公开(公告)号：US06737697B2

公开(公告)日：2004-05-18

申请号：US09779662

申请日：2001-02-09

申请人： Toshie Kutsunai ,  Shinichiro Hayashi ,  Yuji Judai ,  Yoshihisa Nagano

发明人： Toshie Kutsunai ,  Shinichiro Hayashi ,  Yuji Judai ,  Yoshihisa Nagano

IPC分类号： H01L2976

CPC分类号： H01L28/55 ,  C23C16/401 ,  H01L21/02126 ,  H01L21/02164 ,  H01L21/022 ,  H01L21/02271 ,  H01L21/02304 ,  H01L21/02332 ,  H01L21/02337 ,  H01L21/0234 ,  H01L21/31612

摘要： A capacitor including a capacitor lower electrode, a capacitor dielectric film of a highly dielectric film or a ferroelectric film and a capacitor upper electrode is formed on a semiconductor substrate. A protection film is formed on the semiconductor substrate so as to cover the capacitor. A first TEOS film having a relatively large water content is formed on the protection film through first TEOS-O3 CVD where an ozone concentration is relatively low. A second TEOS-O3 film having a relatively small water content is formed on the first TEOS-O3 film through second TEOS-O3 CVD where the ozone concentration is relatively high.

公开(公告)号：US06939725B2

公开(公告)日：2005-09-06

申请号：US10769808

申请日：2004-02-03

申请人： Toshie Kutsunai ,  Shinichiro Hayashi ,  Yuji Judai ,  Yoshihisa Nagano

发明人： Toshie Kutsunai ,  Shinichiro Hayashi ,  Yuji Judai ,  Yoshihisa Nagano

IPC分类号： H01L23/522 ,  C23C16/40 ,  H01L21/02 ,  H01L21/316 ,  H01L21/318 ,  H01L21/768 ,  H01L21/822 ,  H01L21/8234 ,  H01L21/8242 ,  H01L21/8246 ,  H01L27/04 ,  H01L27/06 ,  H01L27/105 ,  H01L27/108 ,  H01L21/00 ,  H01L29/76

CPC分类号： H01L28/55 ,  C23C16/401 ,  H01L21/02126 ,  H01L21/02164 ,  H01L21/022 ,  H01L21/02271 ,  H01L21/02304 ,  H01L21/02332 ,  H01L21/02337 ,  H01L21/0234 ,  H01L21/31612

摘要： A capacitor including a capacitor lower electrode, a capacitor dielectric film of a highly dielectric film or a ferroelectric film and a capacitor upper electrode is formed on a semiconductor substrate. A protection film is formed on the semiconductor substrate so as to cover the capacitor. A first TEOS film having a relatively large water content is formed on the protection film through first TEOS-O3 CVD where an ozone concentration is relatively low. A second TEOS-O3 film having a relatively small water content is formed on the first TEOS-O3 film through second TEOS-O3 CVD where the ozone concentration is relatively high.

摘要翻译： 在半导体衬底上形成包括电容器下电极，高电介质膜的电容器电介质膜或铁电体膜和电容器上电极的电容器。 在半导体衬底上形成保护膜以覆盖电容器。 具有相对较大含水量的第一TEOS膜通过臭氧浓度相对较低的第一TEOS-O 3 CVD形成在保护膜上。 通过第二TEOS-O 3 3在第一TEOS-O 3膜上形成具有相对较小含水量的第二TEOS-O 3膜。 臭氧浓度相对较高的CVD。

公开(公告)号：US06174822B1

公开(公告)日：2001-01-16

申请号：US09175250

申请日：1998-10-20

申请人： Yoshihisa Nagano ,  Toshie Kutsunai ,  Yuji Judai ,  Yasuhiro Uemoto ,  Eiji Fujii

发明人： Yoshihisa Nagano ,  Toshie Kutsunai ,  Yuji Judai ,  Yasuhiro Uemoto ,  Eiji Fujii

IPC分类号： H01L2131

CPC分类号： H01L27/1085 ,  H01L21/76895 ,  H01L23/5223 ,  H01L28/55 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device includes: a capacitor provided on a supporting substrate having an integrated circuit thereon and including a lower electrode, a dielectric film, and an upper electrode; a first interlayer insulating film provided so as to cover the capacitor; a first interconnect selectively provided on the first interlayer insulating film and electrically connected to the integrated circuit and the capacitor through a first contact hole formed in the first interlayer insulating film; a second interlayer insulating film formed of ozone TEOS and provided so as to cover the first interconnect; a second interconnect selectively provided on the second interlayer insulating film and electrically connected to the first interconnect through a second contact hole formed in the second interlayer insulating film; and a passivation layer provided so as to cover the second interconnect.

摘要翻译： 半导体器件包括：设置在其上具有集成电路的支撑衬底上并包括下电极，电介质膜和上电极的电容器; 设置为覆盖电容器的第一层间绝缘膜; 选择性地设置在所述第一层间绝缘膜上并通过形成在所述第一层间绝缘膜中的第一接触孔与所述集成电路和所述电容器电连接的第一互连; 由臭氧TEOS形成的第二层间绝缘膜，并设置为覆盖第一互连; 选择性地设置在第二层间绝缘膜上并通过形成在第二层间绝缘膜中的第二接触孔电连接到第一互连的第二互连; 以及设置成覆盖第二互连的钝化层。

公开(公告)号：US20050082638A1

公开(公告)日：2005-04-21

申请号：US10968623

申请日：2004-10-19

申请人： Yoshihisa Nagano ,  Toshie Kutsunai ,  Yuji Judai ,  Yasuhiro Uemoto ,  Eiji Fujii

发明人： Yoshihisa Nagano ,  Toshie Kutsunai ,  Yuji Judai ,  Yasuhiro Uemoto ,  Eiji Fujii

IPC分类号： H01L21/02 ,  H01L21/768 ,  H01L21/8242 ,  H01L23/522 ,  H01L29/76 ,  H01L21/3205

CPC分类号： H01L27/1085 ,  H01L21/76895 ,  H01L23/5223 ,  H01L28/55 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device includes: a capacitor provided on a supporting substrate having an integrated circuit thereon and including a lower electrode, a dielectric film, and an upper electrode; a first interlayer insulating film provided so as to cover the capacitor; a first interconnect selectively provided on the first interlayer insulating film and electrically connected to the integrated circuit and the capacitor through a first contact hole formed in the first interlayer insulating film; a second interlayer insulating film formed of ozone TEOS and provided so as to cover the first interconnect; a second interconnect selectively provided on the second interlayer insulating film and electrically connected to the first interconnect through a second contact hole formed in the second interlayer insulating film; and a passivation layer provided so as to cover the second interconnect.

公开(公告)号：US06849887B2

公开(公告)日：2005-02-01

申请号：US09103873

申请日：1998-06-24

申请人： Yoshihisa Nagano ,  Toshie Kutsunai ,  Yuji Judai ,  Yasuhiro Uemoto ,  Eiji Fujii

发明人： Yoshihisa Nagano ,  Toshie Kutsunai ,  Yuji Judai ,  Yasuhiro Uemoto ,  Eiji Fujii

IPC分类号： H01L21/02 ,  H01L21/768 ,  H01L21/8242 ,  H01L23/522 ,  H01L29/76

CPC分类号： H01L27/1085 ,  H01L21/76895 ,  H01L23/5223 ,  H01L28/55 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device includes: a capacitor provided on a supporting substrate having an integrated circuit thereon and including a lower electrode, a dielectric film, and an upper electrode; a first interlayer insulating film provided so as to cover the capacitor; a first interconnect selectively provided on the first interlayer insulating film and electrically connected to the integrated circuit and the capacitor through a first contact hole formed in the first interlayer insulating film; a second interlayer insulating film formed of ozone TEOS and provided so as to cover the first interconnect; a second interconnect selectively provided on the second interlayer insulating film and electrically connected to the first interconnect through a second contact hole formed in the second interlayer insulating film; and a passivation layer provided so as to cover the second interconnect.

摘要翻译： 半导体器件包括：设置在其上具有集成电路的支撑衬底上并包括下电极，电介质膜和上电极的电容器; 设置为覆盖电容器的第一层间绝缘膜; 选择性地设置在所述第一层间绝缘膜上并通过形成在所述第一层间绝缘膜中的第一接触孔与所述集成电路和所述电容器电连接的第一互连; 由臭氧TEOS形成的第二层间绝缘膜，并设置为覆盖第一互连; 选择性地设置在第二层间绝缘膜上并通过形成在第二层间绝缘膜中的第二接触孔电连接到第一互连的第二互连; 以及设置成覆盖第二互连的钝化层。

公开(公告)号：US06809000B2

公开(公告)日：2004-10-26

申请号：US09797987

申请日：2001-03-05

申请人： Keisaku Nakao ,  Akihiro Matsuda ,  Yasufumi Izutsu ,  Toyoji Ito ,  Takumi Mikawa ,  Toru Nasu ,  Yoshihisa Nagano ,  Keisuke Tanaka ,  Toshie Kutsunai

发明人： Keisaku Nakao ,  Akihiro Matsuda ,  Yasufumi Izutsu ,  Toyoji Ito ,  Takumi Mikawa ,  Toru Nasu ,  Yoshihisa Nagano ,  Keisuke Tanaka ,  Toshie Kutsunai

IPC分类号： H01L2120

CPC分类号： H01L28/55

摘要： The semiconductor device of the invention includes a capacitor device, which is formed on a substrate and which includes a capacitive lower electrode, a capacitive insulating film made of an insulating metal oxide film and a capacitive upper electrode. An interlevel insulating film having an opening reaching the capacitive upper electrode is formed over the capacitor device. A metal interconnection including a titanium film is formed over the interlevel insulating film so as to be electrically connected to the capacitive upper electrode through the opening. An anti-diffusion film having conductivity is formed between the capacitive upper electrode and the metal interconnection for preventing titanium atoms composing the titanium film of the metal interconnection from passing through the capacitive upper electrode and diffusing into the capacitive insulating film.

摘要翻译： 本发明的半导体器件包括形成在基板上的电容器器件，其包括电容式下电极，由绝缘金属氧化物膜制成的电容绝缘膜和电容上电极。 在电容器装置上形成具有到达电容上电极的开口的层间绝缘膜。 在层间绝缘膜上形成包括钛膜的金属互连，以便通过开口与电容上电极电连接。 在电容上电极和金属互连之间形成具有导电性的防扩散膜，以防止构成金属互连的钛膜的钛原子通过电容上电极并扩散到电容绝缘膜。

公开(公告)号：US06239462B1

公开(公告)日：2001-05-29

申请号：US09120893

申请日：1998-07-23

申请人： Keisaku Nakao ,  Akihiro Matsuda ,  Yasufumi Izutsu ,  Toyoji Ito ,  Takumi Mikawa ,  Toru Nasu ,  Yoshihisa Nagano ,  Keisuke Tanaka ,  Toshie Kutsunai

发明人： Keisaku Nakao ,  Akihiro Matsuda ,  Yasufumi Izutsu ,  Toyoji Ito ,  Takumi Mikawa ,  Toru Nasu ,  Yoshihisa Nagano ,  Keisuke Tanaka ,  Toshie Kutsunai

IPC分类号： H01L27108

CPC分类号： H01L28/55

摘要： The semiconductor device of the invention includes a capacitor device, which is formed on a substrate and which includes a capacitive lower electrode, a capacitive insulating film made of an insulating metal oxide film and a capacitive upper electrode. An interlevel insulating film having an opening reaching the capacitive upper electrode is formed over the capacitor device. A metal interconnection including a titanium film is formed over the interlevel insulating film so as to be electrically connected to the capacitive upper electrode through the opening. An anti-diffusion film having conductivity is formed between the capacitive upper electrode and the metal interconnection for preventing titanium atoms composing the titanium film of the metal interconnection from passing through the capacitive upper electrode and diffusing into the capacitive insulating film.

摘要翻译： 本发明的半导体器件包括形成在基板上的电容器器件，其包括电容式下电极，由绝缘金属氧化物膜制成的电容绝缘膜和电容上电极。 在电容器装置上形成具有到达电容上电极的开口的层间绝缘膜。 在层间绝缘膜上形成包括钛膜的金属互连，以便通过开口与电容上电极电连接。 在电容上电极和金属互连之间形成具有导电性的防扩散膜，以防止构成金属互连的钛膜的钛原子通过电容上电极并扩散到电容绝缘膜。

公开(公告)号：US07053436B2

公开(公告)日：2006-05-30

申请号：US10752668

申请日：2004-01-08

申请人： Yoshihisa Nagano ,  Toshie Kutsunai

发明人： Yoshihisa Nagano ,  Toshie Kutsunai

IPC分类号： H01L27/108

CPC分类号： H01L28/55 ,  H01L21/7687 ,  H01L27/10852 ,  H01L28/65

摘要： A conductive oxygen barrier layer is formed on an interlayer dielectric film and patterned such that it is in contact with the top surface of a contact plug to prevent the diffusion of oxygen into the contact plug from above. The conductive oxygen barrier layer is composed of a lower layer containing a conductive nitride such as TiAlN, and an upper layer containing a conductive oxide such as IrO2. An insulative oxygen barrier layer composed of Al2O3 and having a thickness of approximately 20 nm is formed on the side surfaces of the conductive oxygen barrier layer to prevent the diffusion of oxygen into the contact plug from the sides, such as from the sides of the lower layer of the conductive barrier layer.

摘要翻译： 导电氧阻隔层形成在层间电介质膜上并被图案化，使得其与接触插塞的顶表面接触以防止氧气从上方扩散到接触塞中。 导电氧阻隔层由包含诸如TiAlN的导电氮化物的下层和包含诸如IrO 2的导电氧化物的上层组成。 在导电氧阻隔层的侧表面上形成厚度约为20nm的由Al 2 O 3 3 N 2构成的绝缘性氧阻隔层，以防止扩散 氧从侧面进入接触塞，例如从导电阻挡层的下层的侧面。

公开(公告)号：US20050045990A1

公开(公告)日：2005-03-03

申请号：US10950532

申请日：2004-09-28

申请人： Keisaku Nakao ,  Akihiro Matsuda ,  Yasufumi Izutsu ,  Toyoji Ito ,  Takumi Mikawa ,  Toru Nasu ,  Yoshihisa Nagano ,  Keisuke Tanaka ,  Toshie Kutsunai

发明人： Keisaku Nakao ,  Akihiro Matsuda ,  Yasufumi Izutsu ,  Toyoji Ito ,  Takumi Mikawa ,  Toru Nasu ,  Yoshihisa Nagano ,  Keisuke Tanaka ,  Toshie Kutsunai

IPC分类号： H01L21/02 ,  H01L21/8242 ,  H01L21/00

CPC分类号： H01L28/55

摘要： The semiconductor device of the invention includes a capacitor device, which is formed on a substrate and which includes a capacitive lower electrode, a capacitive insulating film made of an insulating metal oxide film and a capacitive upper electrode. An interlevel insulating film having an opening reaching the capacitive upper electrode is formed over the capacitor device. A metal interconnection including a titanium film is formed over the interlevel insulating film so as to be electrically connected to the capacitive upper electrode through the opening. An anti-diffusion film having conductivity is formed between the capacitive upper electrode and the metal interconnection for preventing titanium atoms composing the titanium film of the metal interconnection from passing through the capacitive upper electrode and diffusing into the capacitive insulating film.

摘要翻译： 本发明的半导体器件包括形成在基板上的电容器器件，其包括电容式下电极，由绝缘金属氧化物膜制成的电容绝缘膜和电容上电极。 在电容器装置上形成具有到达电容上电极的开口的层间绝缘膜。 在层间绝缘膜上形成包括钛膜的金属互连，以便通过开口与电容上电极电连接。 在电容上电极和金属互连之间形成具有导电性的防扩散膜，以防止构成金属互连的钛膜的钛原子通过电容上电极并扩散到电容绝缘膜。

公开(公告)号：US20070235787A1

公开(公告)日：2007-10-11

申请号：US11407048

申请日：2006-04-20

申请人： Yoshihisa Nagano ,  Yuji Judai

发明人： Yoshihisa Nagano ,  Yuji Judai

IPC分类号： H01L27/108

CPC分类号： H01L28/55 ,  H01L27/11502 ,  H01L27/11507

摘要： A capacitor device having a three-dimensional structure includes: a lower electrode formed on a semiconductor substrate to have a three-dimensional shape; a capacitor insulating film formed to cover the lower electrode and made of a ferroelectric material; and an upper electrode formed on the capacitor insulating film to have a step portion. A stress control layer is formed on the upper electrode to cause tensile stress and function as a moisture diffusion barrier.

摘要翻译： 具有三维结构的电容器器件包括：形成在半导体衬底上以形成三维形状的下电极; 形成为覆盖下电极并由铁电体材料制成的电容器绝缘膜; 以及形成在电容器绝缘膜上的上电极，以具有台阶部分。 在上部电极上形成应力控制层，产生拉伸应力，作为水分扩散阻挡层发挥作用。