公开(公告)号：US20140218908A1

公开(公告)日：2014-08-07

申请号：US14235877

申请日：2011-07-29

申请人： Seiko Kawashima ,  Tsuyoshi Oyaizu ,  Hiroki Tamai ,  Yumiko Hayashida ,  Shuhei Matsuda ,  Soichi Shibusawa ,  Masahiro Ogata ,  Kozo Uemura ,  Kiyoshi Nishimura

发明人： Seiko Kawashima ,  Tsuyoshi Oyaizu ,  Hiroki Tamai ,  Yumiko Hayashida ,  Shuhei Matsuda ,  Soichi Shibusawa ,  Masahiro Ogata ,  Kozo Uemura ,  Kiyoshi Nishimura

IPC分类号： H01L33/54 ,  F21K99/00 ,  H01L33/50

CPC分类号： H01L33/54 ,  F21K9/27 ,  F21S8/031 ,  F21Y2103/10 ,  F21Y2115/10 ,  F21Y2115/30 ,  G02B19/0019 ,  G02B19/0066 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K3/284 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/1316 ,  H01L2924/00014

摘要： To improve an angular color difference and emit uniform illumination light. According to an embodiment, a light-emitting device in an embodiment includes a light-emitting module (15). The light-emitting module (15) includes a substrate (21), a plurality of light-emitting elements (45) made of semiconductor, and a plurality of sealing members (54). The light-emitting elements (45) are disposed on the substrate (21). The sealing members (54) contain, as a main component, translucent resin mixed with a phosphor. The sealing members (54) are heaped up from the bottom surfaces thereof bonded on the substrate (21) and are each formed to bury a singularity or a plurality of the light-emitting elements (45). A ratio (H/D) of a diameter D of the bottom surfaces to height H of the heaps of the sealing members (54) is set to 0.22 to 1.0.

摘要翻译： 改善角色差并发出均匀的照明光。 根据实施例，实施例中的发光装置包括发光模块（15）。 发光模块（15）包括基板（21），由半导体形成的多个发光元件（45）和多个密封构件（54）。 发光元件（45）设置在基板（21）上。 密封构件（54）含有与荧光体混合的半透明树脂作为主要成分。 密封构件（54）从结合在基板（21）上的底面堆积起来，并且分别形成为埋入奇点或多个发光元件（45）。 密封构件（54）的堆的底面的直径D与高度H的比（H / D）设定为0.22〜1.0。

公开(公告)号：US08641232B2

公开(公告)日：2014-02-04

申请号：US13162668

申请日：2011-06-17

申请人： Seiko Kawashima ,  Yuichiro Takahara ,  Kazuya Kondo ,  Yusuke Shibahara ,  Hiroki Tamai ,  Haruki Takei ,  Tsuyoshi Oyaizu

发明人： Seiko Kawashima ,  Yuichiro Takahara ,  Kazuya Kondo ,  Yusuke Shibahara ,  Hiroki Tamai ,  Haruki Takei ,  Tsuyoshi Oyaizu

IPC分类号： F21V21/00

CPC分类号： F21V19/0055 ,  F21K9/232 ,  F21V3/00 ,  F21V29/773 ,  F21V29/89 ,  F21Y2115/10 ,  H01L2224/48137

摘要： According to one embodiment, a light emitting device includes: a substrate a back face side of which is disposed on a mounting member; a plurality of light emitting elements mounted on a surface side of the substrate; and a power supply terminal provided on the surface side of the substrate and electrically connected to the light emitting elements. The power supply terminal is connected to electrical connecting units by elastic pressing force directed from the surface side of the substrate to the mounting member side. A mechanical fixing unit has a pressing portion brought into contact with the surface side of the substrate. The mechanical fixing units fix the substrate to the mounting member with use of elastic pressing force of the pressing portions directed from the surface side of the substrate to the mounting member side.

摘要翻译： 根据一个实施例，发光器件包括：衬底，其背面侧设置在安装构件上; 安装在所述基板的表面侧的多个发光元件; 以及设置在基板的表面侧并电连接到发光元件的电源端子。 电源端子通过从基板的表面侧引导到安装构件侧的弹性压力连接到电连接单元。 机械固定单元具有与基板的表面侧接触的按压部。 机械固定单元利用从基板的表面侧向安装部件侧引导的按压部的弹性压力将基板固定在安装部件上。

公开(公告)号：US20130135869A1

公开(公告)日：2013-05-30

申请号：US13592879

申请日：2012-08-23

申请人： Tsuyoshi OYAIZU

发明人： Tsuyoshi OYAIZU

IPC分类号： F21V15/01 ,  F21S4/00

CPC分类号： F21S8/031 ,  F21K9/27 ,  F21V23/026 ,  F21Y2103/10 ,  F21Y2103/33 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2924/00014

摘要： According to one embodiment, a luminaire includes an envelope including a light transmission section, a rectangular substrate provided in the envelope, and a pair of supporting sections. On one surface of the substrate, plural light-emitting elements are mounted side by side on a line shifted to one side in the width direction of the substrate from a center line extending along the longitudinal direction of the substrate. Electronic components are mounted in positions deviating to the other side in the width direction of the substrate from the line. The pair of supporting sections are provided on the inner surface of the envelope and support both the end sides of the substrate, which are along the longitudinal direction of the substrate.

摘要翻译： 根据一个实施例，照明装置包括一个封套，它包括一个透光部分，一个设置在封套中的矩形基板和一对支撑部分。 在基板的一个表面上，沿着沿着基板的纵向方向延伸的中心线，沿着基板宽度方向的一侧偏移的线并排安装多个发光元件。 电子部件安装在离开基板的宽度方向上偏离另一侧的位置。 一对支撑部设置在外壳的内表面上，并且支撑基板的沿着基板的长度方向的两端。

公开(公告)号：US20120305963A1

公开(公告)日：2012-12-06

申请号：US13414458

申请日：2012-03-07

申请人： Kozo UEMURA ,  Soichi Shibusawa ,  Yumiko Hayashida ,  Kiyoshi Nishimura ,  Seiko Kawashima ,  Tsuyoshi Oyaizu ,  Masahiro Ogata ,  Shuhei Matsuda ,  Hiroki Tamai

发明人： Kozo UEMURA ,  Soichi Shibusawa ,  Yumiko Hayashida ,  Kiyoshi Nishimura ,  Seiko Kawashima ,  Tsuyoshi Oyaizu ,  Masahiro Ogata ,  Shuhei Matsuda ,  Hiroki Tamai

IPC分类号： H01L33/60

CPC分类号： H05K3/284 ,  F21S8/04 ,  F21V19/0055 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0209 ,  H05K3/244 ,  H05K2201/0162 ,  H05K2201/099 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to one embodiment, a light-emitting device includes a substrate, a reflecting layer formed on the substrate, a light-emitting element placed on the reflecting layer, and a sealing resin layer that covers the reflecting layer and the light-emitting element. The oxygen permeability of the sealing resin layer is equal to or lower than 1200 cm3/(m2·day·atm), and the ratio of the area of the reflecting layer covered by the sealing resin layer to the entire area on the resin substrate covered by the sealing resin layer is between 30% and 75% inclusive.

摘要翻译： 根据一个实施例，发光装置包括基板，形成在基板上的反射层，放置在反射层上的发光元件和覆盖反射层和发光元件的密封树脂层。 密封树脂层的透氧度等于或低于1200cm3 /（m2·day·atm），并且覆盖在树脂基板上的密封树脂层覆盖的反射层的面积与覆盖的整个面积的比率 通过密封树脂层在30％和75％之间。

公开(公告)号：USD665519S1

公开(公告)日：2012-08-14

申请号：US29375176

申请日：2010-09-17

申请人： Tsuyoshi Oyaizu

设计人： Tsuyoshi Oyaizu

公开(公告)号：USD658602S1

公开(公告)日：2012-05-01

申请号：US29375124

申请日：2010-09-17

申请人： Kazuo Egawa ,  Yuichiro Takahara ,  Seiko Kawashima ,  Akiko Saito ,  Tsuyoshi Oyaizu ,  Takeshi Arimura

设计人： Kazuo Egawa ,  Yuichiro Takahara ,  Seiko Kawashima ,  Akiko Saito ,  Tsuyoshi Oyaizu ,  Takeshi Arimura

公开(公告)号：US20110317416A1

公开(公告)日：2011-12-29

申请号：US13169814

申请日：2011-06-27

申请人： Tsuyoshi Oyaizu ,  Haruki Takei ,  Akiko Saito ,  Seiko Kawashima

发明人： Tsuyoshi Oyaizu ,  Haruki Takei ,  Akiko Saito ,  Seiko Kawashima

IPC分类号： F21V7/00 ,  F21S4/00

CPC分类号： H05B33/0806

摘要： According to one embodiment, a light-emitting module includes a module substrate, a first wiring pattern provided on the module substrate and including a common wire connecting portion, a second wiring pattern provided on the module substrate and including a first wire connecting portion, a second wire connecting portion, and a middle pattern portion, a first light-emitting element group arranged between the common wire connecting portion and the first wire connecting portion and including semiconductor light-emitting elements connected in series and being electrically connected to the common wire connecting portion and the first wire connecting portion, and a second light-emitting element group arranged between the common wire connecting portion and the second wire connecting portion and including semiconductor light-emitting elements connected in series and being electrically connected to the common wire connecting portion and the second wire connecting portion.

摘要翻译： 根据一个实施例，发光模块包括模块基板，设置在模块基板上的第一布线图案，并且包括公共布线连接部分，设置在模块基板上的第二布线图案，包括第一布线连接部分， 第二线连接部分和中间图案部分，布置在公共线连接部分和第一线连接部分之间的第一发光元件组，并且包括串联连接并电连接到公共线连接部的半导体发光元件 第一发光元件组和第二发光元件组，配置在公共电线连接部和第二电线连接部之间，并且包括串联连接并与公共电线连接部电连接的半导体发光元件， 第二线连接部。

公开(公告)号：US20110310609A1

公开(公告)日：2011-12-22

申请号：US13162668

申请日：2011-06-17

申请人： Seiko KAWASHIMA ,  Yuichiro Takahara ,  Kazuya Kondo ,  Yusuke Shibahara ,  Hiroki Tamai ,  Haruki Takei ,  Tsuyoshi Oyaizu

发明人： Seiko KAWASHIMA ,  Yuichiro Takahara ,  Kazuya Kondo ,  Yusuke Shibahara ,  Hiroki Tamai ,  Haruki Takei ,  Tsuyoshi Oyaizu

IPC分类号： F21V21/00

CPC分类号： F21V19/0055 ,  F21K9/232 ,  F21V3/00 ,  F21V29/773 ,  F21V29/89 ,  F21Y2115/10 ,  H01L2224/48137

摘要： According to one embodiment, a light emitting device includes: a substrate a back face side of which is disposed on a mounting member; a plurality of light emitting elements mounted on a surface side of the substrate; and a power supply terminal provided on the surface side of the substrate and electrically connected to the light emitting elements. The power supply terminal is connected to electrical connecting units by elastic pressing force directed from the surface side of the substrate to the mounting member side. A mechanical fixing unit has a pressing portion brought into contact with the surface side of the substrate. The mechanical fixing units fix the substrate to the mounting member with use of elastic pressing force of the pressing portions directed from the surface side of the substrate to the mounting member side.

摘要翻译： 根据一个实施例，发光器件包括：衬底，其背面侧设置在安装构件上; 安装在所述基板的表面侧的多个发光元件; 以及设置在基板的表面侧并电连接到发光元件的电源端子。 电源端子通过从基板的表面侧引导到安装构件侧的弹性压力连接到电连接单元。 机械固定单元具有与基板的表面侧接触的按压部。 机械固定单元利用从基板的表面侧向安装部件侧引导的按压部的弹性压力将基板固定在安装部件上。

公开(公告)号：US20110156613A1

公开(公告)日：2011-06-30

申请号：US12973992

申请日：2010-12-21

申请人： Kiyoshi NISHIMURA ,  Tsuyoshi Oyaizu ,  Kozo Ogawa

发明人： Kiyoshi NISHIMURA ,  Tsuyoshi Oyaizu ,  Kozo Ogawa

IPC分类号： H05B37/02

CPC分类号： H01L25/0753 ,  F21K9/00 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/00014

摘要： According to one embodiment, a lighting apparatus includes a conductive main body at a ground potential, a light-emitting device in the main body, and a lighting control device configured to supply power to the light-emitting device. The light-emitting device includes a substrate including an insulation layer, and a radiation layer with a thermal conductivity, formed of conductive material and laminated on the insulation layer, a plurality of light-emitting elements mounted on the radiation layer, and a power supply wiring configured to electrically connect the light-emitting elements and to make the radiation layer electrically nonconductive.

摘要翻译： 根据一个实施例，照明装置包括接地电位的导电主体，主体中的发光装置和被配置为向发光装置供电的照明控制装置。 发光装置包括：基板，包括绝缘层和由导电材料形成并层压在绝缘层上的导热性辐射层，安装在辐射层上的多个发光元件和电源 布线被配置为电连接发光元件并使辐射层不导电。

公开(公告)号：US20100103680A1

公开(公告)日：2010-04-29

申请号：US12606211

申请日：2009-10-27

申请人： Tsuyoshi OYAIZU ,  Seiko Kawashima ,  Haruki Takei ,  Naoko Matsui

发明人： Tsuyoshi OYAIZU ,  Seiko Kawashima ,  Haruki Takei ,  Naoko Matsui

IPC分类号： F21V29/00 ,  F21V19/00 ,  F21V7/00

CPC分类号： F21V29/70 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0203 ,  H05K1/0274 ,  H05K1/053 ,  H05K2201/0195 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/1476 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting module includes a substrate, a wiring pattern, and a light-emitting device that generates heat. The substrate includes a metal base and an insulating base that is stacked on the metal base and has a mount surface on the opposite side of the metal base. The insulating base has a plurality of insulating layers stacked on one another. The wiring pattern is provided on the mount surface of the substrate. The light-emitting device is mounted on the mount surface of the substrate and is electrically connected to the wiring pattern.

摘要翻译： 发光模块包括基板，布线图案和产生热量的发光装置。 衬底包括金属基底和绝缘基底，该绝缘基底层堆叠在金属基底上并且在金属基底的相对侧具有安装表面。 绝缘基底具有彼此堆叠的多个绝缘层。 布线图案设置在基板的安装表面上。 发光装置安装在基板的安装表面上并与布线图形电连接。