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公开(公告)号：US20100103680A1
公开(公告)日：2010-04-29
申请号：US12606211
申请日：2009-10-27
申请人： Tsuyoshi OYAIZU , Seiko Kawashima , Haruki Takei , Naoko Matsui
发明人： Tsuyoshi OYAIZU , Seiko Kawashima , Haruki Takei , Naoko Matsui
CPC分类号： F21V29/70 , F21K9/00 , F21Y2105/10 , F21Y2115/10 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H05K1/0203 , H05K1/0274 , H05K1/053 , H05K2201/0195 , H05K2201/10106 , H05K2201/2054 , H05K2203/1476 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting module includes a substrate, a wiring pattern, and a light-emitting device that generates heat. The substrate includes a metal base and an insulating base that is stacked on the metal base and has a mount surface on the opposite side of the metal base. The insulating base has a plurality of insulating layers stacked on one another. The wiring pattern is provided on the mount surface of the substrate. The light-emitting device is mounted on the mount surface of the substrate and is electrically connected to the wiring pattern.
摘要翻译： 发光模块包括基板，布线图案和产生热量的发光装置。 衬底包括金属基底和绝缘基底，该绝缘基底层堆叠在金属基底上并且在金属基底的相对侧具有安装表面。 绝缘基底具有彼此堆叠的多个绝缘层。 布线图案设置在基板的安装表面上。 发光装置安装在基板的安装表面上并与布线图形电连接。
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公开(公告)号：US20100135034A1
公开(公告)日：2010-06-03
申请号：US12625917
申请日：2009-11-25
申请人： Tsuyoshi OYAIZU , Seiko Kawashima , Haruki Takei , Naoko Matsui
发明人： Tsuyoshi OYAIZU , Seiko Kawashima , Haruki Takei , Naoko Matsui
CPC分类号： H01L23/4006 , H01L23/3736 , H01L2924/0002 , H01L2924/09701 , H05K1/0203 , H05K1/0306 , H05K1/092 , H05K3/0061 , H05K3/102 , H05K7/20481 , H05K2201/10409 , H01L2924/00
摘要： The invention provides an electronic component mounting module capable of increasing the adhesion between the board and the heat radiating member, improving the thermal conductivity, and effectively radiating heat generated from the LEDs being an electronic component. The LEDs are mounted on the surface of the ceramics board, and the rear surface 1b side of the board is disposed at the heat radiating member. A metallic fine particle layer having high thermal conductivity and flexibility is made to intervene between the board and the heat radiating member.
摘要翻译： 本发明提供一种电子部件安装模块，其能够增加板和散热构件之间的粘附性，改善导热性，并且有效地辐射由作为电子部件的LED产生的热量。 LED安装在陶瓷板的表面上，并且板的后表面1b侧设置在散热构件上。 制成具有高导热性和柔性的金属微粒层，以在基板和散热构件之间插入。
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3.发明授权公开(公告)号：US08403536B2
公开(公告)日：2013-03-26
申请号：US12606211
申请日：2009-10-27
申请人： Tsuyoshi Oyaizu , Seiko Kawashima , Haruki Takei , Naoko Matsui
发明人： Tsuyoshi Oyaizu , Seiko Kawashima , Haruki Takei , Naoko Matsui
CPC分类号： F21V29/70 , F21K9/00 , F21Y2105/10 , F21Y2115/10 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H05K1/0203 , H05K1/0274 , H05K1/053 , H05K2201/0195 , H05K2201/10106 , H05K2201/2054 , H05K2203/1476 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting module includes a substrate, a wiring pattern, and a light-emitting device that generates heat. The substrate includes a metal base and an insulating base that is stacked on the metal base and has a mount surface on the opposite side of the metal base. The insulating base has a plurality of insulating layers stacked on one another. The wiring pattern is provided on the mount surface of the substrate. The light-emitting device is mounted on the mount surface of the substrate and is electrically connected to the wiring pattern.
摘要翻译： 发光模块包括基板，布线图案和产生热量的发光装置。 衬底包括金属基底和绝缘基底，该绝缘基底层堆叠在金属基底上并且在金属基底的相对侧具有安装表面。 绝缘基底具有彼此堆叠的多个绝缘层。 布线图案设置在基板的安装表面上。 发光装置安装在基板的安装表面上并与布线图形电连接。
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公开(公告)号：US08197099B2
公开(公告)日：2012-06-12
申请号：US12625917
申请日：2009-11-25
申请人： Tsuyoshi Oyaizu , Seiko Kawashima , Haruki Takei , Naoko Matsui
发明人： Tsuyoshi Oyaizu , Seiko Kawashima , Haruki Takei , Naoko Matsui
IPC分类号： F21V29/00
CPC分类号： H01L23/4006 , H01L23/3736 , H01L2924/0002 , H01L2924/09701 , H05K1/0203 , H05K1/0306 , H05K1/092 , H05K3/0061 , H05K3/102 , H05K7/20481 , H05K2201/10409 , H01L2924/00
摘要： The invention provides an electronic component mounting module capable of increasing the adhesion between the board and the heat radiating member, improving the thermal conductivity, and effectively radiating heat generated from the LEDs being an electronic component. The LEDs are mounted on the surface of the ceramics board, and the rear surface 1b side of the board is disposed at the heat radiating member. A metallic fine particle layer having high thermal conductivity and flexibility is made to intervene between the board and the heat radiating member.
摘要翻译： 本发明提供一种电子部件安装模块，其能够增加板和散热构件之间的粘附性，改善导热性，并且有效地辐射由作为电子部件的LED产生的热量。 LED安装在陶瓷板的表面上，并且板的后表面1b侧设置在散热构件上。 制成具有高导热性和柔性的金属微粒层，以在基板和散热构件之间插入。
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公开(公告)号：US08716943B2
公开(公告)日：2014-05-06
申请号：US13027788
申请日：2011-02-15
申请人： Tsuyoshi Oyaizu , Seiko Kawashima , Haruki Takei , Akiko Saito
发明人： Tsuyoshi Oyaizu , Seiko Kawashima , Haruki Takei , Akiko Saito
CPC分类号： H05B33/0884 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/181 , H05B33/0803 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： According to one embodiment, a light-emitting device includes a substrate including an insulating surface, a plurality of light-emitting elements mounted on the surface of the substrate and electrically connected to each other, a positive power feeding conductor and a negative power feeding conductor mounted on the surface of the substrate to feed power to the light-emitting elements, lead-out terminals leading from the power feeding conductors, to the outside of an mounting area of the light-emitting elements, and an anti-noise part connected to the lead-out terminals and arranged outside the mounting area.
摘要翻译： 根据一个实施例，一种发光装置包括：基板，包括绝缘表面;多个发光元件，安装在基板的表面上并彼此电连接，正电力馈送导体和负电力供电导体 安装在基板的表面上，以将功率馈送到发光元件，从馈电导体引出的引出端到发光元件的安装区域的外部，以及连接到 引出端子并布置在安装区域外部。
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公开(公告)号：US20120026738A1
公开(公告)日：2012-02-02
申请号：US13193032
申请日：2011-07-28
申请人： Tsuyoshi Oyaizu , Haruki Takei , Seiko Kawashima
发明人： Tsuyoshi Oyaizu , Haruki Takei , Seiko Kawashima
IPC分类号： F21V21/00
CPC分类号： F21V19/004 , F21K9/00 , F21S8/086 , F21V29/70 , F21W2131/103 , F21Y2105/10 , F21Y2115/10 , H01L24/45 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/48137 , H01L2224/73265 , H01L2924/01015 , H01L2924/01047 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： According to one embodiment, a light-emitting apparatus includes a substrate, an attachment member, and a mechanical fixing component. The substrate has light-emitting elements mounted on one surface side thereof. The attachment member includes a concave portion in which the substrate is arranged with a gap between the substrate and a side circumference of the concave portion. The mechanical fixing component includes a pressure portion that is in contact with the one surface side of the substrate, the mechanical fixing component being configured to hold the substrate in the concave portion of the attachment member by elastic pressing force of the pressure portion acting in a direction from the one surface side toward the other surface side of the substrate.
摘要翻译： 根据一个实施例，发光装置包括基板，附接构件和机械固定部件。 基板具有安装在其一个表面侧上的发光元件。 所述安装部件包括凹部，所述基板在所述基板与所述凹部的侧周之间具有间隙。 所述机械固定部件包括与所述基板的一个表面侧接触的压力部，所述机械固定部件构造成通过所述压力部的作用力的弹性压力将所述基板保持在所述安装部件的凹部内 方向从基板的一个表面侧朝向另一个表面侧。
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公开(公告)号：US08044570B2
公开(公告)日：2011-10-25
申请号：US12581911
申请日：2009-10-20
申请人： Tsuyoshi Oyaizu , Kozo Ogawa , Seiko Kawashima , Akiko Takahashi , Haruki Takei , Erika Takenaka
发明人： Tsuyoshi Oyaizu , Kozo Ogawa , Seiko Kawashima , Akiko Takahashi , Haruki Takei , Erika Takenaka
CPC分类号： F21V31/04 , F21V9/30 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/486 , H01L33/507 , H01L33/56 , H01L2924/0002 , H01L2924/00
摘要： A lighting device includes a printed wiring board, a plurality of light-emitting elements, a sealing member, and a color conversion unit, and an adhesive layer. The sealing member has light transmitting properties and seals the light-emitting elements mounted on the printed wiring board. The color conversion unit includes a cover member of light transmitting properties, and a fluorescent substance layer provided on the inner surface of the cover member. The adhesive layer has light-transmitting properties, and adheres the sealing member to the fluorescent substance layer of the color conversion unit in an airtight manner.
摘要翻译： 照明装置包括印刷线路板，多个发光元件，密封构件和颜色转换单元以及粘合剂层。 密封构件具有透光性，并且密封安装在印刷线路板上的发光元件。 颜色转换单元包括透光性的盖构件和设置在盖构件的内表面上的荧光物质层。 粘合剂层具有透光性，并且密封构件以气密的方式粘附到颜色转换单元的荧光物质层。
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公开(公告)号：US08641232B2
公开(公告)日：2014-02-04
申请号：US13162668
申请日：2011-06-17
申请人： Seiko Kawashima , Yuichiro Takahara , Kazuya Kondo , Yusuke Shibahara , Hiroki Tamai , Haruki Takei , Tsuyoshi Oyaizu
发明人： Seiko Kawashima , Yuichiro Takahara , Kazuya Kondo , Yusuke Shibahara , Hiroki Tamai , Haruki Takei , Tsuyoshi Oyaizu
IPC分类号： F21V21/00
CPC分类号： F21V19/0055 , F21K9/232 , F21V3/00 , F21V29/773 , F21V29/89 , F21Y2115/10 , H01L2224/48137
摘要： According to one embodiment, a light emitting device includes: a substrate a back face side of which is disposed on a mounting member; a plurality of light emitting elements mounted on a surface side of the substrate; and a power supply terminal provided on the surface side of the substrate and electrically connected to the light emitting elements. The power supply terminal is connected to electrical connecting units by elastic pressing force directed from the surface side of the substrate to the mounting member side. A mechanical fixing unit has a pressing portion brought into contact with the surface side of the substrate. The mechanical fixing units fix the substrate to the mounting member with use of elastic pressing force of the pressing portions directed from the surface side of the substrate to the mounting member side.
摘要翻译： 根据一个实施例，发光器件包括：衬底，其背面侧设置在安装构件上; 安装在所述基板的表面侧的多个发光元件; 以及设置在基板的表面侧并电连接到发光元件的电源端子。 电源端子通过从基板的表面侧引导到安装构件侧的弹性压力连接到电连接单元。 机械固定单元具有与基板的表面侧接触的按压部。 机械固定单元利用从基板的表面侧向安装部件侧引导的按压部的弹性压力将基板固定在安装部件上。
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公开(公告)号：US20110317416A1
公开(公告)日：2011-12-29
申请号：US13169814
申请日：2011-06-27
申请人： Tsuyoshi Oyaizu , Haruki Takei , Akiko Saito , Seiko Kawashima
发明人： Tsuyoshi Oyaizu , Haruki Takei , Akiko Saito , Seiko Kawashima
CPC分类号： H05B33/0806
摘要： According to one embodiment, a light-emitting module includes a module substrate, a first wiring pattern provided on the module substrate and including a common wire connecting portion, a second wiring pattern provided on the module substrate and including a first wire connecting portion, a second wire connecting portion, and a middle pattern portion, a first light-emitting element group arranged between the common wire connecting portion and the first wire connecting portion and including semiconductor light-emitting elements connected in series and being electrically connected to the common wire connecting portion and the first wire connecting portion, and a second light-emitting element group arranged between the common wire connecting portion and the second wire connecting portion and including semiconductor light-emitting elements connected in series and being electrically connected to the common wire connecting portion and the second wire connecting portion.
摘要翻译： 根据一个实施例，发光模块包括模块基板，设置在模块基板上的第一布线图案，并且包括公共布线连接部分，设置在模块基板上的第二布线图案，包括第一布线连接部分， 第二线连接部分和中间图案部分，布置在公共线连接部分和第一线连接部分之间的第一发光元件组，并且包括串联连接并电连接到公共线连接部的半导体发光元件 第一发光元件组和第二发光元件组，配置在公共电线连接部和第二电线连接部之间，并且包括串联连接并与公共电线连接部电连接的半导体发光元件， 第二线连接部。
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公开(公告)号：US08608340B2
公开(公告)日：2013-12-17
申请号：US13169814
申请日：2011-06-27
申请人： Tsuyoshi Oyaizu , Haruki Takei , Akiko Saito , Seiko Kawashima
发明人： Tsuyoshi Oyaizu , Haruki Takei , Akiko Saito , Seiko Kawashima
CPC分类号： H05B33/0806
摘要： According to one embodiment, a light-emitting module includes a module substrate, a first wiring pattern provided on the module substrate and including a common wire connecting portion, a second wiring pattern provided on the module substrate and including a first wire connecting portion, a second wire connecting portion, and a middle pattern portion, a first light-emitting element group arranged between the common wire connecting portion and the first wire connecting portion and including semiconductor light-emitting elements connected in series and being electrically connected to the common wire connecting portion and the first wire connecting portion, and a second light-emitting element group arranged between the common wire connecting portion and the second wire connecting portion and including semiconductor light-emitting elements connected in series and being electrically connected to the common wire connecting portion and the second wire connecting portion.
摘要翻译： 根据一个实施例，发光模块包括模块基板，设置在模块基板上的第一布线图案，并且包括公共布线连接部分，设置在模块基板上的第二布线图案，包括第一布线连接部分， 第二线连接部分和中间图案部分，布置在公共线连接部分和第一线连接部分之间的第一发光元件组，并且包括串联连接并电连接到公共线连接部的半导体发光元件 第一发光元件组和第二发光元件组，配置在公共线连接部和第二线连接部之间，并且包括串联连接并与公共线连接部电连接的半导体发光元件， 第二线连接部。
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