公开(公告)号：US07378678B2

公开(公告)日：2008-05-27

申请号：US11748579

申请日：2007-05-15

申请人： Toshijaru Furukawa ,  Mark C. Hakey ,  Steven J. Holmes ,  David V. Horak ,  Charles W. Koburger, III ,  Chung H. Lam ,  Gerhard I. Meijer

发明人： Toshijaru Furukawa ,  Mark C. Hakey ,  Steven J. Holmes ,  David V. Horak ,  Charles W. Koburger, III ,  Chung H. Lam ,  Gerhard I. Meijer

IPC分类号： H01L47/00

CPC分类号： H01L27/101 ,  H01L27/115 ,  H01L27/2409 ,  H01L27/2463 ,  H01L45/04 ,  H01L45/1233 ,  H01L45/147 ,  Y10S438/90

摘要： Disclosed are non-volatile memory devices that incorporate a series of single or double memory cells. The single memory cells are essentially “U” shaped. The double memory cells comprise two essentially “U” shaped memory cells. Each memory cell comprises a memory element having a bi-stable layer sandwiched between two conductive layers. A temporary conductor may be applied to a series of cells and used to bulk condition the bi-stable layers of the cells. Also, due to the “U” shape of the cells, a cross point wire array may be used to connect a series of cells. The cross point wire array allows the memory elements of each cell to be individually identified and addressed for storing information and also allows for the information stored in the memory elements in all of the cells in the series to be simultaneously erased using a block erase process.

摘要翻译： 公开了包含一系列单个或双重存储器单元的非易失性存储器件。 单个存储器单元基本上是“U”形的。 双重存储单元包括两个基本上“U”形的存储单元。 每个存储单元包括具有夹在两个导电层之间的双稳态层的存储元件。 临时导体可以应用于一系列的电池并且用于批量地调节电池的双稳态层。 此外，由于电池的“U”形状，可以使用交叉点线阵列来连接一系列电池。 交叉点线阵列允许每个单元的存储元件被单独识别和寻址用于存储信息，并且还允许使用块擦除处理同时擦除存储在串联中的所有单元中的存储器元件中的信息。

公开(公告)号：US07834384B2

公开(公告)日：2010-11-16

申请号：US12060922

申请日：2008-04-02

申请人： Toshijaru Furukawa ,  Mark C. Hakey ,  Steven J. Holmes ,  David V. Horak ,  Charles W. Koburger, III ,  Chung H. Lam ,  Gerhard I. Meijer

发明人： Toshijaru Furukawa ,  Mark C. Hakey ,  Steven J. Holmes ,  David V. Horak ,  Charles W. Koburger, III ,  Chung H. Lam ,  Gerhard I. Meijer

IPC分类号： H01L27/00

CPC分类号： H01L27/0629 ,  H01L27/101 ,  H01L27/24

摘要： Disclosed are a semiconductor structure and a method that allow for simultaneous voltage/current conditioning of multiple memory elements in a nonvolatile memory device with multiple memory cells. The structure and method incorporate the use of a resistor connected in series with the memory elements to limit current passing through the memory elements. Specifically, the method and structure incorporate a blanket temporary series resistor on the wafer surface above the memory cells and/or permanent series resistors within the memory cells. During the conditioning process, these resistors protect the transition metal oxide in the individual memory elements from damage (i.e., burn-out), once it has been conditioned.

摘要翻译： 公开了一种半导体结构和方法，其允许在具有多个存储器单元的非易失性存储器件中同时对多个存储器元件进行电压/电流调节。 该结构和方法结合使用与存储器元件串联连接的电阻器来限制电流通过存储器元件。 具体地，该方法和结构在存储器单元上方的晶片表面上和/或存储器单元内的永久串联电阻器上并入一个橡皮布暂时串联电阻器。 在调节过程中，一旦调节了这些电阻，这些电阻就可以保护各个存储元件中的过渡金属氧化物免受损坏（即烧坏）。

公开(公告)号：US07256415B2

公开(公告)日：2007-08-14

申请号：US11140780

申请日：2005-05-31

申请人： Toshijaru Furukawa ,  Mark C. Hakey ,  Steven J. Holmes ,  David V. Horak ,  Charles W. Koburger, III ,  Chung H. Lam ,  Gerhard I. Meijer

发明人： Toshijaru Furukawa ,  Mark C. Hakey ,  Steven J. Holmes ,  David V. Horak ,  Charles W. Koburger, III ,  Chung H. Lam ,  Gerhard I. Meijer

IPC分类号： H01L47/00

CPC分类号： H01L27/101 ,  H01L27/115 ,  H01L27/2409 ,  H01L27/2463 ,  H01L45/04 ,  H01L45/1233 ,  H01L45/147 ,  Y10S438/90

摘要： Disclosed are non-volatile memory devices that incorporate a series of single or double memory cells. The single memory cells are essentially “U” shaped. The double memory cells comprise two essentially “U” shaped memory cells. Each memory cell comprises a memory element having a bi-stable layer sandwiched between two conductive layers. A temporary conductor may be applied to a series of cells and used to bulk condition the bi-stable layers of the cells. Also, due to the “U” shape of the cells, a cross point wire array may be used to connect a series of cells. The cross point wire array allows the memory elements of each cell to be individually identified and addressed for storing information and also allows for the information stored in the memory elements in all of the cells in the series to be simultaneously erased using a block erase process.

摘要翻译： 公开了包含一系列单个或双重存储器单元的非易失性存储器件。 单个存储器单元基本上是“U”形的。 双重存储单元包括两个基本上“U”形的存储单元。 每个存储单元包括具有夹在两个导电层之间的双稳态层的存储元件。 临时导体可以应用于一系列的电池并且用于批量地调节电池的双稳态层。 此外，由于电池的“U”形状，可以使用交叉点线阵列来连接一系列电池。 交叉点线阵列允许每个单元的存储元件被单独识别和寻址用于存储信息，并且还允许使用块擦除处理同时擦除存储在串联中的所有单元中的存储器元件中的信息。

公开(公告)号：US20080185652A1

公开(公告)日：2008-08-07

申请号：US12060922

申请日：2008-04-02

申请人： Toshijaru Furukawa ,  Mark C. Hakey ,  Steven J. Holmes ,  David V. Horak ,  Charles W. Koburger ,  Chung H. Lam ,  Gerhard I. Meijer

发明人： Toshijaru Furukawa ,  Mark C. Hakey ,  Steven J. Holmes ,  David V. Horak ,  Charles W. Koburger ,  Chung H. Lam ,  Gerhard I. Meijer

IPC分类号： H01L23/62 ,  H01L21/8234

CPC分类号： H01L27/0629 ,  H01L27/101 ,  H01L27/24

摘要： Disclosed are a semiconductor structure and a method that allow for simultaneous voltage/current conditioning of multiple memory elements in a nonvolatile memory device with multiple memory cells. The structure and method incorporate the use of a resistor connected in series with the memory elements to limit current passing through the memory elements. Specifically, the method and structure incorporate a blanket temporary series resistor on the wafer surface above the memory cells and/or permanent series resistors within the memory cells. During the conditioning process, these resistors protect the transition metal oxide in the individual memory elements from damage (i.e., burn-out), once it has been conditioned.

摘要翻译： 公开了一种半导体结构和方法，其允许在具有多个存储器单元的非易失性存储器件中同时对多个存储器元件进行电压/电流调节。 该结构和方法结合使用与存储器元件串联连接的电阻器来限制电流通过存储器元件。 具体地，该方法和结构在存储器单元上方的晶片表面上和/或存储器单元内的永久串联电阻器上并入一个橡皮布暂时串联电阻器。 在调节过程中，一旦调节了这些电阻，这些电阻就可以保护各个存储元件中的过渡金属氧化物免受损坏（即烧坏）。

公开(公告)号：US07541608B2

公开(公告)日：2009-06-02

申请号：US12030927

申请日：2008-02-14

申请人： Toshijaru Furukawa ,  Mark C. Hakey ,  Steven J. Holmes ,  David V. Horak ,  Charles W. Koburger ,  Chung H. Lam ,  Gerhard I. Meijer

发明人： Toshijaru Furukawa ,  Mark C. Hakey ,  Steven J. Holmes ,  David V. Horak ,  Charles W. Koburger ,  Chung H. Lam ,  Gerhard I. Meijer

IPC分类号： H01L47/00

CPC分类号： H01L27/101 ,  H01L27/115 ,  H01L27/2409 ,  H01L27/2463 ,  H01L45/04 ,  H01L45/1233 ,  H01L45/147 ,  Y10S438/90

摘要： Disclosed are non-volatile memory devices that incorporate a series of single or double memory cells. The single memory cells are essentially “U” shaped. The double memory cells comprise two essentially “U” shaped memory cells. Each memory cell comprises a memory element having a bi-stable layer sandwiched between two conductive layers. A temporary conductor may be applied to a series of cells and used to bulk condition the bi-stable layers of the cells. Also, due to the “U” shape of the cells, a cross point wire array may be used to connect a series of cells. The cross point wire array allows the memory elements of each cell to be individually identified and addressed for storing information and also allows for the information stored in the memory elements in all of the cells in the series to be simultaneously erased using a block erase process.

摘要翻译： 公开了包含一系列单个或双重存储器单元的非易失性存储器件。 单个存储器单元基本上是“U”形的。 双重存储单元包括两个基本上“U”形的存储单元。 每个存储单元包括具有夹在两个导电层之间的双稳态层的存储元件。 临时导体可以应用于一系列的电池并且用于批量地调节电池的双稳态层。 此外，由于电池的“U”形状，可以使用交叉点线阵列来连接一系列电池。 交叉点线阵列允许每个单元的存储元件被单独识别和寻址用于存储信息，并且还允许使用块擦除处理同时擦除存储在串联中的所有单元中的存储器元件中的信息。

公开(公告)号：US20080131995A1

公开(公告)日：2008-06-05

申请号：US12030927

申请日：2008-02-14

申请人： Toshijaru Furukawa ,  Mark C. Hakey ,  Steven J. Holmes ,  David V. Horak ,  Charles W. Koburger ,  Chung H. Lam ,  Gerhard I. Meijer

发明人： Toshijaru Furukawa ,  Mark C. Hakey ,  Steven J. Holmes ,  David V. Horak ,  Charles W. Koburger ,  Chung H. Lam ,  Gerhard I. Meijer

IPC分类号： H01L21/00

CPC分类号： H01L27/101 ,  H01L27/115 ,  H01L27/2409 ,  H01L27/2463 ,  H01L45/04 ,  H01L45/1233 ,  H01L45/147 ,  Y10S438/90

摘要： Disclosed are non-volatile memory devices that incorporate a series of single or double memory cells. The single memory cells are essentially “U” shaped. The double memory cells comprise two essentially “U” shaped memory cells. Each memory cell comprises a memory element having a bi-stable layer sandwiched between two conductive layers. A temporary conductor may be applied to a series of cells and used to bulk condition the bi-stable layers of the cells. Also, due to the “U” shape of the cells, a cross point wire array may be used to connect a series of cells. The cross point wire array allows the memory elements of each cell to be individually identified and addressed for storing information and also allows for the information stored in the memory elements in all of the cells in the series to be simultaneously erased using a block erase process.

摘要翻译： 公开了包含一系列单个或双重存储器单元的非易失性存储器件。 单个存储器单元基本上是“U”形的。 双重存储单元包括两个基本上“U”形的存储单元。 每个存储单元包括具有夹在两个导电层之间的双稳态层的存储元件。 临时导体可以应用于一系列的电池并且用于批量地调节电池的双稳态层。 此外，由于电池的“U”形状，可以使用交叉点线阵列来连接一系列电池。 交叉点线阵列允许每个单元的存储元件被单独识别和寻址用于存储信息，并且还允许使用块擦除处理同时擦除存储在串联中的所有单元中的存储器元件中的信息。

公开(公告)号：US08039334B2

公开(公告)日：2011-10-18

申请号：US12902944

申请日：2010-10-12

申请人： Toshiharu Furukawa ,  Mark C. Hakey ,  Steven J. Holmes ,  David V. Horak ,  Charles W. Koburger, III ,  Mark E. Masters

发明人： Toshiharu Furukawa ,  Mark C. Hakey ,  Steven J. Holmes ,  David V. Horak ,  Charles W. Koburger, III ,  Mark E. Masters

IPC分类号： H01L21/8234

CPC分类号： H01L21/823412 ,  B01J23/74 ,  B01J37/0238 ,  B82Y10/00 ,  H01L21/7624 ,  H01L21/823437 ,  H01L27/286 ,  H01L51/0048 ,  H01L51/0545 ,  H01L51/055 ,  Y10S977/742 ,  Y10S977/762 ,  Y10S977/763

摘要： A semiconductor structure in which a planar semiconductor device and a horizontal carbon nanotube transistor have a shared gate and a method of fabricating the same are provided in the present application. The hybrid semiconductor structure includes at least one horizontal carbon nanotube transistor and at least one planar semiconductor device, in which the at least one horizontal carbon nanotube transistor and the at least one planar semiconductor device have a shared gate and the at least one horizontal carbon nanotube transistor is located above a gate of the at least one planar semiconductor device.

摘要翻译： 在本申请中提供了其中平面半导体器件和水平碳纳米管晶体管具有共享栅极的半导体结构及其制造方法。 所述混合半导体结构包括至少一个水平碳纳米管晶体管和至少一个平面半导体器件，其中所述至少一个水平碳纳米管晶体管和所述至少一个平面半导体器件具有共享栅极，并且所述至少一个水平碳纳米管 晶体管位于至少一个平面半导体器件的栅极之上。

公开(公告)号：US08004024B2

公开(公告)日：2011-08-23

申请号：US12348404

申请日：2009-01-05

申请人： Toshiharu Furukawa ,  Mark C. Hakey ,  Steven J. Holmes ,  David V. Horak ,  Charles W. Koburger, III

发明人： Toshiharu Furukawa ,  Mark C. Hakey ,  Steven J. Holmes ,  David V. Horak ,  Charles W. Koburger, III

IPC分类号： H01L29/423 ,  H01L29/78

CPC分类号： H01L29/4983 ,  H01L29/4908 ,  H01L29/6656 ,  H01L29/6659 ,  H01L29/66772 ,  H01L29/7833 ,  H01L29/78621 ,  Y10S977/742 ,  Y10S977/847

摘要： A transistor. The transistor including: a well region in a substrate; a gate dielectric layer on a top surface of the well region; a polysilicon gate electrode on a top surface of the gate dielectric layer; spacers formed on opposite sidewalls of the polysilicon gate electrode; source/drain regions formed on opposite sides of the polysilicon gate electrode in the well region; a first doped region in the polysilicon gate electrode, the first doped region extending into the polysilicon gate electrode from a top surface of the polysilicon gate electrode; and a buried second doped region in the polysilicon gate electrode.

摘要翻译： 晶体管。 晶体管包括：衬底中的阱区; 在所述阱区的顶表面上的栅介质层; 栅极电介质层的顶表面上的多晶硅栅电极; 间隔物形成在多晶硅栅电极的相对侧壁上; 形成在阱区中的多晶硅栅电极的相对侧上的源/漏区; 所述多晶硅栅电极中的第一掺杂区域，所述第一掺杂区域从所述多晶硅栅电极的顶表面延伸到所述多晶硅栅电极; 以及多晶硅栅电极中的掩埋的第二掺杂区。

公开(公告)号：US07557023B2

公开(公告)日：2009-07-07

申请号：US11532189

申请日：2006-09-15

申请人： Toshiharu Furukawa ,  Mark C. Hakey ,  Steven J. Holmes ,  David V. Horak ,  Charles W. Koburger, III

发明人： Toshiharu Furukawa ,  Mark C. Hakey ,  Steven J. Holmes ,  David V. Horak ,  Charles W. Koburger, III

IPC分类号： H01L21/425

CPC分类号： H01L29/66545 ,  H01L21/0273 ,  H01L21/266 ,  H01L21/28035 ,  H01L29/1083 ,  H01L29/6653 ,  H01L29/6659

摘要： A semiconductor fabrication method. The method includes providing a semiconductor structure which includes (i) a semiconductor layer, (ii) a gate dielectric layer on the semiconductor layer, and (iii) a gate electrode region on the gate dielectric layer. The gate dielectric layer is sandwiched between and electrically insulates the semiconductor layer and the gate electrode region. The semiconductor layer and the gate dielectric layer share a common interfacing surface which defines a reference direction perpendicular to the common interfacing surface and pointing from the semiconductor layer to the gate dielectric layer. Next, a resist layer is formed on the gate dielectric layer and the gate electrode region. Next, a cap portion of the resist layer directly above the gate electrode region in the reference direction is removed without removing any portion of the resist layer not directly above the gate electrode region in the reference direction.

摘要翻译： 半导体制造方法。 该方法包括提供半导体结构，其包括（i）半导体层，（ii）半导体层上的栅极电介质层，以及（iii）栅极电介质层上的栅电极区。 栅极电介质层被夹在半导体层和栅极电极区域之间并使其电绝缘。 半导体层和栅极介电层共享公共接口表面，其界定垂直于公共接口表面的参考方向并且从半导体层指向栅极介电层。 接下来，在栅极电介质层和栅极电极区域上形成抗蚀剂层。 接下来，去除在参考方向上正好在栅极区域上方的抗蚀剂层的盖部分，而不去除在参考方向上不在栅电极区域正上方的任何部分的抗蚀剂层。

公开(公告)号：US07393779B2

公开(公告)日：2008-07-01

申请号：US11163786

申请日：2005-10-31

申请人： Toshiharu Furukawa ,  Mark C. Hakey ,  Steven J. Holmes ,  David V. Horak ,  Charles W. Koburger, III ,  Larry A. Nesbit

发明人： Toshiharu Furukawa ,  Mark C. Hakey ,  Steven J. Holmes ,  David V. Horak ,  Charles W. Koburger, III ,  Larry A. Nesbit

IPC分类号： H01L21/4763

CPC分类号： H01L21/76816 ,  H01L21/0337 ,  H01L21/0338 ,  H01L21/31144

摘要： Sublithographic contact apertures through a dielectric are formed in a stack of dielectric, hardmask and oxide-containing seed layer. An initial aperture through the seed layer receives a deposition of oxide by liquid phase deposition, which adheres selectively to the exposed vertical walls of the aperture in the seed layer. The sublithographic aperture, reduced in size by the thickness of the added material, defines a reduced aperture in the hardmask. The reduced hardmask then defines the sublithographic aperture through the dielectric.

摘要翻译： 通过电介质的亚光刻接触孔形成在电介质，硬掩模和含氧化物种子层的堆叠中。 通过种子层的初始孔径通过液相沉积接收氧化物沉积，该相沉积选择性地粘附到种子层中的孔的暴露的垂直壁。 通过所添加的材料的厚度减小尺寸的亚光刻孔径在硬掩模中限定了减小的孔径。 缩小的硬掩模然后限定通过电介质的亚光刻孔。