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48 条记录 (耗时 0.017 秒)

    SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
    1.
    发明申请
    SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20200075711A1

    公开(公告)日：2020-03-05

    申请号：US16159726

    申请日：2018-10-15

    申请人： Unimicron Technology Corp.

    发明人： Yu-Hua Chen ,  Fu-Yang Chen ,  Chun-Hsien Chien ,  Chien-Chou Chen ,  Wei-Ti Lin

    IPC分类号： H01L49/02 ,  H01L23/522 ,  H01L23/532 ,  H01L23/15 ,  H01L23/498

    摘要： A manufacturing method of a substrate structure includes the following steps. A first build-up circuit structure is formed. At least one copper pillar is formed on the first build-up circuit structure. A dielectric layer is formed on the first build-up circuit structure, and the dielectric layer wraps the copper pillar. A second build-up circuit structure and a capacitive element are formed on the dielectric layer. In particular, the second build-up circuit structure and the first build-up circuit structure are respectively located at two opposite sides of the dielectric layer. The capacitive element is disposed in a capacitive element setting region within the second build-up circuit structure. The copper pillar penetrates the dielectric layer and is electrically connected to the second build-up circuit structure and the first build-up circuit structure. A substrate structure obtained by the manufacturing method of the substrate structure is provided.

    PACKAGE SUBSTRATE STRUCTURE AND BONDING METHOD THEREOF
    2.
    发明申请
    PACKAGE SUBSTRATE STRUCTURE AND BONDING METHOD THEREOF 审中-公开

    公开(公告)号：US20200043839A1

    公开(公告)日：2020-02-06

    申请号：US16167540

    申请日：2018-10-23

    申请人： Unimicron Technology Corp.

    发明人： Cheng-Ta Ko ,  Kai-Ming Yang ,  Yu-Hua Chen ,  Tzyy-Jang Tseng

    IPC分类号： H01L23/498

    摘要： A package substrate structure includes a first substrate, a second substrate, a plurality of conductive pillars and an adhesive layer. The first substrate includes a plurality of vias and a plurality of pads. The vias and the pads are disposed on the first substrate, and fills in the vias. The second substrate is disposed opposite to the first substrate. Each conductive pillar is disposed between the first substrate and the second substrate, where each conductive pillar electrically connects each pad and the second substrate, and the adhesive layer fills in the gaps between the conductive pillars. A bonding method of the package substrate structure is also provided.

    Chip package structure
    5.
    发明授权
    Chip package structure 有权

    公开(公告)号：US10211139B2

    公开(公告)日：2019-02-19

    申请号：US15287729

    申请日：2016-10-06

    申请人： Unimicron Technology Corp.

    发明人： Tzyy-Jang Tseng ,  Yu-Hua Chen ,  Ra-Min Tain

    IPC分类号： H01L23/498 ,  H01L23/48 ,  H01L25/10 ,  H01L21/48 ,  H01L23/367 ,  H01L23/31 ,  C25D5/02 ,  C25D5/34 ,  C25D5/48 ,  C25D7/12 ,  H05K1/11 ,  H05K3/46 ,  H01L23/36 ,  H05K3/42

    摘要： A chip package structure including a molding compound, a carrier board, a chip, a plurality of conductive pillars and a circuit board is provided. The carrier board includes a substrate and a redistribution layer. The substrate has a first surface and a second surface. The redistribution layer is disposed on the first surface. The chip and the conductive pillars are disposed on the redistribution layer. The molding compound covers the chip, the conductive pillars, and the redistribution layer. The circuit board is connected with the carrier board, wherein the circuit board is disposed on the molding compound, such that the chip is located between the substrate and the circuit board, and the chip and the redistribution layer are electrically connected with the circuit board through the conductive pillars. Heat generated by the chip is transmitted through the substrate from the first surface to the second surface to dissipate.

    EMBEDDED COMPONENT STRUCTURE AND MANUFACTURING METHOD THEREOF
    8.
    发明申请
    EMBEDDED COMPONENT STRUCTURE AND MANUFACTURING METHOD THEREOF 有权

    公开(公告)号：US20220287182A1

    公开(公告)日：2022-09-08

    申请号：US17826178

    申请日：2022-05-27

    申请人： Unimicron Technology Corp.

    发明人： Tzyy-Jang Tseng ,  Yu-Hua Chen ,  Chun-Hsien Chien ,  Wen-Liang Yeh ,  Ra-Min Tain

    IPC分类号： H05K1/18 ,  H05K1/02 ,  H05K3/46

    摘要： An embedded component structure includes a board, an electronic component, and a dielectric material layer. The board has a through cavity. The board includes an insulating core layer and a conductive member. The insulating core layer has a first surface and a second surface opposite thereto. The through cavity penetrates the insulating core layer. The conductive member extends from a portion of the first surface along a portion of the side wall of the through cavity to a portion of the second surface. The electronic component includes an electrode. The electronic component is disposed in the through cavity. The dielectric material layer is at least filled in the through cavity. The connection circuit layer covers and contacts the conductive member and the electrode. A manufacturing method of an embedded component structure is also provided.

    Package structure with structure reinforcing element and manufacturing method thereof
    9.
    发明授权
    Package structure with structure reinforcing element and manufacturing method thereof 有权

    公开(公告)号：US11410940B2

    公开(公告)日：2022-08-09

    申请号：US17170736

    申请日：2021-02-08

    申请人： Unimicron Technology Corp.

    发明人： Pu-Ju Lin ,  Cheng-Ta Ko ,  Yu-Hua Chen ,  Tzyy-Jang Tseng ,  Ra-Min Tain

    IPC分类号： H01L23/16 ,  H01L23/66 ,  H01L23/00 ,  H01L23/31

    摘要： A package structure includes a redistribution structure, a chip, one or more structural reinforcing elements, and a protective layer. The redistribution structure includes a first circuit layer and a second circuit layer disposed over the first circuit layer. The first circuit layer is electrically connected to the second circuit layer. The chip is disposed over the redistribution structure and electrically connected to the second circuit layer. The one or more structural reinforcing elements are disposed over the redistribution structure. The structural reinforcing element has a Young's modulus in a range of 30 to 200 GPa. The protective layer overlays the chip and a sidewall of the structural reinforcing element.

    Package structure with structure reinforcing element and manufacturing method thereof
    10.
    发明授权
    Package structure with structure reinforcing element and manufacturing method thereof 有权

    公开(公告)号：US10957658B2

    公开(公告)日：2021-03-23

    申请号：US16866530

    申请日：2020-05-04

    申请人： Unimicron Technology Corp.

    发明人： Pu-Ju Lin ,  Cheng-Ta Ko ,  Yu-Hua Chen ,  Tzyy-Jang Tseng ,  Ra-Min Tain

    IPC分类号： H01L23/16 ,  H01L23/66 ,  H01L23/00 ,  H01L23/31

    摘要： A package structure includes a redistribution structure, a chip, one or more structural reinforcing elements, and a protective layer. The redistribution structure includes a first circuit layer and a second circuit layer disposed over the first circuit layer. The first circuit layer is electrically connected to the second circuit layer. The chip is disposed over the redistribution structure and electrically connected to the second circuit layer. The one or more structural reinforcing elements are disposed over the redistribution structure. The structural reinforcing element has a Young's modulus in a range of 30 to 200 GPa. The protective layer overlays the chip and a sidewall of the structural reinforcing element.