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公开(公告)号：US06516604B2
公开(公告)日：2003-02-11
申请号：US09819182
申请日：2001-03-27
IPC分类号： F03H500
CPC分类号： F03H1/0012 , B64G1/26 , B64G1/405 , F02K9/94
摘要： A micro-colloid thruster system may be fabricated using micro electromechanical system (MEMS) fabrication techniques. A beam of charged droplets may be extracted from an emitter tip in an emitter array by an extractor electrode and accelerated by an accelerator electrode to produce thrust. The micro-colloid thruster system may be used as the main propulsion system for microspacecraft and for precision maneuvers in larger spacecraft.
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2.发明授权Processes and packaging for high voltage integrated circuits, electronic devices, and circuits 失效高压集成电路，电子设备和电路的处理和封装公开(公告)号：US07709292B2
公开(公告)日：2010-05-04
申请号：US11541429
申请日：2006-09-29
IPC分类号： H01L21/02
CPC分类号： H01L21/78 , H01L21/561 , H01L21/6835 , H01L24/24 , H01L24/27 , H01L24/28 , H01L24/32 , H01L24/48 , H01L24/80 , H01L24/82 , H01L24/83 , H01L24/94 , H01L24/96 , H01L24/97 , H01L25/0655 , H01L25/50 , H01L2221/68322 , H01L2224/24137 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/484 , H01L2224/73265 , H01L2224/76155 , H01L2224/82102 , H01L2224/83101 , H01L2224/8385 , H01L2224/8592 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01014 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/18162 , H01L2924/19043 , H01L2224/82 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： The present invention includes processes and packaging for high voltage integrated circuits (ICs), high voltage electronic devices and high voltage electronic circuits which operate over a wide range of voltages, e.g., from tens of volts to tens of thousands of volts. The inventive processes and packaging are particularly suitable for integrating low or lower voltage circuits or transistors to form high voltage ICs, high voltage electronic devices and high voltage electronic circuits. The inventive processes and packaging are also particularly suitable for isolating high voltage electronics to achieve high breakdown voltages and for supporting high voltage operation. The inventive processes may be used with any suitable semiconductor materials using conventional semiconductor fabrication and related facilities.
摘要翻译： 本发明包括用于高电压集成电路（IC），高电压电子设备和高电压电子电路的工艺和封装，其在宽范围的电压范围内工作，例如几十伏到几万伏特。 本发明的工艺和封装特别适用于集成低压或低压电路或晶体管以形成高压IC，高压电子器件和高电压电子电路。 本发明的工艺和封装也特别适用于隔离高电压电子元件以实现高击穿电压并支持高压操作。 本发明的方法可以与使用常规半导体制造和相关设施的任何合适的半导体材料一起使用。
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公开(公告)号：US20090109716A1
公开(公告)日：2009-04-30
申请号：US11932364
申请日：2007-10-31
CPC分类号： H02M5/293 , Y10T29/49002
摘要： An exemplary embodiment of an apparatus for supplying and switching power may include a power source, a transformer, a full bridge rectifier and a control switch. The transformer has a first winding and a second winding, the first winding being connected to the power source, the second winding having a first tap and a second tap, with the first tap being connected to a first load output. The full bridge rectifier includes four nodes, the first being connected to the second tap of the second winding, the second being connected to a second load output, the third being connected to a reference voltage source. The control switch is connected between a fourth of the four nodes and the reference voltage source.
摘要翻译： 用于提供和切换电力的设备的示例性实施例可以包括电源，变压器，全桥整流器和控制开关。 变压器具有第一绕组和第二绕组，第一绕组连接到电源，第二绕组具有第一抽头和第二抽头，第一抽头连接到第一负载输出端。 全桥整流器包括四个节点，第一个连接到第二绕组的第二抽头，第二个连接到第二负载输出，第三个连接到参考电压源。 控制开关连接在四个节点的四分之一和参考电压源之间。
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4.发明授权Integrated RF switching cell built in CMOS technology and utilizing a high voltage integrated circuit diode with a charge injecting node 失效内置CMOS技术的集成射频开关单元，并利用具有电荷注入节点的高压集成电路二极管
公开(公告)号：US5786722A
公开(公告)日：1998-07-28
申请号：US746589
申请日：1996-11-12
IPC分类号： H01L27/092 , H01L21/8238 , H01L27/06 , H01L29/861 , H01L29/868
CPC分类号： H01L27/0629
摘要： An integrated CMOS diode with an injection ring that enables construction of an integrated CMOS RF switch. Construction techniques of using a diffused n-well resistor, parasitic capacitance and construction of the diode underneath a bonding input pad contribute to performance of the switch as well as saving space needed to construct the switch.
摘要翻译： 具有注入环的集成CMOS二极管，可构建集成的CMOS RF开关。 使用扩散的n阱电阻器，寄生电容和结合输入焊盘下面的二极管的构造的构造技术有助于开关的性能，并节省构建开关所需的空间。
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5.发明授权Method of packaging high voltage components with low voltage components in a small space 失效在小空间内用高压元件封装高压元件的方法
公开(公告)号：US5699231A
公开(公告)日：1997-12-16
申请号：US562615
申请日：1995-11-24
CPC分类号： H05K5/064 , H05K1/0256 , H05K1/0262 , H05K3/284 , H05K2201/09063 , H05K2201/09072 , H05K2201/10689
摘要： An electronic circuit package in which several high voltage components are packaged along with low voltage components using standard circuit boards and minimizing the space needed for the entire assembly. A miniature circuit board, constructed of standard circuit board material, is used to mount several electronic components, some of which require high voltages. To meet isolation requirements, requiring a dielectric strength more than that provided by the board itself, between the high and low voltage nodes the circuit board incorporates slots or other cut out shapes in the board. The slots or other cut out shapes provide two functions. The first use for the slots or other cut out shapes is to prevent charge migration on the surface of the board between high and low voltage nodes. This is accomplished by placing the slots or other cut out shapes between high and low voltage nodes. The circuit board is then encapsulated within a potting material. The slots or other cut out shapes perform a second function of allowing the potting material to flow around and through the board to facilitate full encapsulation of the board and the electronic devices on the board. Several of the slots or other cut out shapes are placed in the board directly underneath the electronic devices mounted on the board to aid in allowing the potting material to completely surround and encapsulate the electronic devices.
摘要翻译： 一种电子电路封装，其中使用标准电路板将几个高压部件与低电压部件一起封装，并使整个组件所需的空间最小化。 由标准电路板材料构成的小型电路板用于安装几个电子部件，其中一些需要高电压。 为了满足隔离要求，要求绝缘强度大于电路板本身提供的绝缘强度，在高压节点和低电压节点之间，电路板在板中集成了槽或其他切割形状。 槽或其他切割形状提供两个功能。 插槽或其他切割形状的第一个用途是防止电池在高压节点和低压节点之间的表面上的电荷迁移。 这通过在高电压节点和低电压节点之间放置槽或其他切割形状来实现。 然后将电路板封装在灌封材料内。 槽或其他切割形状执行允许灌封材料绕过板并流过板的第二功能，以便板和板上的电子器件完全封装。 几个槽或其他切割形状被放置在板上直接位于安装在板上的电子装置下面，以帮助灌封材料完全包围和封装电子装置。
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6.发明授权Low profile interconnect for a segmented electrode donor roll and a commutator 失效用于分段电极供体辊和换向器的薄型互连
公开(公告)号：US5693912A
公开(公告)日：1997-12-02
申请号：US673874
申请日：1996-07-02
申请人： Paul C. Tien , Sousanna Kardashian , Mohammad M. Mojarradi , Tuan A. Vo , Charles E. Morand , Charles C. Currie
发明人： Paul C. Tien , Sousanna Kardashian , Mohammad M. Mojarradi , Tuan A. Vo , Charles E. Morand , Charles C. Currie
CPC分类号： G03G15/0818 , G03G2215/0651
摘要： A low profile interconnect is used for electronic connections to segmented electrode donor rolls in which at least 78 interconnections between the segmented donor roll and a commutator can be made with a profile of approximately 10-15 mils, which retains reliability in an approximately 600 rpm rotational environment and which withstands 2000 volts between adjacent lines.
摘要翻译： 薄型互连用于与分段电极供体辊的电子连接，其中分段施主辊和换向器之间的至少78个互连可以制成具有大约10-15密耳的轮廓，其保持约600rpm旋转的可靠性 在相邻线路之间承受2000伏特的环境。
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公开(公告)号：US20140117949A1
公开(公告)日：2014-05-01
申请号：US14062861
申请日：2013-10-24
IPC分类号： G05F1/455
CPC分类号： G05F1/455 , H02M5/293 , H02M2001/008
摘要： A dimming power supply includes a power source, a transformer, a full bridge rectifier and a control switch.
摘要翻译： 调光电源包括电源，变压器，全桥整流器和控制开关。
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公开(公告)号：US08446741B1
公开(公告)日：2013-05-21
申请号：US13190261
申请日：2011-07-25
IPC分类号： H02M5/27
CPC分类号： H02M3/335 , H02M3/33561 , H02M7/12
摘要： A power supply includes a power source having at least one power source output, and a plurality of drivers connected to the at least one power source output. At least one of the plurality of drivers includes a bridge network having a first switch, a second switch and a bridge network output. The first switch is connected between the at least one power source output and the bridge network output. The second switch is connected between the bridge network output and a ground. The bridge network further includes at least one control input connected to the second switch. The bridge network is adapted to change a state of the first switch based on a state of the second switch.
摘要翻译： 电源包括具有至少一个电源输出的电源和连接到所述至少一个电源输出的多个驱动器。 多个驱动器中的至少一个包括具有第一开关，第二开关和桥接网络输出的桥接网络。 第一开关连接在至少一个电源输出端和桥接网络输出端之间。 第二个开关连接在桥网输出和地之间。 桥接网络还包括连接到第二交换机的至少一个控制输入。 桥接网络适于基于第二交换机的状态来改变第一交换机的状态。
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公开(公告)号：US08193995B2
公开(公告)日：2012-06-05
申请号：US12468253
申请日：2009-05-19
IPC分类号： H01Q13/10
CPC分类号： H01Q13/10 , H01Q1/40 , H01Q21/064
摘要： In one embodiment, a slot array antenna comprising a quartz layer and a silicon layer, wherein the quartz and silicon layers are matched to suppress microwave modes, and a metal layer adjacent to the silicon layer comprising offset cuts.
摘要翻译： 在一个实施例中，包括石英层和硅层的缝隙阵列天线，其中石英和硅层匹配以抑制微波模式，以及与硅层相邻的金属层包括偏移切割。
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公开(公告)号：US08010591B2
公开(公告)日：2011-08-30
申请号：US11804893
申请日：2007-05-21
申请人： Mohammad M. Mojarradi , Benjamin Blalock , Sorin Cristoloveanu , Suheng Chen , Kerem Akarvardar
发明人： Mohammad M. Mojarradi , Benjamin Blalock , Sorin Cristoloveanu , Suheng Chen , Kerem Akarvardar
IPC分类号： G06E3/00
CPC分类号： G06G7/16
摘要： A differential output analog multiplier circuit utilizing four G4-FETs, each source connected to a current source. The four G4-FETs may be grouped into two pairs of two G4-FETs each, where one pair has its drains connected to a load, and the other par has its drains connected to another load. The differential output voltage is taken at the two loads. In one embodiment, for each G4-FET, the first and second junction gates are each connected together, where a first input voltage is applied to the front gates of each pair, and a second input voltage is applied to the first junction gates of each pair. Other embodiments are described and claimed.
摘要翻译： 使用四个G4-FET的差分输出模拟乘法器电路，每个源极连接到电流源。 四个G4-FET可以分成两对，每对两个G4-FET，其中一对具有连接到负载的漏极，另一对的漏极连接到另一个负载。 差分输出电压在两个负载下进行。 在一个实施例中，对于每个G4-FET，第一和第二结门各自连接在一起，其中第一输入电压施加到每对的前门，并且第二输入电压施加到每个的第一结门 对。 描述和要求保护其他实施例。
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