公开(公告)号：US08421373B2

公开(公告)日：2013-04-16

申请号：US13069276

申请日：2011-03-22

申请人： Chia-Tin Chung ,  Shih-Neng Dai ,  Chao-Chin Wu

发明人： Chia-Tin Chung ,  Shih-Neng Dai ,  Chao-Chin Wu

IPC分类号： H05B37/02

CPC分类号： H05B33/0827 ,  F21K9/00 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/50 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-mixing multichip package structure includes a substrate unit, a light-emitting unit, a frame unit, and a package unit. The light-emitting unit includes at least one first light-emitting module with red light-emitting chips and at least one second light-emitting module with blue light-emitting chips. The frame unit includes at least one first continuous colloid frame and at least one second continuous colloid frame respectively surrounding the first light-emitting module and the second light-emitting module. The package unit includes a transparent colloid body and a phosphor colloid body respectively covering the first light-emitting module and the second light-emitting module. Hence, when the red light source generated by matching the red light-emitting chips and the transparent colloid body and the white light source generated by matching the blue light-emitting chips and the phosphor colloid body are mixed with each other, the CRI of the light-mixing multichip package structure can be increased.

摘要翻译： 光混合多芯片封装结构包括基板单元，发光单元，框架单元和封装单元。 发光单元包括具有红色发光芯片的至少一个第一发光模块和具有蓝色发光芯片的至少一个第二发光模块。 框架单元包括分别围绕第一发光模块和第二发光模块的至少一个第一连续胶体框架和至少一个第二连续胶体框架。 封装单元包括分别覆盖第一发光模块和第二发光模块的透明胶体和荧光体胶体。 因此，当通过使红色发光芯片和透明胶体体匹配的红色光源与通过匹配蓝色发光芯片和荧光体胶体而产生的白色光源相互混合时，CRI 可以增加光混合多芯片封装结构。

公开(公告)号：US08405118B2

公开(公告)日：2013-03-26

申请号：US12979201

申请日：2010-12-27

申请人： Chia-Tin Chung ,  Shih-Neng Dai

发明人： Chia-Tin Chung ,  Shih-Neng Dai

IPC分类号： H01L33/00

CPC分类号： H01L33/48 ,  F21K9/00 ,  F21V23/005 ,  F21V29/15 ,  F21Y2105/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L25/167 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/3025 ,  H05K1/0201 ,  H05K1/0209 ,  H05K2201/09063 ,  H05K2201/09972 ,  H05K2201/10106 ,  H01L2924/00 ,  H01L2924/00014

摘要： A multichip package structure includes a substrate unit, a light-emitting unit, a current-limiting unit, a frame unit and a package unit. The substrate unit includes a first chip-placing region and a second chip-placing region. The light-emitting unit includes a plurality of light-emitting chips electrically connected to the first chip-placing region. The current-limiting unit includes at least one current-limiting chip electrically connected to the second chip-placing region and the light-emitting unit. The frame unit includes a first annular colloid frame surrounding the light-emitting chips and a second annular colloid frame surrounding the current-limiting chip. The package unit includes a first package colloid body surrounded by the first annular colloid frame to cover the light-emitting chips and a second package colloid body surrounded by the second annular colloid frame to cover the current-limiting chip.

摘要翻译： 多芯片封装结构包括基板单元，发光单元，限流单元，框架单元和封装单元。 基板单元包括第一芯片放置区域和第二芯片放置区域。 发光单元包括电连接到第一芯片放置区的多个发光芯片。 限流单元包括电连接到第二芯片放置区域和发光单元的至少一个限流芯片。 框架单元包括围绕发光芯片的第一环形胶体框架和围绕限流芯片的第二环形胶体框架。 封装单元包括由第一环形胶体框架包围以覆盖发光芯片的第一封装胶体体和由第二环形胶体框架包围以覆盖限流芯片的第二封装胶体体。

公开(公告)号：US09078312B2

公开(公告)日：2015-07-07

申请号：US12964415

申请日：2010-12-09

申请人： Shih-Neng Dai ,  Chia-Tin Chung

发明人： Shih-Neng Dai ,  Chia-Tin Chung

IPC分类号： H05B33/08 ,  F21K99/00 ,  H01L25/16 ,  H01L25/075

CPC分类号： H05B33/0812 ,  F21K9/00 ,  H01L25/0753 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2924/3025 ,  H05B33/0821 ,  Y02B20/348 ,  H01L2924/00014 ,  H01L2924/00

摘要： A multichip package structure includes a substrate unit, a light-emitting unit, a control module, a frame unit and a package unit. The substrate unit includes a first chip-placing region and a second chip-placing region. The light-emitting unit includes a plurality of light-emitting chips electrically connected to the first chip-placing region. The control module includes at least one current-limiting unit and the rectifier unit electrically connected to the second chip-placing region and the light-emitting unit. The frame unit includes a first annular colloid frame surrounding the light-emitting chips and a second annular colloid frame surrounding the current-limiting unit and the rectifier unit. The package unit includes a first package colloid body surrounded by the first annular colloid frame to cover the light-emitting chips and a second package colloid body surrounded by the second annular colloid frame to cover the current-limiting unit and the rectifier unit.

摘要翻译： 多芯片封装结构包括基板单元，发光单元，控制模块，框架单元和封装单元。 基板单元包括第一芯片放置区域和第二芯片放置区域。 发光单元包括电连接到第一芯片放置区的多个发光芯片。 控制模块包括至少一个限流单元，并且整流单元电连接到第二芯片放置区域和发光单元。 框架单元包括围绕发光芯片的第一环形胶体框架和围绕限流单元和整流单元的第二环形胶体框架。 封装单元包括被第一环形胶体框架包围以覆盖发光芯片的第一封装胶体体和由第二环形胶体框架包围以覆盖限流单元和整流器单元的第二封装胶体体。

公开(公告)号：US08415701B2

公开(公告)日：2013-04-09

申请号：US13160679

申请日：2011-06-15

申请人： Chia-Tin Chung ,  Chao-Chin Wu ,  Fang-Kuei Wu

发明人： Chia-Tin Chung ,  Chao-Chin Wu ,  Fang-Kuei Wu

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An LED package structure for increasing light-emitting efficiency and controlling light-projecting angle includes a substrate unit, a light-emitting unit, a light-reflecting unit and a package unit. The substrate unit has a substrate body and a chip-placing area disposed on a top surface of the substrate body. The light-emitting unit has a plurality of LED chips electrically disposed on the chip-placing area. The light-reflecting unit has an annular reflecting resin body surroundingly formed on the top surface of the substrate body by coating. The annular reflecting resin body surrounds the LED chips that are disposed on the chip-placing area to form a resin position limiting space above the chip-placing area. The package unit has a translucent package resin body disposed on the top surface of the substrate body in order to cover the LED chips. The position of the translucent package resin body is limited in the resin position limiting space.

摘要翻译： 用于提高发光效率和控制投光角度的LED封装结构包括基板单元，发光单元，光反射单元和封装单元。 基板单元具有设置在基板主体的上表面上的基板主体和芯片放置区域。 发光单元具有多个LED芯片，电芯设置在芯片放置区域上。 光反射单元具有通过涂覆在基板主体的上表面上周围形成的环状的反射树脂体。 环状反射树脂体围绕设置在芯片放置区域上的LED芯片，以在芯片放置区域上方形成树脂位置限制空间。 封装单元具有设置在基板主体的顶表面上的半透明封装树脂体，以覆盖LED芯片。 半透明封装树脂体的位置限制在树脂位置限制空间中。

公开(公告)号：US20100327295A1

公开(公告)日：2010-12-30

申请号：US12551682

申请日：2009-09-01

申请人： HSIN-YUAN PENG ,  Chao-Chin Wu ,  Chia-Tin Chung

发明人： HSIN-YUAN PENG ,  Chao-Chin Wu ,  Chia-Tin Chung

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L24/97 ,  H01L33/52 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package structure includes a substrate unit, a light-emitting unit, a light-reflecting unit and a package unit. The substrate unit has a substrate body and a chip-placing area, and the substrate body has a cutting chamfer formed on one side thereof. The light-emitting unit has a plurality of LED chips electrically disposed on the chip-placing area. The light-reflecting unit has an annular reflecting resin body surroundingly formed on the substrate body by coating. A distance between an outermost side of the annular reflecting resin body and an outermost side of the substrate body is between 0 and 1.5 mm, and the annular reflecting resin body surrounds the LED chips to form a resin position limiting space. The package unit has a translucent package resin body for covering the LED chips, and the position of the translucent package resin body is limited in the resin position limiting space.

公开(公告)号：US08187899B2

公开(公告)日：2012-05-29

申请号：US12550699

申请日：2009-08-31

申请人： Chia-Tin Chung ,  Chao-Chin Wu ,  Fang-Kuei Wu

发明人： Chia-Tin Chung ,  Chao-Chin Wu ,  Fang-Kuei Wu

IPC分类号： H01L21/76

CPC分类号： H01L25/0753 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An LED package structure for increasing light-emitting efficiency and controlling light-projecting angle includes a substrate unit, a light-emitting unit, a light-reflecting unit and a package unit. The substrate unit has a substrate body and a chip-placing area disposed on a top surface of the substrate body. The light-emitting unit has a plurality of LED chips electrically disposed on the chip-placing area. The light-reflecting unit has an annular reflecting resin body surroundingly formed on the top surface of the substrate body by coating. The annular reflecting resin body surrounds the LED chips that are disposed on the chip-placing area to form a resin position limiting space above the chip-placing area. The package unit has a translucent package resin body disposed on the top surface of the substrate body in order to cover the LED chips. The position of the translucent package resin body is limited in the resin position limiting space.

摘要翻译： 用于提高发光效率和控制投光角度的LED封装结构包括基板单元，发光单元，光反射单元和封装单元。 基板单元具有设置在基板主体的上表面上的基板主体和芯片放置区域。 发光单元具有多个LED芯片，电芯设置在芯片放置区域上。 光反射单元具有通过涂覆在基板主体的上表面上周围形成的环状的反射树脂体。 环状反射树脂体围绕设置在芯片放置区域上的LED芯片，以在芯片放置区域上方形成树脂位置限制空间。 封装单元具有设置在基板主体的顶表面上的半透明封装树脂体，以覆盖LED芯片。 半透明封装树脂体的位置限制在树脂位置限制空间中。

公开(公告)号：US08217404B2

公开(公告)日：2012-07-10

申请号：US12756317

申请日：2010-04-08

申请人： Chao-Chin Wu ,  Chia-Tin Chung

发明人： Chao-Chin Wu ,  Chia-Tin Chung

IPC分类号： H01L29/18 ,  H01L33/00

CPC分类号： H01L25/0753 ,  H01L33/50 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-mixing type LED package structure for increasing color render index includes a substrate unit, a light-emitting unit, a frame unit and a package unit. The light-emitting unit has a first light-emitting module for generating a first color temperature and a second light-emitting module for generating a second color temperature. The frame unit has two annular resin frames surroundingly formed on the top surface of the substrate unit by coating. The two annular resin frames respectively surround the first light-emitting module and the second light-emitting module in order to form two resin position limiting spaces above the substrate unit. The package unit has a first translucent package resin body and a second translucent package resin body both disposed on the substrate unit and respective covering the first light-emitting module and the second light-emitting module.

摘要翻译： 用于增加着色指数的光混合型LED封装结构包括基板单元，发光单元，框架单元和封装单元。 发光单元具有用于产生第一色温的第一发光模块和用于产生第二色温的第二发光模块。 框架单元具有通过涂覆在基板单元的顶表面周围形成的两个环形树脂框架。 两个环形树脂框架分别围绕第一发光模块和第二发光模块，以在基板单元上方形成两个树脂位置限制空间。 封装单元具有第一半透明封装树脂体和第二半透明封装树脂体，两者均设置在基板单元上，并且分别覆盖第一发光模块和第二发光模块。

公开(公告)号：US20110193108A1

公开(公告)日：2011-08-11

申请号：US12756317

申请日：2010-04-08

申请人： Chao-Chin Wu ,  Chia-Tin Chung

发明人： Chao-Chin Wu ,  Chia-Tin Chung

IPC分类号： H01L33/50 ,  H01L33/44

CPC分类号： H01L25/0753 ,  H01L33/50 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-mixing type LED package structure for increasing color render index includes a substrate unit, a light-emitting unit, a frame unit and a package unit. The light-emitting unit has a first light-emitting module for generating a first color temperature and a second light-emitting module for generating a second color temperature. The frame unit has two annular resin frames surroundingly formed on the top surface of the substrate unit by coating. The two annular resin frames respectively surround the first light-emitting module and the second light-emitting module in order to form two resin position limiting spaces above the substrate unit. The package unit has a first translucent package resin body and a second translucent package resin body both disposed on the substrate unit and respective covering the first light-emitting module and the second light-emitting module.

摘要翻译： 用于增加着色指数的光混合型LED封装结构包括基板单元，发光单元，框架单元和封装单元。 发光单元具有用于产生第一色温的第一发光模块和用于产生第二色温的第二发光模块。 框架单元具有通过涂覆在基板单元的顶表面周围形成的两个环形树脂框架。 两个环形树脂框架分别围绕第一发光模块和第二发光模块，以在基板单元上方形成两个树脂位置限制空间。 封装单元具有第一半透明封装树脂体和第二半透明封装树脂体，两者均设置在基板单元上，并且分别覆盖第一发光模块和第二发光模块。

公开(公告)号：US09125328B2

公开(公告)日：2015-09-01

申请号：US13425692

申请日：2012-03-21

申请人： Chia-Tin Chung ,  Chao-Chin Wu ,  Fang-Kuei Wu

发明人： Chia-Tin Chung ,  Chao-Chin Wu ,  Fang-Kuei Wu

IPC分类号： F21V7/00 ,  H05K3/28 ,  H01L33/54 ,  H01L33/60

CPC分类号： H05K3/285 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2924/181 ,  H05K3/284 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T29/49146 ,  Y10T29/49147 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A method of manufacturing a multichip package structure includes: providing a substrate body; placing a plurality of light-emitting chips on the substrate body, where the light-emitting chips are electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, where the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, where the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body.

摘要翻译： 一种制造多芯片封装结构的方法包括：提供衬底本体; 将多个发光芯片放置在基板主体上，其中发光芯片电连接到基板主体; 围绕所述基板主体周围形成周围的液体胶体以围绕所述发光芯片; 在预定室温下自然干燥周围液体胶体的外层，以形成半干燥的周围光反射框架，其中半干燥的周围光反射框架具有设置在基板主体上的非干燥环绕胶体， 胶体完全覆盖不干胶体周边胶体; 然后在基板主体上形成封装胶体，以覆盖发光芯片，半透明周围的光反射框架接触并包围封装胶体。

公开(公告)号：US09029883B2

公开(公告)日：2015-05-12

申请号：US13180298

申请日：2011-07-11

申请人： Chia-Tin Chung

发明人： Chia-Tin Chung

IPC分类号： H01L33/00 ,  F21K99/00 ,  H01L25/075 ,  H01L33/64

CPC分类号： F21K9/00 ,  H01L25/0753 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0075 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package structure with concave area for positioning heat-conducting substance includes a substrate unit, a heat-conducting adhesive unit, a light-emitting unit, a conductive unit and a package unit. The substrate unit has a substrate body, a concave space formed on the substrate body, and a plurality of positive and negative pads exposed on the substrate body. The heat-conducting adhesive unit has a heat-conducting adhesive layer positioned in the concave space. The light-emitting unit has a plurality of LED chips disposed on the heat-conducting adhesive layer and received in the concave space. The conductive unit has a plurality of wires. Each LED chip is electrically connected between each positive pad and each negative pad. The package unit has a translucent package resin body disposed on the substrate body in order to cover the LED chips and the wires.

摘要翻译： 具有用于定位导热物质的凹面积的LED封装结构包括基板单元，导热粘合单元，发光单元，导电单元和封装单元。 基板单元具有基板主体，形成在基板主体上的凹形空间，以及暴露在基板主体上的多个正极和负极焊盘。 导热粘合单元具有定位在凹形空间中的导热粘合剂层。 发光单元具有设置在导热粘合剂层上并被容纳在凹形空间中的多个LED芯片。 导电单元具有多根导线。 每个LED芯片电连接在每个正极焊盘和每个负焊盘之间。 封装单元具有设置在基板主体上的半透明封装树脂体，以覆盖LED芯片和电线。