公开(公告)号：US08564033B2

公开(公告)日：2013-10-22

申请号：US12345876

申请日：2008-12-30

申请人： Toshihiko Hayashi ,  Yoshiharu Kudoh

发明人： Toshihiko Hayashi ,  Yoshiharu Kudoh

IPC分类号： H01L31/0216

CPC分类号： H01L27/14636 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14687 ,  H01L27/14689 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/18

摘要： A solid-state imaging device includes: a light-receiving pixel part configured to be formed on a semiconductor substrate; a black-level reference pixel part configured to be formed on the semiconductor substrate; and a multilayer interconnect part configured to be provided over the semiconductor substrate. The multilayer interconnect part includes an insulating layer formed over the semiconductor substrate and metal interconnect layers formed as a plurality of layers in the insulating layer. The multilayer interconnect part has a first light-blocking film formed above an area between first metal interconnects of a first metal interconnect layer as one of the metal interconnect layers above the black-level reference pixel part, and a second light-blocking film that is connected to the first light-blocking film and is formed of a second metal interconnect layer over the first metal interconnect layer.

公开(公告)号：US20090189236A1

公开(公告)日：2009-07-30

申请号：US12345876

申请日：2008-12-30

申请人： Toshihiko HAYASHI ,  Yoshiharu Kudoh

发明人： Toshihiko HAYASHI ,  Yoshiharu Kudoh

IPC分类号： H01L31/0216 ,  H01L31/0232 ,  H01L21/30

CPC分类号： H01L27/14636 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14687 ,  H01L27/14689 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/18

摘要： A solid-state imaging device includes: a light-receiving pixel part configured to be formed on a semiconductor substrate; a black-level reference pixel part configured to be formed on the semiconductor substrate; and a multilayer interconnect part configured to be provided over the semiconductor substrate. The multilayer interconnect part includes an insulating layer formed over the semiconductor substrate and metal interconnect layers formed as a plurality of layers in the insulating layer. The multilayer interconnect part has a first light-blocking film formed above an area between first metal interconnects of a first metal interconnect layer as one of the metal interconnect layers above the black-level reference pixel part, and a second light-blocking film that is connected to the first light-blocking film and is formed of a second metal interconnect layer over the first metal interconnect layer.

摘要翻译： 固态成像装置包括：被配置为形成在半导体衬底上的受光像素部分; 配置为形成在所述半导体衬底上的黑色级参考像素部分; 以及被构造成设置在所述半导体衬底上的多层互连部件。 多层互连部分包括形成在半导体衬底上的绝缘层和在绝缘层中形成为多层的金属互连层。 多层互连部分具有形成在第一金属互连层的第一金属互连之间的区域上方的第一遮光膜，作为黑电平参考像素部分上方的金属互连层之一，以及第二遮光膜， 连接到第一遮光膜并且由第一金属互连层上的第二金属互连层形成。

公开(公告)号：US07812878B2

公开(公告)日：2010-10-12

申请号：US11200687

申请日：2005-08-10

申请人： Yoshiharu Kudoh

发明人： Yoshiharu Kudoh

IPC分类号： H04N5/335

CPC分类号： H04N5/37457 ,  H01L27/14603 ,  H01L27/14609 ,  H01L27/14621 ,  H01L27/14641 ,  H04N5/347

摘要： A solid-state imaging device with a multi-pixel sharing structure, wherein the area of each photoelectric conversion element can be secured independent of a reduction in area of each pixel. A solid-state imaging device including photoelectric conversion elements arranged in a two-dimensional array and voltage conversion elements for converting charge produced by photoelectric conversion through the corresponding photoelectric conversion elements into voltage.

摘要翻译： 一种具有多像素共享结构的固态成像装置，其中可以独立于每个像素的面积的减小来确保每个光电转换元件的面积。 一种固态成像装置，包括以二维阵列布置的光电转换元件和用于将通过相应的光电转换元件的光电转换产生的电荷转换为电压的电压转换元件。

公开(公告)号：US20080302952A1

公开(公告)日：2008-12-11

申请号：US12133536

申请日：2008-06-05

申请人： Kazuyoshi Yamashita ,  Yoshiharu Kudoh

发明人： Kazuyoshi Yamashita ,  Yoshiharu Kudoh

IPC分类号： G01J1/04

CPC分类号： G02B5/201 ,  H01L27/14609 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14685 ,  H04N9/045 ,  H04N2209/045

摘要： There is provided a solid-state imaging device including a substrate of which surface is provided with a pixel area where a plurality of pixels arranged, each pixel including a photoelectric converting element to receive light from a subject image and perform photoelectric conversion on the received light to generate signal charge, and a surrounding area that is positioned around the pixel area and that includes a surrounding circuit to process the signal charge generated by the photoelectric converting elements. The solid-state imaging device includes a color filter facing the substrate so as to receive the light from the subject image in a surface corresponding to the surface of the substrate and to allow the light to transmit therethrough onto the surface of the substrate. The color filter includes a first colored layer and a second colored layer.

摘要翻译： 提供了一种固态成像装置，其包括：基板，其表面设置有排列有多个像素的像素区域，每个像素包括光电转换元件，用于接收来自被摄体图像的光并对所接收的光进行光电转换 以产生信号电荷，以及围绕像素区域定位并且包括周围电路以处理由光电转换元件产生的信号电荷的周围区域。 固态成像装置包括面向衬底的滤色器，以便在与衬底的表面相对应的表面中接收来自被摄体图像的光，并且允许光透射穿过衬底的表面。 滤色器包括第一着色层和第二着色层。

公开(公告)号：US20080018429A1

公开(公告)日：2008-01-24

申请号：US11779504

申请日：2007-07-18

申请人： Yoshiharu Kudoh ,  Hitoshi Nishino ,  Kenji Tsuboi

发明人： Yoshiharu Kudoh ,  Hitoshi Nishino ,  Kenji Tsuboi

IPC分类号： H04B11/00 ,  G01S15/74

CPC分类号： G01S15/74 ,  G06K19/07749 ,  H04B11/00

摘要： Object To provide a passive ultrasonic tag and an ultrasonic reading system that are constructed more simply and record and/or read information more reliably by using ultrasonic waves for transmission/reception.Solving Means A passive ultrasonic tag 100 according to a first embodiment of this invention includes a tag body 102. The tag body has two or more holes (106, 108, 110) disposed extensively on a surface 104 of the tag body. The holes have bottoms (112, 114, 116) at predetermined depths (d1, d2, d3) from the surface of the tag body (z). The depths of at least two of the two or more holes are set to different values. As a result, when a three-dimensional range including surfaces and bottoms of the two holes is scanned using ultrasonic waves, the ultrasonic waves are reflected in different manners (R1, R2, R3) on the basis of the depths of the two holes. This allows information to be recorded and read.

摘要翻译： 目的通过使用超声波进行发送/接收，提供更简单地构造的无源超声波标签和超声波读取系统，并且更可靠地记录和/或读取信息。 解决方案根据本发明的第一实施例的无源超声波标签100包括标签主体102。 标签主体具有广泛设置在标签主体的表面104上的两个或多个孔（106,108,110）。 这些孔具有从标签体（z）的表面的预定深度（d 1，d 2，d 3）的底部（112,114,116）。 两个或更多个孔中的至少两个的深度被设定为不同的值。 结果，当使用超声波扫描包括两个孔的表面和底部的三维范围时，超声波以不同的方式（R 1，R 2，R 3）以基于 两个洞 这允许记录和读取信息。

公开(公告)号：US20080017901A1

公开(公告)日：2008-01-24

申请号：US11879444

申请日：2007-07-17

申请人： Maki Sato ,  Yoshiharu Kudoh

发明人： Maki Sato ,  Yoshiharu Kudoh

IPC分类号： H01L31/113 ,  H04N5/335

CPC分类号： H04N5/2175 ,  H01L27/14654 ,  H04N3/1568 ,  H04N5/2351 ,  H04N5/351 ,  H04N5/3591 ,  H04N5/3592 ,  H04N5/374

摘要： A solid-state imaging device is provided. The solid-state imaging device includes an imaging region having a plurality of pixels arranged on a semiconductor substrate, in which each of the pixels includes a photoelectric converting portion and a charge converting portion for converting a charge generated by photoelectric conversion into a pixel signal and blooming is suppressed by controlling a substrate voltage of the semiconductor substrate.

摘要翻译： 提供固态成像装置。 固态成像装置包括具有布置在半导体衬底上的多个像素的成像区域，其中每个像素包括光电转换部分和用于将由光电转换产生的电荷转换成像素信号的电荷转换部分，以及 通过控制半导体衬底的衬底电压来抑制起霜。

公开(公告)号：US08866941B2

公开(公告)日：2014-10-21

申请号：US13104604

申请日：2011-05-10

申请人： Takashi Abe ,  Ryoji Suzuki ,  Yoshiharu Kudoh

发明人： Takashi Abe ,  Ryoji Suzuki ,  Yoshiharu Kudoh

IPC分类号： H04N9/64 ,  H01L27/146

CPC分类号： H01L27/14603 ,  H01L27/14636

摘要： A solid-state imaging device is provided. The solid-state imaging device includes an imaging area that includes arrayed pixels having photoelectric converting units and transistor elements; and a peripheral circuit, in which a wiring line in the imaging area that is shifted based on pupil correction amount and a wiring line in the peripheral circuit that is not shifted are connected through a connection expanded portion integrally formed with one or both of the wiring lines.

摘要翻译： 提供固态成像装置。 固态成像装置包括具有光电转换单元和晶体管元件的排列像素的成像区域; 以及外围电路，其中基于瞳孔校正量移位的成像区域中的布线和外围电路中未移位的布线通过与一个或两个布线一体形成的连接扩展部分连接 线条。

公开(公告)号：US08520105B2

公开(公告)日：2013-08-27

申请号：US12698326

申请日：2010-02-02

申请人： Eiichi Funatsu ,  Hiroaki Ebihara ,  Yoshiharu Kudoh

发明人： Eiichi Funatsu ,  Hiroaki Ebihara ,  Yoshiharu Kudoh

IPC分类号： H04N9/083 ,  H04N3/14 ,  H04N9/04 ,  H04N5/335

CPC分类号： H04N5/3559 ,  H01L27/14603 ,  H01L27/14609 ,  H01L27/14641 ,  H01L27/14656 ,  H04N5/35563 ,  H04N5/374 ,  H04N5/37457 ,  H04N5/378

摘要： A solid-state image pickup device includes a pixel unit in which a plurality of photoelectric conversion elements having different sensitivities are arranged; and a pixel reading unit configured to read and add output signals from the plurality of photoelectric conversion elements in the pixel unit, and to obtain an output signal seemingly from one pixel. The pixel unit includes an absorbing unit configured to absorb overflowing electric charge from a photoelectric conversion element with a high sensitivity.

摘要翻译： 固态图像拾取装置包括其中布置具有不同灵敏度的多个光电转换元件的像素单元; 以及像素读取单元，被配置为从像素单元中的多个光电转换元件读取并添加输出信号，并且从一个像素看来得到输出信号。 像素单元包括吸收单元，其被配置为以高灵敏度吸收来自光电转换元件的溢出电荷。

公开(公告)号：US08183609B2

公开(公告)日：2012-05-22

申请号：US12773248

申请日：2010-05-04

申请人： Yoshiharu Kudoh

发明人： Yoshiharu Kudoh

IPC分类号： H01L31/062

CPC分类号： H04N5/3745 ,  H01L27/14603 ,  H01L27/1461 ,  H01L27/14614 ,  H01L27/14616 ,  H01L27/14641 ,  H01L27/14643 ,  H04N5/374 ,  H04N5/378

摘要： Disclosed is a solid-state imaging device which includes a plurality of pixels in an arrangement, each of the pixels including a photoelectric conversion element, pixel transistors including a transfer transistor, and a floating diffusion region, in which the channel width of transfer gate of the transfer transistor is formed to be larger on a side of the floating diffusion region than on a side of the photoelectric conversion element.

摘要翻译： 公开了一种固态成像装置，其包括排列中的多个像素，每个像素包括光电转换元件，包括转移晶体管的像素晶体管和浮动扩散区域，其中传输门的沟道宽度 传输晶体管在浮动扩散区域的一侧形成为比在光电转换元件侧更大。

公开(公告)号：US20120062777A1

公开(公告)日：2012-03-15

申请号：US13227851

申请日：2011-09-08

申请人： Shoji Kobayashi ,  Yoshiharu Kudoh ,  Takuya Sano

发明人： Shoji Kobayashi ,  Yoshiharu Kudoh ,  Takuya Sano

IPC分类号： H04N5/335 ,  H01L27/146

CPC分类号： H01L27/14623 ,  H01L27/14603 ,  H01L27/14605 ,  H01L27/14609 ,  H01L27/14612 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14645 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/369 ,  H04N5/374

摘要： A solid state imaging device including: a pixel region that is formed on a light incidence side of a substrate and to which a plurality of pixels that include photoelectric conversion units is arranged; a peripheral circuit unit that is formed in a lower portion in the substrate depth direction of the pixel region and that includes an active element; and a light shielding member that is formed between the pixel region and the peripheral circuit unit and that shields the incidence of light, emitted from an active element, to the photoelectric conversion unit.

摘要翻译： 一种固态成像装置，包括：形成在基板的光入射侧并且配置有包括光电转换单元的多个像素的像素区域; 外围电路单元，其形成在像素区域的基板深度方向的下部，并且包括有源元件; 以及形成在像素区域和外围电路单元之间并且遮蔽从有源元件发射的光的入射到光电转换单元的遮光构件。