公开(公告)号：US08415701B2

公开(公告)日：2013-04-09

申请号：US13160679

申请日：2011-06-15

申请人： Chia-Tin Chung ,  Chao-Chin Wu ,  Fang-Kuei Wu

发明人： Chia-Tin Chung ,  Chao-Chin Wu ,  Fang-Kuei Wu

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An LED package structure for increasing light-emitting efficiency and controlling light-projecting angle includes a substrate unit, a light-emitting unit, a light-reflecting unit and a package unit. The substrate unit has a substrate body and a chip-placing area disposed on a top surface of the substrate body. The light-emitting unit has a plurality of LED chips electrically disposed on the chip-placing area. The light-reflecting unit has an annular reflecting resin body surroundingly formed on the top surface of the substrate body by coating. The annular reflecting resin body surrounds the LED chips that are disposed on the chip-placing area to form a resin position limiting space above the chip-placing area. The package unit has a translucent package resin body disposed on the top surface of the substrate body in order to cover the LED chips. The position of the translucent package resin body is limited in the resin position limiting space.

摘要翻译： 用于提高发光效率和控制投光角度的LED封装结构包括基板单元，发光单元，光反射单元和封装单元。 基板单元具有设置在基板主体的上表面上的基板主体和芯片放置区域。 发光单元具有多个LED芯片，电芯设置在芯片放置区域上。 光反射单元具有通过涂覆在基板主体的上表面上周围形成的环状的反射树脂体。 环状反射树脂体围绕设置在芯片放置区域上的LED芯片，以在芯片放置区域上方形成树脂位置限制空间。 封装单元具有设置在基板主体的顶表面上的半透明封装树脂体，以覆盖LED芯片。 半透明封装树脂体的位置限制在树脂位置限制空间中。

公开(公告)号：US08187899B2

公开(公告)日：2012-05-29

申请号：US12550699

申请日：2009-08-31

申请人： Chia-Tin Chung ,  Chao-Chin Wu ,  Fang-Kuei Wu

发明人： Chia-Tin Chung ,  Chao-Chin Wu ,  Fang-Kuei Wu

IPC分类号： H01L21/76

CPC分类号： H01L25/0753 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An LED package structure for increasing light-emitting efficiency and controlling light-projecting angle includes a substrate unit, a light-emitting unit, a light-reflecting unit and a package unit. The substrate unit has a substrate body and a chip-placing area disposed on a top surface of the substrate body. The light-emitting unit has a plurality of LED chips electrically disposed on the chip-placing area. The light-reflecting unit has an annular reflecting resin body surroundingly formed on the top surface of the substrate body by coating. The annular reflecting resin body surrounds the LED chips that are disposed on the chip-placing area to form a resin position limiting space above the chip-placing area. The package unit has a translucent package resin body disposed on the top surface of the substrate body in order to cover the LED chips. The position of the translucent package resin body is limited in the resin position limiting space.

摘要翻译： 用于提高发光效率和控制投光角度的LED封装结构包括基板单元，发光单元，光反射单元和封装单元。 基板单元具有设置在基板主体的上表面上的基板主体和芯片放置区域。 发光单元具有多个LED芯片，电芯设置在芯片放置区域上。 光反射单元具有通过涂覆在基板主体的上表面上周围形成的环状的反射树脂体。 环状反射树脂体围绕设置在芯片放置区域上的LED芯片，以在芯片放置区域上方形成树脂位置限制空间。 封装单元具有设置在基板主体的顶表面上的半透明封装树脂体，以覆盖LED芯片。 半透明封装树脂体的位置限制在树脂位置限制空间中。

公开(公告)号：US09125328B2

公开(公告)日：2015-09-01

申请号：US13425692

申请日：2012-03-21

申请人： Chia-Tin Chung ,  Chao-Chin Wu ,  Fang-Kuei Wu

发明人： Chia-Tin Chung ,  Chao-Chin Wu ,  Fang-Kuei Wu

IPC分类号： F21V7/00 ,  H05K3/28 ,  H01L33/54 ,  H01L33/60

CPC分类号： H05K3/285 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2924/181 ,  H05K3/284 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T29/49146 ,  Y10T29/49147 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A method of manufacturing a multichip package structure includes: providing a substrate body; placing a plurality of light-emitting chips on the substrate body, where the light-emitting chips are electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, where the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, where the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body.

摘要翻译： 一种制造多芯片封装结构的方法包括：提供衬底本体; 将多个发光芯片放置在基板主体上，其中发光芯片电连接到基板主体; 围绕所述基板主体周围形成周围的液体胶体以围绕所述发光芯片; 在预定室温下自然干燥周围液体胶体的外层，以形成半干燥的周围光反射框架，其中半干燥的周围光反射框架具有设置在基板主体上的非干燥环绕胶体， 胶体完全覆盖不干胶体周边胶体; 然后在基板主体上形成封装胶体，以覆盖发光芯片，半透明周围的光反射框架接触并包围封装胶体。

公开(公告)号：US20110241035A1

公开(公告)日：2011-10-06

申请号：US13160679

申请日：2011-06-15

申请人： CHIA-TIN CHUNG ,  Chao-Chin Wu ,  Fang-Kuei Wu

发明人： CHIA-TIN CHUNG ,  Chao-Chin Wu ,  Fang-Kuei Wu

IPC分类号： H01L27/15

CPC分类号： H01L25/0753 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An LED package structure for increasing light-emitting efficiency and controlling light-projecting angle includes a substrate unit, a light-emitting unit, a light-reflecting unit and a package unit. The substrate unit has a substrate body and a chip-placing area disposed on a top surface of the substrate body. The light-emitting unit has a plurality of LED chips electrically disposed on the chip-placing area. The light-reflecting unit has an annular reflecting resin body surroundingly formed on the top surface of the substrate body by coating. The annular reflecting resin body surrounds the LED chips that are disposed on the chip-placing area to form a resin position limiting space above the chip-placing area. The package unit has a translucent package resin body disposed on the top surface of the substrate body in order to cover the LED chips. The position of the translucent package resin body is limited in the resin position limiting space.

摘要翻译： 用于提高发光效率和控制投光角度的LED封装结构包括基板单元，发光单元，光反射单元和封装单元。 基板单元具有设置在基板主体的上表面上的基板主体和芯片放置区域。 发光单元具有多个LED芯片，电芯设置在芯片放置区域上。 光反射单元具有通过涂覆在基板主体的上表面上周围形成的环状的反射树脂体。 环状反射树脂体围绕设置在芯片放置区域上的LED芯片，以在芯片放置区域上方形成树脂位置限制空间。 封装单元具有设置在基板主体的顶表面上的半透明封装树脂体，以覆盖LED芯片。 半透明封装树脂体的位置限制在树脂位置限制空间中。

公开(公告)号：US08217404B2

公开(公告)日：2012-07-10

申请号：US12756317

申请日：2010-04-08

申请人： Chao-Chin Wu ,  Chia-Tin Chung

发明人： Chao-Chin Wu ,  Chia-Tin Chung

IPC分类号： H01L29/18 ,  H01L33/00

CPC分类号： H01L25/0753 ,  H01L33/50 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-mixing type LED package structure for increasing color render index includes a substrate unit, a light-emitting unit, a frame unit and a package unit. The light-emitting unit has a first light-emitting module for generating a first color temperature and a second light-emitting module for generating a second color temperature. The frame unit has two annular resin frames surroundingly formed on the top surface of the substrate unit by coating. The two annular resin frames respectively surround the first light-emitting module and the second light-emitting module in order to form two resin position limiting spaces above the substrate unit. The package unit has a first translucent package resin body and a second translucent package resin body both disposed on the substrate unit and respective covering the first light-emitting module and the second light-emitting module.

摘要翻译： 用于增加着色指数的光混合型LED封装结构包括基板单元，发光单元，框架单元和封装单元。 发光单元具有用于产生第一色温的第一发光模块和用于产生第二色温的第二发光模块。 框架单元具有通过涂覆在基板单元的顶表面周围形成的两个环形树脂框架。 两个环形树脂框架分别围绕第一发光模块和第二发光模块，以在基板单元上方形成两个树脂位置限制空间。 封装单元具有第一半透明封装树脂体和第二半透明封装树脂体，两者均设置在基板单元上，并且分别覆盖第一发光模块和第二发光模块。

公开(公告)号：US20110193108A1

公开(公告)日：2011-08-11

申请号：US12756317

申请日：2010-04-08

申请人： Chao-Chin Wu ,  Chia-Tin Chung

发明人： Chao-Chin Wu ,  Chia-Tin Chung

IPC分类号： H01L33/50 ,  H01L33/44

CPC分类号： H01L25/0753 ,  H01L33/50 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-mixing type LED package structure for increasing color render index includes a substrate unit, a light-emitting unit, a frame unit and a package unit. The light-emitting unit has a first light-emitting module for generating a first color temperature and a second light-emitting module for generating a second color temperature. The frame unit has two annular resin frames surroundingly formed on the top surface of the substrate unit by coating. The two annular resin frames respectively surround the first light-emitting module and the second light-emitting module in order to form two resin position limiting spaces above the substrate unit. The package unit has a first translucent package resin body and a second translucent package resin body both disposed on the substrate unit and respective covering the first light-emitting module and the second light-emitting module.

摘要翻译： 用于增加着色指数的光混合型LED封装结构包括基板单元，发光单元，框架单元和封装单元。 发光单元具有用于产生第一色温的第一发光模块和用于产生第二色温的第二发光模块。 框架单元具有通过涂覆在基板单元的顶表面周围形成的两个环形树脂框架。 两个环形树脂框架分别围绕第一发光模块和第二发光模块，以在基板单元上方形成两个树脂位置限制空间。 封装单元具有第一半透明封装树脂体和第二半透明封装树脂体，两者均设置在基板单元上，并且分别覆盖第一发光模块和第二发光模块。

公开(公告)号：US20100327295A1

公开(公告)日：2010-12-30

申请号：US12551682

申请日：2009-09-01

申请人： HSIN-YUAN PENG ,  Chao-Chin Wu ,  Chia-Tin Chung

发明人： HSIN-YUAN PENG ,  Chao-Chin Wu ,  Chia-Tin Chung

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L24/97 ,  H01L33/52 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package structure includes a substrate unit, a light-emitting unit, a light-reflecting unit and a package unit. The substrate unit has a substrate body and a chip-placing area, and the substrate body has a cutting chamfer formed on one side thereof. The light-emitting unit has a plurality of LED chips electrically disposed on the chip-placing area. The light-reflecting unit has an annular reflecting resin body surroundingly formed on the substrate body by coating. A distance between an outermost side of the annular reflecting resin body and an outermost side of the substrate body is between 0 and 1.5 mm, and the annular reflecting resin body surrounds the LED chips to form a resin position limiting space. The package unit has a translucent package resin body for covering the LED chips, and the position of the translucent package resin body is limited in the resin position limiting space.

公开(公告)号：US08421373B2

公开(公告)日：2013-04-16

申请号：US13069276

申请日：2011-03-22

申请人： Chia-Tin Chung ,  Shih-Neng Dai ,  Chao-Chin Wu

发明人： Chia-Tin Chung ,  Shih-Neng Dai ,  Chao-Chin Wu

IPC分类号： H05B37/02

CPC分类号： H05B33/0827 ,  F21K9/00 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/50 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-mixing multichip package structure includes a substrate unit, a light-emitting unit, a frame unit, and a package unit. The light-emitting unit includes at least one first light-emitting module with red light-emitting chips and at least one second light-emitting module with blue light-emitting chips. The frame unit includes at least one first continuous colloid frame and at least one second continuous colloid frame respectively surrounding the first light-emitting module and the second light-emitting module. The package unit includes a transparent colloid body and a phosphor colloid body respectively covering the first light-emitting module and the second light-emitting module. Hence, when the red light source generated by matching the red light-emitting chips and the transparent colloid body and the white light source generated by matching the blue light-emitting chips and the phosphor colloid body are mixed with each other, the CRI of the light-mixing multichip package structure can be increased.

摘要翻译： 光混合多芯片封装结构包括基板单元，发光单元，框架单元和封装单元。 发光单元包括具有红色发光芯片的至少一个第一发光模块和具有蓝色发光芯片的至少一个第二发光模块。 框架单元包括分别围绕第一发光模块和第二发光模块的至少一个第一连续胶体框架和至少一个第二连续胶体框架。 封装单元包括分别覆盖第一发光模块和第二发光模块的透明胶体和荧光体胶体。 因此，当通过使红色发光芯片和透明胶体体匹配的红色光源与通过匹配蓝色发光芯片和荧光体胶体而产生的白色光源相互混合时，CRI 可以增加光混合多芯片封装结构。

公开(公告)号：US20120187865A1

公开(公告)日：2012-07-26

申请号：US13069276

申请日：2011-03-22

申请人： CHIA-TIN CHUNG ,  Shih-Neng Dai ,  Chao-Chin Wu

发明人： CHIA-TIN CHUNG ,  Shih-Neng Dai ,  Chao-Chin Wu

IPC分类号： H05B37/02 ,  F21V9/16

CPC分类号： H05B33/0827 ,  F21K9/00 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/50 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-mixing multichip package structure includes a substrate unit, a light-emitting unit, a frame unit, and a package unit. The light-emitting unit includes at least one first light-emitting module with red light-emitting chips and at least one second light-emitting module with blue light-emitting chips. The frame unit includes at least one first continuous colloid frame and at least one second continuous colloid frame respectively surrounding the first light-emitting module and the second light-emitting module. The package unit includes a transparent colloid body and a phosphor colloid body respectively covering the first light-emitting module and the second light-emitting module. Hence, when the red light source generated by matching the red light-emitting chips and the transparent colloid body and the white light source generated by matching the blue light-emitting chips and the phosphor colloid body are mixed with each other, the CRI of the light-mixing multichip package structure can be increased.

摘要翻译： 光混合多芯片封装结构包括基板单元，发光单元，框架单元和封装单元。 发光单元包括具有红色发光芯片的至少一个第一发光模块和具有蓝色发光芯片的至少一个第二发光模块。 框架单元包括分别围绕第一发光模块和第二发光模块的至少一个第一连续胶体框架和至少一个第二连续胶体框架。 封装单元包括分别覆盖第一发光模块和第二发光模块的透明胶体和荧光体胶体。 因此，当通过使红色发光芯片和透明胶体体匹配的红色光源与通过匹配蓝色发光芯片和荧光体胶体而产生的白色光源相互混合时，CRI 可以增加光混合多芯片封装结构。

公开(公告)号：US20060048607A1

公开(公告)日：2006-03-09

申请号：US11129930

申请日：2005-05-16

申请人： Yu-Cheng Lin ,  Min Li ,  Chao-Chin Wu

发明人： Yu-Cheng Lin ,  Min Li ,  Chao-Chin Wu

IPC分类号： B22F9/24 ,  C22C5/02

CPC分类号： B22F9/24 ,  B01L7/52 ,  B01L2300/18 ,  B22F1/0018 ,  B22F1/0022 ,  B22F1/0062 ,  B22F2998/00 ,  B82Y30/00

摘要： The present invention provides a reagent for rapidly attaining thermal equilibrium in a biological and/or chemical reaction, which comprises Au nanoparticles; wherein the Au nanoparticles have a Au metal core covalently bonding to a weak acid functional group, and the Au nanoparticles are aqueous. A method for rapidly attaining thermal equilibrium in a biological and/or chemical reaction and a method for producing the reagent are also provided.

摘要翻译： 本发明提供了用于在生物和/或化学反应中快速获得热平衡的试剂，其包含Au纳米颗粒; 其中所述Au纳米颗粒具有与弱酸官能团共价结合的Au金属核，并且所述Au纳米颗粒是水性的。 还提供了在生物和/或化学反应中快速获得热平衡的方法和制备试剂的方法。