, characterized in that the polyimide resin comprises three kinds of repeating units represented by the formula (1), and has a weight average molecular weight, reduced to polystyrene, of from 5,000 to 500,000, an acryl equivalent of from 400 to 3,000 g/eq, and a carboxylic acid equivalent of from 300 to 2500 g/eq wherein X is a tetravalent organic group, Y is a divalent organic group, Z is a divalent organic group, W is a divalent organic group having a polyorganosiloxane structure. The polyimide resin is suitable for preparing a patterned or non-patterned protective coating.

    摘要翻译: 一种聚酰亚胺树脂,其特征在于,所述聚酰亚胺树脂包括由式(1)表示的三种重复单元,其重均分子量减少至聚苯乙烯为5,000至500,000,丙烯当量为400至3,000 g / eq,羧酸当量为300〜2500g / eq,其中X为四价有机基团,Y为二价有机基团,Z为二价有机基团,W为具有聚有机硅氧烷结构的二价有机基团。 聚酰亚胺树脂适用于制备图案化或未图案化的保护涂层。

    Silicone resin composition for die bonding
    10.
    发明申请
    Silicone resin composition for die bonding 有权
    用于芯片粘合的硅树脂组合物

    公开(公告)号:US20060275617A1

    公开(公告)日:2006-12-07

    申请号:US11447100

    申请日:2006-06-06

    IPC分类号: B32B9/04 C09J183/04

    摘要: A silicone resin composition for die bonding is provided. The composition includes (A) a straight-chain organopolysiloxane having silicon-bonded alkenyl groups, and with a viscosity of no more than 1,000 mPa·s, (B) a three dimensional network-type organopolysiloxane resin that is either wax-like or solid at 23° C., (C) an organohydrogenpolysiloxane having SiH groups, and (D) a platinum-group metal-based catalyst. The composition produces a cured product with a high hardness, and good heat resistance, transparency, and light transmittance in the low wavelength region.

    摘要翻译: 提供了用于芯片接合的有机硅树脂组合物。 该组合物包括(A)具有硅键合链烯基并且粘度不大于1,000mPa.s的直链有机聚硅氧烷,(B)三维网状有机聚硅氧烷树脂,其为蜡状或固体 (C)具有SiH基团的有机氢聚硅氧烷,(D)铂族金属类催化剂。 组合物在低波长区域产生具有高硬度,良好的耐热性,透明性和透光性的固化产物。