摘要:
Disclosed herein are a process for producing mixed crystals of disodium 5′-guanylate and disodium 5′-inosinate which comprises precipitating mixed crystals of disodium 5′-guanylate and disodium 5′-inosinate (I+G mixed crystals) by adding an aqueous mixed solution of disodium 5′-guanylate and disodium 5′-inosinate and a hydrophilic organic solvent at the same time into a crystallization vessel in such manner that the ratio of the hydrophilic organic solvent to the liquid phase in the crystallization vessel is maintained in a range of 30 to 70 vol %, as well as such process for producing I+G mixed crystals wherein said producing of I+G mixed crystals is carried out by seeding crystallization wherein crystals of 5′-IMP2Na or/and I+G mixed crystals are used as seed crystals. According to these production processes, the by-production of amorphous solids of 5′-GMP2Na which adversely affect separability of the crystals concerned, is inhibited, and therefore, such mixed crystals having a good separability without contamination of such amorphous solids, can be produced in a high productivity.
摘要:
Herein is disclosed a method for producing mixed crystals of disodium 5′-guanylate and disodium 5′-inosinate which comprises feeding a mixed solution of disodium 5′-guanylate and disodium 5′-inosinate which solution will become supersaturated at the below-mentioned constant temperature, to a solution or slurry of disodium 5′-guanylate and disodium 5′-inosinate charged in a crystallization bath (lower-temperature bath) and kept at a constant temperature, whereby mixed crystals of disodium 5′-guanylate and disodium 5′-inosinate are deposited from the mixed solution of disodium 5′-guanylate and disodium 5′-inosinate, according to which method 5′-GMP2Na which is difficult to handle due to the properties and powder characteristic of its crystals in particular and 5′-IMP2Na, in the form of crystals which are easy to handle, that is, I+G mixed crystals having a given I/G ratio, can be produced under simple process control and with inexpensive facilities, with the I/G ratio being controlled easily.
摘要:
The invention relates to antigen-presenting cells having specificity against a selected antigen and methods for making the cells. The invention also relates to a method of selecting efficient antigen-presenting cells using reporter fusion constructs. The highly efficient antigen-presenting cells of the invention will provide a therapeutic strategy of modulating immune responses for a variety of diseases.
摘要:
A method for forming a pattern of a stacked film, includes steps (a) to (e). The step (a) is forming sequentially a first base insulating film and a light shielding material on a transparent substrate. The step (b) is patterning the light shielding material to obtain a light shielding film with a first pattern. The step (c) is forming sequentially a second base insulating film, a semiconductor film and a first oxide film on a substrate. The step (d) is forming a resist pattern with a second pattern on the first oxide film. The step (e) is forming a pattern of a stacked film by dry etching the first oxide film and the semiconductor film, above the light shielding film. The stacked film includes the semiconductor film and the first oxide film. The dry etching includes an etching by using an etching gas and the resist pattern as a mask. The semiconductor film includes a taper angle which is controlled to be within predetermined range.
摘要:
A semiconductor film serving as an active region of a thin film transistor and an upper oxide film protecting the semiconductor film are dry etched to form the active region. In this case, a fluorine-based gas is used as the etching gas, and the etching gas is switched from the fluorine-based gas to a chlorine-based gas at a point of time when a lower oxide film as an underlying film of the semiconductor film is exposed. As the fluorine-based gas, a mixed gas of CF4 and O2 is used, and suitably, a gas ratio of CF4 and O2 in the mixture gas is set at 1:1, and the dry etching is performed therefor. By this etching, a side face of a two-layer structure of the semiconductor film and upper oxide film is optimally tapered, and a crack or a disconnection is prevented from being occurring in a film crossing over the two-layer structure.
摘要:
A method for forming a pattern of a stacked film, includes steps (a) to (e). The step (a) is forming sequentially a first base insulating film and a light shielding material on a transparent substrate. The step (b) is patterning the light shielding material to obtain a light shielding film with a first pattern. The step (c) is forming sequentially a second base insulating film, a semiconductor film and a first oxide film on a substrate. The step (d) is forming a resist pattern with a second pattern on the first oxide film. The step (e) is forming a pattern of a stacked film by dry etching the first oxide film and the semiconductor film, above the light shielding film. The stacked film includes the semiconductor film and the first oxide film. The dry etching includes an etching by using an etching gas and the resist pattern as a mask. The semiconductor film includes a taper angle which is controlled to be within predetermined range.
摘要:
Each cell of a PDP is provided with a pair of narrow and substantially U-shaped plane electrodes, which are connected to a corresponding trace electrode at the open ends thereof (located at the respective non-discharging gap sides) to operate as scan electrode and common electrode. A plane discharging gap is defined between the closed front ends of the plane electrodes. The plane electrodes have a curved profile at the front ends thereof with the highest point located at the longitudinal central axis of the cell. With this arrangement, the effective length of the plane electrodes can be increased without increasing the surface area of the plane electrodes so that the plane electrodes overlap the data electrode at the front ends thereof over an expanded area.
摘要:
A semiconductor wafer for an epitaxial growth is disclosed comprising: a main face on which a vapor phase epitaxial layer grows; a back face provided on an opposite side of the wafer; a main chamfered part along a circumferential edge where the main face and a side face of the wafer meet; and a back chamfered part along a circumferential edge where the back face and the side face meet is provided. After a CVD layer formation process is conducted to form a layer at least on the back face and the back chamfered part, a machining process is conducted on the main face to remove a CVD layer at least partially formed thereon so as to polish the main face to a mirror finished surface with a maximum height of profile (Rz) not exceeding 0.3 μm.
摘要:
Ribs for defining pixel cells are formed in the shape of a lattice, and sustain electrodes and scan electrodes are disposed near the ribs. The electrodes are spaced apart in each pixel cell, and the sustain electrode and the scan electrode are each cut away between pixel cells arranged in the row direction to provide each pixel cell with individually separated electrodes. In addition, between pixel cells adjacent to each other in the row direction, the sustain electrodes and the scan electrodes are connected to each other by means of a sustain-side bus electrode and a scan-side bus electrode, respectively. This makes it possible to provide a high luminous efficiency. Furthermore, each pixel cell is provided with a wide distance between the electrodes and thereby with a large effective opening portion. Thus, this provides only a small amount of reduction in intensity when the electrodes are spaced apart between the pixel cells arranged in the row direction in order to increase the luminous efficiency. The sustain electrodes or the scan electrodes can be connected to each other or shared between pixel cells adjacent to each other in the column direction and thus the effective opening portion can be made larger, thereby making it possible to provide a further increased intensity and luminous efficiency.
摘要:
A method for forming a pattern of a stacked film, includes steps (a) to (e). The step (a) is forming sequentially a first base insulating film and a light shielding material on a transparent substrate. The step (b) is patterning the light shielding material to obtain a light shielding film with a first pattern. The step (c) is forming sequentially a second base insulating film, a semiconductor film and a first oxide film on a substrate. The step (d) is forming a resist pattern with a second pattern on the first oxide film. The step (e) is forming a pattern of a stacked film by dry etching the first oxide film and the semiconductor film, above the light shielding film. The stacked film includes the semiconductor film and the first oxide film. The dry etching includes an etching by using an etching gas and the resist pattern as a mask. The semiconductor film includes a taper angle which is controlled to be within predetermined range.