公开(公告)号：US20070031700A1

公开(公告)日：2007-02-08

申请号：US11462038

申请日：2006-08-02

申请人： Tzung-Fang Guo ,  Fuh-Shun Yang ,  Ten-Chin Wen ,  Yaw-Shyan Fu ,  Ruey-Min Chen ,  Chia-Tin Chung ,  Chin-In Wu

发明人： Tzung-Fang Guo ,  Fuh-Shun Yang ,  Ten-Chin Wen ,  Yaw-Shyan Fu ,  Ruey-Min Chen ,  Chia-Tin Chung ,  Chin-In Wu

IPC分类号： H01L51/54 ,  H05B33/12

CPC分类号： H01L51/5092 ,  H01L51/0037 ,  H01L51/0038 ,  H01L51/004

摘要： An organic light emitting diode (OLED) includes a substrate, a first electrode layer, an organic emitting layer, a second electrode layer, and an electron injection layer, in which the electron injection layer is selected from an electron injection layer made from organic molecules, an electron injection layer with nano-grade thickness, or an electron injection layer having dipole moment organic molecules with nano-grade thickness. By utilizing the conformation of the electron injection layer, an OLED having stable operation can be achieved.

摘要翻译： 有机发光二极管（OLED）包括基板，第一电极层，有机发光层，第二电极层和电子注入层，其中电子注入层选自由有机分子制成的电子注入层 ，具有纳米级厚度的电子注入层，或具有纳米级厚度的偶极矩有机分子的电子注入层。 通过利用电子注入层的构象，可以实现具有稳定操作的OLED。

公开(公告)号：US07053546B2

公开(公告)日：2006-05-30

申请号：US10633666

申请日：2003-08-04

申请人： Chen-Ze Hu ,  Chia-Tin Chung ,  Ruey-Min Chen ,  Yao-Hui Lee

发明人： Chen-Ze Hu ,  Chia-Tin Chung ,  Ruey-Min Chen ,  Yao-Hui Lee

IPC分类号： H01L51/50 ,  H05B33/00

CPC分类号： C23C16/30 ,  H01L51/0097 ,  H01L51/5253 ,  H01L2251/5338 ,  Y02E10/549

摘要： A plastic substrate for OLED, fabrication method thereof and device using the substrate. The OLED comprises a plastic substrate with a deposition film of predetermined thickness formed thereon by plasma CVD. The deposition film has the formula SiOeCaHbXcYdZf (e≦2, 2−e=a+b+c+d+f), wherein X, Y and Z are periodic table IA, IIA, IIIA, IVA, VA, VIA or VIIA elements excepting H. X, Y and Z also can be selected from the group consisting of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Pd, Ag, Pt and Au. The OLED with the plastic substrate has both glass and plastic properties, including high temperature tolerance, good gas and liquid resistance, superior planarity, and high transparency and high flexibility.

摘要翻译： 一种用于OLED的塑料基板，其制造方法和使用该基板的装置。 OLED包括通过等离子体CVD在其上形成有预定厚度的沉积膜的塑料基板。 沉积膜具有以下分子式：SiO 2 C 1 H 2 C （e <= 2，2-e = a + b + c + d + f）其中X，Y和Z是周期表IA，IIA，IIIA，IVA，VA， 除了H. X，Y和Z之外的VIA或VIIA元素也可以选自Sc，Ti，V，Cr，Mn，Fe，Co，Ni，Cu，Zn，Pd，Ag，Pt和Au。 具有塑料基板的OLED具有玻璃和塑料性能，包括耐高温，气体和液体阻力好，平面性优异，透明度高，灵活性高。

公开(公告)号：US09029883B2

公开(公告)日：2015-05-12

申请号：US13180298

申请日：2011-07-11

申请人： Chia-Tin Chung

发明人： Chia-Tin Chung

IPC分类号： H01L33/00 ,  F21K99/00 ,  H01L25/075 ,  H01L33/64

CPC分类号： F21K9/00 ,  H01L25/0753 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0075 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package structure with concave area for positioning heat-conducting substance includes a substrate unit, a heat-conducting adhesive unit, a light-emitting unit, a conductive unit and a package unit. The substrate unit has a substrate body, a concave space formed on the substrate body, and a plurality of positive and negative pads exposed on the substrate body. The heat-conducting adhesive unit has a heat-conducting adhesive layer positioned in the concave space. The light-emitting unit has a plurality of LED chips disposed on the heat-conducting adhesive layer and received in the concave space. The conductive unit has a plurality of wires. Each LED chip is electrically connected between each positive pad and each negative pad. The package unit has a translucent package resin body disposed on the substrate body in order to cover the LED chips and the wires.

摘要翻译： 具有用于定位导热物质的凹面积的LED封装结构包括基板单元，导热粘合单元，发光单元，导电单元和封装单元。 基板单元具有基板主体，形成在基板主体上的凹形空间，以及暴露在基板主体上的多个正极和负极焊盘。 导热粘合单元具有定位在凹形空间中的导热粘合剂层。 发光单元具有设置在导热粘合剂层上并被容纳在凹形空间中的多个LED芯片。 导电单元具有多根导线。 每个LED芯片电连接在每个正极焊盘和每个负焊盘之间。 封装单元具有设置在基板主体上的半透明封装树脂体，以覆盖LED芯片和电线。

公开(公告)号：US08749164B2

公开(公告)日：2014-06-10

申请号：US13242735

申请日：2011-09-23

申请人： Chia-Tin Chung ,  Shih-Neng Tai

发明人： Chia-Tin Chung ,  Shih-Neng Tai

IPC分类号： G05F1/00

CPC分类号： H05B33/0824

摘要： An illuminating apparatus is disclosed. The illuminating apparatus includes a detecting unit, an illuminating unit, and a control unit. The illuminating unit includes multiple illuminating sets and a switching unit for adjusting a connection relationship among the illuminating sets. The detecting unit is for detecting an inputted power supply received by the illuminating unit while the control unit is coupled to the detecting unit and the switching unit. The control unit based on a detected inputted power supply controls the switching unit according to a predetermined setting parameter, so as to ensure a conducting voltage of the illuminating unit to vary according to a variation in the inputted power supply.

摘要翻译： 公开了一种照明装置。 照明装置包括检测单元，照明单元和控制单元。 照明单元包括多个照明组和用于调节照明组之间的连接关系的切换单元。 检测单元用于在控制单元耦合到检测单元和切换单元时检测由照明单元接收的输入电源。 基于检测到的输入电源的控制单元根据预定的设定参数来控制切换单元，以确保照明单元的导通电压根据输入电源的变化而变化。

公开(公告)号：US08421373B2

公开(公告)日：2013-04-16

申请号：US13069276

申请日：2011-03-22

申请人： Chia-Tin Chung ,  Shih-Neng Dai ,  Chao-Chin Wu

发明人： Chia-Tin Chung ,  Shih-Neng Dai ,  Chao-Chin Wu

IPC分类号： H05B37/02

CPC分类号： H05B33/0827 ,  F21K9/00 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/50 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-mixing multichip package structure includes a substrate unit, a light-emitting unit, a frame unit, and a package unit. The light-emitting unit includes at least one first light-emitting module with red light-emitting chips and at least one second light-emitting module with blue light-emitting chips. The frame unit includes at least one first continuous colloid frame and at least one second continuous colloid frame respectively surrounding the first light-emitting module and the second light-emitting module. The package unit includes a transparent colloid body and a phosphor colloid body respectively covering the first light-emitting module and the second light-emitting module. Hence, when the red light source generated by matching the red light-emitting chips and the transparent colloid body and the white light source generated by matching the blue light-emitting chips and the phosphor colloid body are mixed with each other, the CRI of the light-mixing multichip package structure can be increased.

摘要翻译： 光混合多芯片封装结构包括基板单元，发光单元，框架单元和封装单元。 发光单元包括具有红色发光芯片的至少一个第一发光模块和具有蓝色发光芯片的至少一个第二发光模块。 框架单元包括分别围绕第一发光模块和第二发光模块的至少一个第一连续胶体框架和至少一个第二连续胶体框架。 封装单元包括分别覆盖第一发光模块和第二发光模块的透明胶体和荧光体胶体。 因此，当通过使红色发光芯片和透明胶体体匹配的红色光源与通过匹配蓝色发光芯片和荧光体胶体而产生的白色光源相互混合时，CRI 可以增加光混合多芯片封装结构。

公开(公告)号：US08415701B2

公开(公告)日：2013-04-09

申请号：US13160679

申请日：2011-06-15

申请人： Chia-Tin Chung ,  Chao-Chin Wu ,  Fang-Kuei Wu

发明人： Chia-Tin Chung ,  Chao-Chin Wu ,  Fang-Kuei Wu

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An LED package structure for increasing light-emitting efficiency and controlling light-projecting angle includes a substrate unit, a light-emitting unit, a light-reflecting unit and a package unit. The substrate unit has a substrate body and a chip-placing area disposed on a top surface of the substrate body. The light-emitting unit has a plurality of LED chips electrically disposed on the chip-placing area. The light-reflecting unit has an annular reflecting resin body surroundingly formed on the top surface of the substrate body by coating. The annular reflecting resin body surrounds the LED chips that are disposed on the chip-placing area to form a resin position limiting space above the chip-placing area. The package unit has a translucent package resin body disposed on the top surface of the substrate body in order to cover the LED chips. The position of the translucent package resin body is limited in the resin position limiting space.

摘要翻译： 用于提高发光效率和控制投光角度的LED封装结构包括基板单元，发光单元，光反射单元和封装单元。 基板单元具有设置在基板主体的上表面上的基板主体和芯片放置区域。 发光单元具有多个LED芯片，电芯设置在芯片放置区域上。 光反射单元具有通过涂覆在基板主体的上表面上周围形成的环状的反射树脂体。 环状反射树脂体围绕设置在芯片放置区域上的LED芯片，以在芯片放置区域上方形成树脂位置限制空间。 封装单元具有设置在基板主体的顶表面上的半透明封装树脂体，以覆盖LED芯片。 半透明封装树脂体的位置限制在树脂位置限制空间中。

公开(公告)号：US08008099B2

公开(公告)日：2011-08-30

申请号：US12558492

申请日：2009-09-12

申请人： Chia-Tin Chung

发明人： Chia-Tin Chung

IPC分类号： H01L21/00

CPC分类号： F21K9/00 ,  H01L25/0753 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0075 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package structure with concave area for positioning heat-conducting substance includes a substrate unit, a heat-conducting adhesive unit, a light-emitting unit, a conductive unit and a package unit. The substrate unit has a substrate body, a concave space formed on the substrate body, and a plurality of positive and negative pads exposed on the substrate body. The heat-conducting adhesive unit has a heat-conducting adhesive layer positioned in the concave space. The light-emitting unit has a plurality of LED chips disposed on the heat-conducting adhesive layer and received in the concave space. The conductive unit has a plurality of wires. Each LED chip is electrically connected between each positive pad and each negative pad. The package unit has a translucent package resin body disposed on the substrate body in order to cover the LED chips and the wires.

摘要翻译： 具有用于定位导热物质的凹面积的LED封装结构包括基板单元，导热粘合单元，发光单元，导电单元和封装单元。 基板单元具有基板主体，形成在基板主体上的凹形空间，以及暴露在基板主体上的多个正极和负极焊盘。 导热粘合单元具有定位在凹形空间中的导热粘合剂层。 发光单元具有设置在导热粘合剂层上并被容纳在凹形空间中的多个LED芯片。 导电单元具有多根导线。 每个LED芯片电连接在每个正极焊盘和每个负焊盘之间。 封装单元具有设置在基板主体上的半透明封装树脂体，以覆盖LED芯片和电线。

公开(公告)号：US20110050071A1

公开(公告)日：2011-03-03

申请号：US12591378

申请日：2009-11-18

申请人： Chia-Tin Chung ,  Fang-Kuei Wu ,  Shen-Ta Yang

发明人： Chia-Tin Chung ,  Fang-Kuei Wu ,  Shen-Ta Yang

IPC分类号： H01J61/52 ,  F21K2/08 ,  H01J1/62 ,  H01K1/26

CPC分类号： H05K3/284 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A quasioptical LED package structure for increasing color render index and brightness includes a substrate unit, a light-emitting unit, a frame unit and a package unit. The light-emitting unit has a first light-emitting module for generating a first color temperature and a second light-emitting module for generating a second color temperature. The frame unit has two annular resin frames surroundingly formed on the top surface of the substrate unit by coating. The two annular resin frames respectively surround the first light-emitting module and the second light-emitting module in order to form two resin position limiting spaces above the substrate unit. The package unit has a first translucent package resin body and a second translucent package resin body both disposed on the substrate unit and respective covering the first light-emitting module and the second light-emitting module.

摘要翻译： 用于增加彩色渲染指数和亮度的准激光LED封装结构包括基板单元，发光单元，框架单元和封装单元。 发光单元具有用于产生第一色温的第一发光模块和用于产生第二色温的第二发光模块。 框架单元具有通过涂覆在基板单元的顶表面周围形成的两个环形树脂框架。 两个环形树脂框架分别围绕第一发光模块和第二发光模块，以在基板单元上方形成两个树脂位置限制空间。 封装单元具有第一半透明封装树脂体和第二半透明封装树脂体，两者均设置在基板单元上，并且分别覆盖第一发光模块和第二发光模块。

公开(公告)号：US20110001152A1

公开(公告)日：2011-01-06

申请号：US12557462

申请日：2009-09-10

申请人： Chia-Tin Chung ,  Fang-Kuei Wu

发明人： Chia-Tin Chung ,  Fang-Kuei Wu

IPC分类号： H01L33/00 ,  H01L21/56

CPC分类号： F21V31/04 ,  F21K9/00 ,  H01L23/24 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K1/0203 ,  H05K3/284 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An LED package structure includes a substrate unit, a light-emitting unit, a light-reflecting unit and a convex package unit. The substrate unit has a substrate body and a chip-placing area. The light-emitting unit has a plurality of LED chips electrically disposed on the chip-placing area. The light-reflecting unit has an annular reflecting resin body surroundingly formed on the substrate body by coating. The annular reflecting resin body surrounds the LED chips that are disposed on the chip-placing area to form a resin position limiting space above the chip-placing area, and the annular reflecting resin body has an inner surface that has been cleaned by plasma to form a clean surface. The convex package unit has a convex package resin body disposed on the substrate body in order to cover the LED chips. The position of the convex package resin body is limited in the resin position limiting space.

摘要翻译： LED封装结构包括基板单元，发光单元，光反射单元和凸包单元。 基板单元具有基板主体和芯片放置区域。 发光单元具有多个LED芯片，电芯设置在芯片放置区域上。 光反射单元具有通过涂布在基板主体上周围形成的环状的反射树脂体。 环状反射树脂体围绕设置在芯片放置区域上的LED芯片，以在芯片放置区域之上形成树脂位置限制空间，并且环形反射树脂体具有已经被等离子体清洁的内表面 一个干净的表面。 凸包装单元具有设置在基板主体上以覆盖LED芯片的凸包装树脂体。 凸包装树脂体的位置限制在树脂位置限制空间中。

公开(公告)号：US20050269957A1

公开(公告)日：2005-12-08

申请号：US11056303

申请日：2005-02-11

申请人： Hong-Ru Guo ,  Keng-Chu Lin ,  Chen-Chung Yang ,  Chia-Tin Chung

发明人： Hong-Ru Guo ,  Keng-Chu Lin ,  Chen-Chung Yang ,  Chia-Tin Chung

IPC分类号： G09G3/10

CPC分类号： G09G3/3233 ,  G09G3/3291 ,  G09G2320/0233

摘要： A driving circuit of a pixel of an active organic electro-luminescence device for driving an emitting device in the pixel of the active organic electro-luminescence device is provided. A voltage sensor is adapted for sensing the voltage of the emitting device and sending out the signal according to the voltage. A compensation unit is adapted for receiving the signal output from the voltage sensor. A compensating signal is sent to an emitting device driving unit for compensating the data signal input into the pixel of active organic electro-luminescence device so as to improve uniformity in the brightness of the active organic electro-luminescence device.

摘要翻译： 提供了用于驱动有源有机电致发光器件的像素中的发光器件的有源有机电致发光器件的像素的驱动电路。 电压传感器适于感测发射装置的电压并根据电压发出信号。 补偿单元适于接收从电压传感器输出的信号。 补偿信号被发送到发射器件驱动单元，用于补偿输入到有源有机电致发光器件的像素中的数据信号，以便改善有源有机电致发光器件的亮度的均匀性。