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公开(公告)号：US5717986A
公开(公告)日：1998-02-10
申请号：US668759
申请日：1996-06-24
CPC分类号： G03G15/08 , G03G15/0803 , G03G2215/0651
摘要： A development system which includes a flexible donor belt having groups of electrode array near the surface of the belt is disclosed. The Electrode array has group areas in which perform the function of: Loading; Transferring; Developing; Transferring and Unloading. Each electrode array group area is independently addressable and operatively connected to voltage source in order to supply a voltage in the order of .quadrature.0-1000 volts AC or DC to each group area. The electrodes array group area picks up the toner from the magnetic brush. An electrode array group area connected to the voltage source via phase shifting circuitry such that a traveling wave pattern is established. The electrostatic field forming the traveling wave pattern pushes the charged toner particles about the surface of the donor belt from the magnetic brush to the photoconductive belt where they are transferred to the latent electrostatic images on the belt by an electrode group area which generates a toner cloud in the development zone. Thereafter, toner is moved by an electrode array group area where an electrode group area is bias to unload remaining toner off the belt.
摘要翻译： 公开了一种显影系统，其包括在带表面附近具有电极阵列组的柔性供体带。 电极阵列具有组合区域，其中执行以下功能：加载; 转让 发展; 转移和卸载 每个电极阵列组区域是可独立寻址的并且可操作地连接到电压源，以便向每个组区域提供大约为-1000伏交流或直流电压的电压。 电极阵列组区域从磁刷拾取调色剂。 电极阵列组区域，通过相移电路连接到电压源，使得建立行波模式。 形成行波图案的静电场将电荷调色剂颗粒从供电带的表面推压到感光带上，在这些带电调色剂颗粒通过产生调色剂云的电极组区域转移到带上的静电潜像上 在开发区。 此后，通过偏置电极组区域的电极阵列组区域移动调色剂，以将剩余的调色剂从带上卸下。
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公开(公告)号：US5893015A
公开(公告)日：1999-04-06
申请号：US670734
申请日：1996-06-24
CPC分类号： G03G15/08 , G03G2215/0651
摘要： An apparatus for transporting charged particles in a predetermine path which includes a donor member that is adapted to move charged particles on the surface thereof in the predetermined path. The donor member includes an electrode array on the outer surface thereof; the array including a plurality of spaced apart electrodes extending substantially across width of the surface of the donor member. A multi-phase DC voltage source is operatively coupled to the electrode array, the phase being shifted with respect to each other such as to create an electrodynamic wave pattern capable of moving charged particles on the surface thereof in the predetermined path.
摘要翻译： 一种用于在预定路径中传送带电粒子的装置，其包括适于在预定路径中在其表面上移动带电粒子的施主构件。 供体构件在其外表面上包括电极阵列; 所述阵列包括基本上横跨所述供体构件的表面的宽度延伸的多个间隔开的电极。 多相DC电压源可操作地耦合到电极阵列，该相位相对于彼此移动，以产生能够在预定路径中的带电粒子在其表面上移动的电动势波形图案。
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3.发明授权Advanced technique for packaging multiple number of electrically stackable high voltage transistors in one package 失效在一个封装中封装多个可电叠置的高压晶体管的先进技术
公开(公告)号：US5577617A
公开(公告)日：1996-11-26
申请号：US581385
申请日：1995-12-29
IPC分类号： H01L23/495 , B65D73/02
CPC分类号： H01L23/49575 , H01L2924/0002
摘要： High voltage circuitry often requires assembling an array of high voltage devices that are electrically isolated from one another. A lead frame that fits within conventional plastic packaging has been designed that will allow electrical isolation of the substrates of two or more transistors mounted together in a single package.
摘要翻译： 高电压电路通常需要组装彼此电隔离的高压器件阵列。 已经设计出适合传统塑料封装的引线框架，其将允许在单个封装中安装在一起的两个或多个晶体管的基板电隔离。
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4.发明授权Processes and packaging for high voltage integrated circuits, electronic devices, and circuits 失效高压集成电路，电子设备和电路的处理和封装公开(公告)号：US07709292B2
公开(公告)日：2010-05-04
申请号：US11541429
申请日：2006-09-29
IPC分类号： H01L21/02
CPC分类号： H01L21/78 , H01L21/561 , H01L21/6835 , H01L24/24 , H01L24/27 , H01L24/28 , H01L24/32 , H01L24/48 , H01L24/80 , H01L24/82 , H01L24/83 , H01L24/94 , H01L24/96 , H01L24/97 , H01L25/0655 , H01L25/50 , H01L2221/68322 , H01L2224/24137 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/484 , H01L2224/73265 , H01L2224/76155 , H01L2224/82102 , H01L2224/83101 , H01L2224/8385 , H01L2224/8592 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01014 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/18162 , H01L2924/19043 , H01L2224/82 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： The present invention includes processes and packaging for high voltage integrated circuits (ICs), high voltage electronic devices and high voltage electronic circuits which operate over a wide range of voltages, e.g., from tens of volts to tens of thousands of volts. The inventive processes and packaging are particularly suitable for integrating low or lower voltage circuits or transistors to form high voltage ICs, high voltage electronic devices and high voltage electronic circuits. The inventive processes and packaging are also particularly suitable for isolating high voltage electronics to achieve high breakdown voltages and for supporting high voltage operation. The inventive processes may be used with any suitable semiconductor materials using conventional semiconductor fabrication and related facilities.
摘要翻译： 本发明包括用于高电压集成电路（IC），高电压电子设备和高电压电子电路的工艺和封装，其在宽范围的电压范围内工作，例如几十伏到几万伏特。 本发明的工艺和封装特别适用于集成低压或低压电路或晶体管以形成高压IC，高压电子器件和高电压电子电路。 本发明的工艺和封装也特别适用于隔离高电压电子元件以实现高击穿电压并支持高压操作。 本发明的方法可以与使用常规半导体制造和相关设施的任何合适的半导体材料一起使用。
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公开(公告)号：US20090109716A1
公开(公告)日：2009-04-30
申请号：US11932364
申请日：2007-10-31
CPC分类号： H02M5/293 , Y10T29/49002
摘要： An exemplary embodiment of an apparatus for supplying and switching power may include a power source, a transformer, a full bridge rectifier and a control switch. The transformer has a first winding and a second winding, the first winding being connected to the power source, the second winding having a first tap and a second tap, with the first tap being connected to a first load output. The full bridge rectifier includes four nodes, the first being connected to the second tap of the second winding, the second being connected to a second load output, the third being connected to a reference voltage source. The control switch is connected between a fourth of the four nodes and the reference voltage source.
摘要翻译： 用于提供和切换电力的设备的示例性实施例可以包括电源，变压器，全桥整流器和控制开关。 变压器具有第一绕组和第二绕组，第一绕组连接到电源，第二绕组具有第一抽头和第二抽头，第一抽头连接到第一负载输出端。 全桥整流器包括四个节点，第一个连接到第二绕组的第二抽头，第二个连接到第二负载输出，第三个连接到参考电压源。 控制开关连接在四个节点的四分之一和参考电压源之间。
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公开(公告)号：US06516604B2
公开(公告)日：2003-02-11
申请号：US09819182
申请日：2001-03-27
IPC分类号： F03H500
CPC分类号： F03H1/0012 , B64G1/26 , B64G1/405 , F02K9/94
摘要： A micro-colloid thruster system may be fabricated using micro electromechanical system (MEMS) fabrication techniques. A beam of charged droplets may be extracted from an emitter tip in an emitter array by an extractor electrode and accelerated by an accelerator electrode to produce thrust. The micro-colloid thruster system may be used as the main propulsion system for microspacecraft and for precision maneuvers in larger spacecraft.
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7.发明授权Integrated RF switching cell built in CMOS technology and utilizing a high voltage integrated circuit diode with a charge injecting node 失效内置CMOS技术的集成射频开关单元，并利用具有电荷注入节点的高压集成电路二极管
公开(公告)号：US5786722A
公开(公告)日：1998-07-28
申请号：US746589
申请日：1996-11-12
IPC分类号： H01L27/092 , H01L21/8238 , H01L27/06 , H01L29/861 , H01L29/868
CPC分类号： H01L27/0629
摘要： An integrated CMOS diode with an injection ring that enables construction of an integrated CMOS RF switch. Construction techniques of using a diffused n-well resistor, parasitic capacitance and construction of the diode underneath a bonding input pad contribute to performance of the switch as well as saving space needed to construct the switch.
摘要翻译： 具有注入环的集成CMOS二极管，可构建集成的CMOS RF开关。 使用扩散的n阱电阻器，寄生电容和结合输入焊盘下面的二极管的构造的构造技术有助于开关的性能，并节省构建开关所需的空间。
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8.发明授权Method of packaging high voltage components with low voltage components in a small space 失效在小空间内用高压元件封装高压元件的方法
公开(公告)号：US5699231A
公开(公告)日：1997-12-16
申请号：US562615
申请日：1995-11-24
CPC分类号： H05K5/064 , H05K1/0256 , H05K1/0262 , H05K3/284 , H05K2201/09063 , H05K2201/09072 , H05K2201/10689
摘要： An electronic circuit package in which several high voltage components are packaged along with low voltage components using standard circuit boards and minimizing the space needed for the entire assembly. A miniature circuit board, constructed of standard circuit board material, is used to mount several electronic components, some of which require high voltages. To meet isolation requirements, requiring a dielectric strength more than that provided by the board itself, between the high and low voltage nodes the circuit board incorporates slots or other cut out shapes in the board. The slots or other cut out shapes provide two functions. The first use for the slots or other cut out shapes is to prevent charge migration on the surface of the board between high and low voltage nodes. This is accomplished by placing the slots or other cut out shapes between high and low voltage nodes. The circuit board is then encapsulated within a potting material. The slots or other cut out shapes perform a second function of allowing the potting material to flow around and through the board to facilitate full encapsulation of the board and the electronic devices on the board. Several of the slots or other cut out shapes are placed in the board directly underneath the electronic devices mounted on the board to aid in allowing the potting material to completely surround and encapsulate the electronic devices.
摘要翻译： 一种电子电路封装，其中使用标准电路板将几个高压部件与低电压部件一起封装，并使整个组件所需的空间最小化。 由标准电路板材料构成的小型电路板用于安装几个电子部件，其中一些需要高电压。 为了满足隔离要求，要求绝缘强度大于电路板本身提供的绝缘强度，在高压节点和低电压节点之间，电路板在板中集成了槽或其他切割形状。 槽或其他切割形状提供两个功能。 插槽或其他切割形状的第一个用途是防止电池在高压节点和低压节点之间的表面上的电荷迁移。 这通过在高电压节点和低电压节点之间放置槽或其他切割形状来实现。 然后将电路板封装在灌封材料内。 槽或其他切割形状执行允许灌封材料绕过板并流过板的第二功能，以便板和板上的电子器件完全封装。 几个槽或其他切割形状被放置在板上直接位于安装在板上的电子装置下面，以帮助灌封材料完全包围和封装电子装置。
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9.发明授权Low profile interconnect for a segmented electrode donor roll and a commutator 失效用于分段电极供体辊和换向器的薄型互连
公开(公告)号：US5693912A
公开(公告)日：1997-12-02
申请号：US673874
申请日：1996-07-02
申请人： Paul C. Tien , Sousanna Kardashian , Mohammad M. Mojarradi , Tuan A. Vo , Charles E. Morand , Charles C. Currie
发明人： Paul C. Tien , Sousanna Kardashian , Mohammad M. Mojarradi , Tuan A. Vo , Charles E. Morand , Charles C. Currie
CPC分类号： G03G15/0818 , G03G2215/0651
摘要： A low profile interconnect is used for electronic connections to segmented electrode donor rolls in which at least 78 interconnections between the segmented donor roll and a commutator can be made with a profile of approximately 10-15 mils, which retains reliability in an approximately 600 rpm rotational environment and which withstands 2000 volts between adjacent lines.
摘要翻译： 薄型互连用于与分段电极供体辊的电子连接，其中分段施主辊和换向器之间的至少78个互连可以制成具有大约10-15密耳的轮廓，其保持约600rpm旋转的可靠性 在相邻线路之间承受2000伏特的环境。
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公开(公告)号：US20140117949A1
公开(公告)日：2014-05-01
申请号：US14062861
申请日：2013-10-24
IPC分类号： G05F1/455
CPC分类号： G05F1/455 , H02M5/293 , H02M2001/008
摘要： A dimming power supply includes a power source, a transformer, a full bridge rectifier and a control switch.
摘要翻译： 调光电源包括电源，变压器，全桥整流器和控制开关。
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