公开(公告)号：US5219794A

公开(公告)日：1993-06-15

申请号：US850738

申请日：1992-03-13

申请人： Toshihiko Satoh ,  Tetsuya Hayashida ,  Hiroshi Kikuchi ,  Takeo Yamada ,  Takashi Mori

发明人： Toshihiko Satoh ,  Tetsuya Hayashida ,  Hiroshi Kikuchi ,  Takeo Yamada ,  Takashi Mori

IPC分类号： H01L21/50 ,  H01L21/58 ,  H01L23/10

CPC分类号： H01L24/83 ,  H01L21/50 ,  H01L23/10 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/73253 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/166 ,  Y10T29/49144

摘要： In a chip carrier wherein a semiconductor chip is face down bonded to a package substrate through solder bumps, then covered with a cap and sealed hermetically using a sealing solder, the back of the semiconductor chip being bonded closely to the underside of the cap using a solder for heat transfer, a solder preform serving as the said heat transfer solder is heat-melted and a portion of the thus melted solder is allowed to flow into the sealing portion to effect the hermetic seal of the chip. Furthermore, in order to improve the flowability of the solder preform during the melt flow thereof, a metallized layer for heat transfer formed under the heat transfer solder of the cap and a sealing metallized layer are partially connected with each other through a connecting metallized layer.

摘要翻译： 在通过焊料凸块将半导体芯片面向下接合到封装衬底的芯片载体中，然后用盖子覆盖并使用密封焊料密封密封，半导体芯片的背面使用 用于传热的焊料，用作所述传热焊料的焊料预制件被热熔化，并且这样熔化的焊料的一部分被允许流入密封部分以实现芯片的气密密封。 此外，为了提高焊料预制件在其熔融流动期间的流动性，在盖的传热焊料和密封金属化层下形成的用于传热的金属化层通过连接金属化层彼此部分连接。

公开(公告)号：US08623495B2

公开(公告)日：2014-01-07

申请号：US12919907

申请日：2009-03-02

申请人： Kenji Hata ,  Yuuhei Hayamizu ,  Takeo Yamada

发明人： Kenji Hata ,  Yuuhei Hayamizu ,  Takeo Yamada

IPC分类号： B32B3/00 ,  B32B9/00

CPC分类号： C01B31/022 ,  B81B2203/0127 ,  B81C1/0038 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/158 ,  C01B2202/08 ,  C01B2202/10 ,  Y10T156/1028 ,  Y10T156/1041 ,  Y10T428/24479 ,  Y10T428/24521 ,  Y10T428/24612 ,  Y10T428/24851 ,  Y10T428/249924 ,  Y10T428/30

摘要： A method of producing a carbon nanotube film structure having a substrate and a carbon nanotube layer, comprises a placing step of placing a carbon nanotube film comprising a plurality of carbon nanotubes aligned in one direction within a film plane on the substrate; and a densifying step of applying a densifying treatment to the carbon nanotube film thereby forming the carbon nanotube layer having the weight density of the carbon nanotube to 0.1 g/cm3 or more. Thus, a problem of island-like shrinkage caused while a highly densified CNT layer is being manufactured is solved, and a high-quality CNT film structure wherein the aligned CNT layer having a high density and uniform thickness is deposited on the substrate.

摘要翻译： 一种具有基板和碳纳米管层的碳纳米管膜结构体的制造方法，其特征在于，包括：在基板的膜面内配置包含在一个方向上排列的多个碳纳米管的碳纳米管膜的放置工序; 以及对碳纳米管膜进行致密处理的致密化步骤，从而形成碳纳米管的重量密度为0.1g / cm 3以上的碳纳米管层。 因此，解决了在制造高度致密化的CNT层时引起的岛状收缩的问题，并且在基板上沉积具有高密度和均匀厚度的排列CNT层的高质量CNT膜结构。

公开(公告)号：US5934521A

公开(公告)日：1999-08-10

申请号：US144081

申请日：1998-08-31

申请人： Takeo Yamada ,  Katsuhiko Koike ,  Norihiro Kuzuu ,  Isao Ono ,  Shozo Yodo

发明人： Takeo Yamada ,  Katsuhiko Koike ,  Norihiro Kuzuu ,  Isao Ono ,  Shozo Yodo

IPC分类号： B05B1/30 ,  B05B7/12 ,  B05C5/00 ,  B05C5/02 ,  B05C5/04 ,  B67D5/00

CPC分类号： B05B1/306 ,  B05B7/1272 ,  B05C5/001 ,  B05C5/0225

摘要： There is provided a hot melt applicator including (a) a nozzle opening, (b) a valve seat disposed upstream of the nozzle opening, (c) an empty chamber formed between the nozzle opening and the valve seat, (d) a valve body movable to the valve seat so that the valve seat is open or closed, and (e) a spring for biasing the valve body; and a pneumatically driven cylinder for driving the spring. The valve body is shaped to be a cone having an apex angle facing the nozzle opening, and the valve seat is formed with a tapered surface which is to make a contact with the cone. The tapered surface has an angle greater than the apex angle of the cone, and has a length of at least 1 mm. The hot melt applicator uses a pneumatically driven cylinder for driving the valve body to thereby compress the spring which in turn compresses the valve body, and thus, avoids the great resistance of hot melt with the spring used as a large capacity. By slightly changing angles of the valve body and the valve seat, the leakage which would occur when the valve is closed is prevented. By setting a length of the taper surface of the valve seat which is to make contact with the valve body to be in the range of 1 mm to 2 mm, the present invention makes it possible to prevent making of glue filament for a glue having great viscosity such as hot melt. In addition, setting a stroke of the valve body in the range of 0.3 mm to 0.5 mm ensures more effectively to prevent making of glue filament.

摘要翻译： 提供了一种热熔体施加器，其包括（a）喷嘴开口，（b）设置在喷嘴开口上游的阀座，（c）形成在喷嘴开口和阀座之间的空腔，（d）阀体 可移动到阀座，使得阀座打开或关闭，和（e）用于偏压阀体的弹簧; 以及用于驱动弹簧的气动驱动气缸。 阀体成形为具有面向喷嘴开口的顶角的锥体，阀座形成有与锥体接触的锥形表面。 锥形表面的角度大于锥体的顶角，并且具有至少1mm的长度。 热熔胶器采用气动驱动气缸驱动阀体，从而压缩弹簧，弹簧又压缩阀体，从而避免了与大容量弹簧相比的热熔胶的极大阻力。 通过稍微改变阀体和阀座的角度，可以防止当阀门关闭时发生的泄漏。 通过将与阀体接触的阀座的锥形表面的长度设定在1mm至2mm的范围内，本发明使得可以防止用于具有大的胶的胶丝长度 粘度如热熔。 此外，将阀体的行程设定在0.3mm至0.5mm的范围内，确保更有效地防止了胶丝的制造。

公开(公告)号：US5924607A

公开(公告)日：1999-07-20

申请号：US796705

申请日：1997-02-06

申请人： Takeo Yamada ,  Katsuhiko Koike ,  Norihiro Kuzuu ,  Isao Ono ,  Shozo Yodo

发明人： Takeo Yamada ,  Katsuhiko Koike ,  Norihiro Kuzuu ,  Isao Ono ,  Shozo Yodo

IPC分类号： B05B1/30 ,  B05B7/12 ,  B05C5/00 ,  B05C5/02 ,  B05C5/04 ,  B05C11/10

CPC分类号： B05B1/306 ,  B05B7/1272 ,  B05C5/001 ,  B05C5/0225

摘要： There is provided a hot melt applicator including (a) a nozzle opening, (b) a valve seat disposed upstream of the nozzle opening, (c) an empty chamber formed between the nozzle opening and the valve seat, (d) a valve body movable to the valve seat so that the valve seat is open or closed, and (e) a spring for biasing the valve body; and a pneumatically driven cylinder for driving the spring. The valve body is shaped to be a cone having an apex angle facing the nozzle opening, and the valve seat is formed with a tapered surface which is to make a contact with the cone. The tapered surface has an angle greater than the apex angle of the cone, and has a length of at least 1 mm. The hot melt applicator uses a pneumatically driven cylinder for driving the valve body to thereby compress the spring which in turn compresses the valve body, and thus, avoids the great resistance of hot melt with the spring used as a large capacity. By slightly changing angles of the valve body and the valve seat, the leakage which would occur when the valve is closed is prevented. By setting a length of the taper surface of the valve seat which is to make contact with the valve body to be in the range of 1 mm to 2 mm, the present invention makes it possible to prevent making of glue filament for a glue having great viscosity such as hot melt. In addition, setting a stroke of the valve body in the range of 0.3 mm to 0.5 mm ensures more effectively to prevent making of glue filament.

公开(公告)号：US5306948A

公开(公告)日：1994-04-26

申请号：US950332

申请日：1992-09-24

申请人： Takeo Yamada ,  Satoru Isomura ,  Atsushi Shimizu ,  Yuko Ito ,  Tohru Kobayashi ,  Mikinori Kawaji

发明人： Takeo Yamada ,  Satoru Isomura ,  Atsushi Shimizu ,  Yuko Ito ,  Tohru Kobayashi ,  Mikinori Kawaji

IPC分类号： H01L21/66 ,  G01R1/04 ,  H01L23/053 ,  H01L23/057 ,  H01L23/473 ,  H01L23/498 ,  H01L25/065 ,  H01L23/02 ,  H01L23/12

CPC分类号： H01L25/0655 ,  G01R1/0483 ,  H01L23/053 ,  H01L23/057 ,  H01L23/473 ,  H01L23/49805 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/15174 ,  H01L2924/15312 ,  H01L2924/16152

摘要： Herein disclosed is a chip-carrier type semiconductor device adopting the MCC structure, in which a semiconductor pellet is mounted on the surface of the base substrate and in which mounting terminals to be connected with external terminals of the semiconductor pellet are mounted on the rear surface of the base substrate. In order to effect a test such as screening easily and inexpensively even if the mounting terminals are multiplied or miniaturized, the chip-carrier type semiconductor device adopting the MCC structure is equipped on the side surfaces of the base substrate with auxiliary terminals to be electrically connected with a plurality of external terminals which are arrayed on an element formed main surface of the semiconductor pellet.

摘要翻译： 这里公开的是采用MCC结构的芯片载体型半导体器件，其中半导体芯片安装在基底表面上，并且其中与半导体芯片的外部端子连接的安装端子安装在后表面 的基底。 即使安装端子倍增或小型化，为了实现轻松便宜地进行测试，采用MCC结构的芯片载体型半导体器件配置在具有辅助端子的基底基板的电连接 多个外部端子排列在半导体芯片的形成元件的主表面上。

公开(公告)号：US5301021A

公开(公告)日：1994-04-05

申请号：US907245

申请日：1992-07-01

申请人： Masanori Ogino ,  Tadashi Fukushima ,  Takeo Yamada ,  Shigeyuki Shiotani

发明人： Masanori Ogino ,  Tadashi Fukushima ,  Takeo Yamada ,  Shigeyuki Shiotani

IPC分类号： G09G1/00 ,  G09G1/04 ,  G09G1/16 ,  G09G5/00 ,  G09G5/12 ,  G09G5/18 ,  H04N5/00 ,  H04N5/74 ,  H04N9/12

CPC分类号： H04N9/12

摘要： Apparatus for a multi-screen display including a multiprocessor for processing signals from at least one signal source and for applying processed signals to a plurality of display units arranged in at least two rows so as to form the multi-screen display. The multiprocessor includes vertical scanning format transformation apparatus for transforming a vertical scanning frequency of the output signal of the multiprocessor to be a higher vertical scanning frequency than that of a vertical scanning frequency of the input signal of the multiprocessor so that a ratio of the vertical scanning frequency of the output signal applied to the multi-screen display to the vertical scanning frequency of the input signal is at least two, thereby substantially eliminating discontinuity distortion of a moving pole image displayed as a reproduced picture on the multi-screen display.

摘要翻译： 一种用于多画面显示的装置，包括用于处理来自至少一个信号源的信号的多处理器，以及将经处理的信号施加到以至少两行布置的多个显示单元，以形成多屏显示。 多处理器包括用于将多处理器的输出信号的垂直扫描频率变换为比多处理器的输入信号的垂直扫描频率高的垂直扫描频率的垂直扫描格式变换装置，使得垂直扫描 施加到多屏幕显示器的输出信号的频率与输入信号的垂直扫描频率的频率为至少两个，从而基本上消除了在多屏幕显示器上显示为再现图像的移动极图像的不连续失真。

公开(公告)号：US5088836A

公开(公告)日：1992-02-18

申请号：US508800

申请日：1990-04-12

申请人： Takeo Yamada ,  Mitsuya Otonari ,  Masaru Yoshida ,  Naoki Harada ,  Shuichi Takano ,  Shinichiro Ohtaka

发明人： Takeo Yamada ,  Mitsuya Otonari ,  Masaru Yoshida ,  Naoki Harada ,  Shuichi Takano ,  Shinichiro Ohtaka

IPC分类号： G01K1/14 ,  G01K1/16 ,  G01K13/08

CPC分类号： G01K13/08 ,  G01K1/143 ,  G01K1/16

摘要： The invention provides an apparatus of the measurement which is consisted of a sensing element, a retaining element which retains the sensing element and which is made of a thermally conductive and electrically insulative material, a holding element which holds the retaining element, and a contact mechanism which elastically contact the retaining element with the top of the surface of the measured body. The sensing element is composed of a thin film thermister formed on the electrically insulating layer on a substrate. A film having the thermally conductive and electrically insulative material may be inserted between the measured body and the contact area of the retaining element. The retaining element is composed of the polyimide film and a flexible copper lead foil formed on the film and connected to the electrodes of the sensing element. The contact mechanism is composed of a pressing frame with at least one pressing arm which presses the contact part of the retaining element to the measured body and which is located adjacent to the contact zone.

公开(公告)号：US5053724A

公开(公告)日：1991-10-01

申请号：US530183

申请日：1990-05-29

申请人： Masanori Ogino ,  Takeo Yamada ,  Miyuki Ikeda

发明人： Masanori Ogino ,  Takeo Yamada ,  Miyuki Ikeda

IPC分类号： H04N5/12 ,  G09G5/00 ,  G09G5/02 ,  G09G5/12 ,  G09G5/18 ,  H03L7/093 ,  H04N3/27

CPC分类号： H03L7/093 ,  H03L2207/14

摘要： In a high prrecision PLL circuit arrangement, a phase detecting circuit produces a detecting signal which is directly proportional to a phase difference between a horizontal synchronizing signal and a voltage-controlled oscillating signal. A loop filter circuit produces a delay signal for delaying a frequency control at a predetermined time constant in response to the detecting signal derived from the phase detecting circuit. A voltage-controlled oscillating circuit produces an oscillating signal having a frequency directly proportional to a voltage of the delay signal from the loop filter circuit. A non-linear circuit includes a non-linear element for changing at least one of an AC gain and a DC gain of the loop filter circuit, and prevents an erroneous capture phenomenon of the PLL circuit arrangement in response to the detecting signal from the phase detecting circuit.

摘要翻译： 在高精度PLL电路装置中，相位检测电路产生与水平同步信号和压控振荡信号之间的相位差成正比的检测信号。 环路滤波器电路响应于从相位检测电路导出的检测信号，产生用于延迟预定时间常数的频率控制的延迟信号。 压控振荡电路产生具有与来自环路滤波器电路的延迟信号的电压成正比的频率的振荡信号。 非线性电路包括用于改变环路滤波器电路的AC增益和DC增益中的至少一个的非线性元件，并且响应于来自相位的检测信号防止PLL电路装置的错误捕获现象 检测电路。

公开(公告)号：US4918359A

公开(公告)日：1990-04-17

申请号：US335434

申请日：1989-04-10

申请人： Masanori Ogino ,  Takeo Yamada ,  Miyuki Ikeda

发明人： Masanori Ogino ,  Takeo Yamada ,  Miyuki Ikeda

IPC分类号： H04N3/16 ,  H04N3/18

CPC分类号： H04N3/18

摘要： A vertical deflection circuit used in a cathode ray tube display device for shortening a vertical blanking period is disclosed which includes back-flow blocking diode means for preventing an oscillating current from flowing backward to a vertical push-pull output amplifier circuit in the vertical blanking period, resonating capacitor means, and electrostatic energy supplying means for energizing a fly-back pulse. The resonating capacitor means is provided to generate resonance due to the capacitance of the capacitor means and the inductance of a vertical deflection coil, on the basis of the electro-magnetic energy of the vertical deflection coil at a time immediately before a retrace line starts from the bottom of display screen, thereby producing a fly-back pulse. The back-flow blocking diode means prevents the fly-back pulse from flowing backward to the vertical output circuit, that is, prevents the fly-back pulse from de-energizing the output of the vertical output circuit. According to the above vertical deflection circuit, the power consumption in a vertical retrace operation is reduced, and a ratio of the vertical blanking period to a vertical scanning period can be made small. Accordingly, an effective scanning time is increased, and it becomes possible to display information precisely.

摘要翻译： 公开了用于缩短垂直消隐期的阴极射线管显示装置中使用的垂直偏转电路，其包括用于防止振荡电流在垂直消隐期间向后流向垂直推挽输出放大器电路的反向流阻塞二极管装置 谐振电容器装置和用于激励回扫脉冲的静电能量供给装置。 谐振电容器装置被设置为基于电容器装置的电容和垂直偏转线圈的电感，基于垂直偏转线圈的电磁能在回扫线开始之前的时间产生谐振 显示屏的底部，从而产生回扫脉冲。 逆流阻塞二极管装置防止反向脉冲向后流向垂直输出电路，即防止回扫脉冲使垂直输出电路的输出断电。 根据上述垂直偏转电路，垂直回扫操作中的功耗降低，并且可以使垂直消隐周期与垂直扫描周期的比例变小。 因此，有效的扫描时间增加，可以精确地显示信息。

公开(公告)号：US4095469A

公开(公告)日：1978-06-20

申请号：US776901

申请日：1977-03-11

申请人： Takeo Yamada ,  Katsujiro Watanabe ,  Seigo Ando ,  Akira Kameyama

发明人： Takeo Yamada ,  Katsujiro Watanabe ,  Seigo Ando ,  Akira Kameyama

IPC分类号： G01K7/36 ,  G01R33/12

CPC分类号： G01K7/36

摘要： An apparatus for measuring the temperature of a metallic body in a non-contact maner includes an electronic circuitry for measuring a change in the impedance of a detecting coil arranged oppposite to the metallic body. The electronic circuitry comprises an operational amplifier, a negative feedback circuit with adjustable feedback factor, a positive feedback circuit, an oscillator, a phase shifter circuit and a synchronous detection circuit. The change in the impedance of the detecting coil is caused by the effect of eddy current produced by the application of alternating field to the metallic body, and this impedance change is dependent on change in the temperature of the metallic body. By adjusting the negative feedback factor .beta..sub.N of the negative feedback circuit and the phase angle .theta. of the phase shifter circuit in the electronic circuitry, the relationship between the distance measured between the detecting coil and the metallic body and the measured output level, the temperature measuring sensitivity relative to the temperature of the metallic body and the temperature measuring sensitivity relative to the measuring distance can be determined as desired.

摘要翻译： 用于测量非接触式接管装置中的金属体的温度的装置包括用于测量与金属体相对布置的检测线圈的阻抗变化的电子电路。 电子电路包括运算放大器，具有可调整反馈因子的负反馈电路，正反馈电路，振荡器，移相器电路和同步检测电路。 检测线圈的阻抗变化是由于通过对金属体施加交变场而产生的涡流的影响引起的，该阻抗变化取决于金属体的温度变化。 通过调整负反馈电路的负反馈因子βN和电子电路中移相器电路的相位角θ，检测线圈与金属体之间测得的距离与测量输出电平之间的关系，温度 可以根据需要确定相对于金属体的温度的测量灵敏度和相对于测量距离的温度测量灵敏度。