摘要:
In a chip carrier wherein a semiconductor chip is face down bonded to a package substrate through solder bumps, then covered with a cap and sealed hermetically using a sealing solder, the back of the semiconductor chip being bonded closely to the underside of the cap using a solder for heat transfer, a solder preform serving as the said heat transfer solder is heat-melted and a portion of the thus melted solder is allowed to flow into the sealing portion to effect the hermetic seal of the chip. Furthermore, in order to improve the flowability of the solder preform during the melt flow thereof, a metallized layer for heat transfer formed under the heat transfer solder of the cap and a sealing metallized layer are partially connected with each other through a connecting metallized layer.
摘要:
A metal member includes a first layer and a second layer. The second layer has an average crystal grain size different from an average crystal grain size of the first layer. An intermediate layer having an average crystal grain size smaller than the average crystal grain sizes of the first layer and the second layer is interposed between the first layer and the second layer.
摘要:
A channel substrate includes a plurality of individual channels and a plurality of linear machining marks. The plurality of individual channels is arrayed in row. The plurality of linear machining marks is substantially parallel to a direction in which the plurality of individual channels is arrayed in row.
摘要:
In a printing blanket, a manufacturing method of the printing blanket, a blanket cylinder, and a printing press, a printing unit is configured to include a plate cylinder to which a plate is attached, and a blanket cylinder that has a blanket attached thereto, rotates synchronously with the plate cylinder, and can transfer an ink image transferred from the plate cylinder onto a web, a circumference of the blanket cylinder is set to be twice as large as a circumference of the plate cylinder, and a notch and a concave portion along an axial direction are provided on a surface of the blanket at a uniform interval to correspond to a notch of the plate cylinder.
摘要:
An image processor includes an encoding unit encoding inputted data. The encoding unit includes a first processing unit splitting the data into a first partial data in a first digit range on an upper side and a second partial data in a second digit range on a lower side, a second processing unit encoding only the first partial data between the first partial data and the second partial data, and a third processing unit performing correction to set a value of the first partial data at “0”.
摘要:
A smart entry system for a vehicle having a lockable trunk is provided. The smart entry system includes portable devices, an onboard transmitter for transmitting request signals to the portable devices, an onboard receiver for receiving identification signals from the portable devices, and a trunk lockout protection feature. The trunk lockout protection feature is configured to receive a command signal to either initiate a trunk lockout protection sequence to unlock the trunk in the event that one of the portable devices is locked in the trunk or to disable the trunk lockout protection sequence to permit the trunk to remain in a locked state in the event that one of the portable devices is locked in the trunk.
摘要:
A semiconductor device chip has a plurality of projecting electrodes mounted on a wiring board or wafer having electrodes respectively corresponding to the projecting electrodes of the semiconductor device chip. An insulator is applied to the front side of the semiconductor device wafer where the projecting electrodes are formed, to fill any spaces between adjacent electrodes with the insulator. The front side of the wafer covered with the insulator is planarized to expose the end surfaces of the projecting electrodes, and the wafer is divided along division lines to obtain a plurality of individual semiconductor device chips. Each chip is mounted on the wiring board or the wafer with an anisotropic conductor interposed between the projecting electrodes of each chip and the electrodes of the wiring board or the wafer to thereby respectively connect the projecting electrodes and the electrodes through the anisotropic conductor.
摘要:
A pressure sensor has a Si device having a first main surface that has a bonded area, a second main surface parallel to the first main surface, a pressure-sensitive resistor formed on the first main surface, and a joining assist pattern formed on the first main surface, and a pressing member bonded to the bonded area on the first main surface and compressing the Si device in a thickness direction. The pressure-sensitive resistor has a first bonded section which is placed within the bonded area of the first main surface and is bonded to the pressing member. The joining assist pattern has a second bonded section which is made of the same material as the first bonded section of the pressure-sensitive resistor and is placed within the bonded area of the first main surface and is bonded to the pressing member.
摘要:
A tablet supply apparatus including a main body having a case accommodating unit at the upper portion thereof, plural tablet cases provided in the case accommodating unit, each of the tablet cases having tablets accommodated therein, a hopper provided at the lower side of the tablet case in the main body, a nozzle for filling tablets received by the hopper into a container, the nozzle comprising a passage through which tables drop, a shutter which is freely opened and closed so as to allow or prohibit passage of dropping tablets through the nozzle, and a sensor for detecting passage of the tablets dropping through the passage at an upper side of the shutter. Furthermore, a tablet feeder for adding deficient tablets to the hopper comprises plural cells for accommodating tablets and an endless belt on which the cells are arranged on a line side by side.
摘要:
An OLT transmits and receives a CMTS/CM apparatus control signal through an apparatus physical management interface which is physically identical to or different from a main signal interface (NNI) and processes the CMTS apparatus control signal by itself. When connection of a new ONU is detected by an ONU apparatus control signal, an IP address is allocated by using the CM apparatus control signal in a manner similar to the CM. The CM apparatus control signal regarding the ONU is transmitted and received by using the IP address and a mutual conversion is performed between the CM apparatus control signal and the ONU apparatus control signal. The ONU processes the ONU apparatus control signal in a manner similar to the ONU based on an ordinary PON standard.