-
公开(公告)号:US09697947B1
公开(公告)日:2017-07-04
申请号:US14942352
申请日:2015-11-16
Applicant: VLT, Inc.
Inventor: Sergey Luzanov
CPC classification number: H01F27/2804 , H01F5/00 , H01F27/02 , H01F27/29 , H01F27/292 , H01F41/02 , H01F41/041 , H01F2027/2809 , H05K1/111 , H05K1/141 , H05K3/303 , H05K3/366 , H05K3/403
Abstract: An vertical PCB inductive device is adapted to be surface mount soldered to a substrate. The inductive device may comprise a transformer having a plurality of windings or one or more discrete inductive devices. The inductive device, being amenable to volume production, may also provide cost savings by reducing the number of layers and the PCB area otherwise required by planar magnetics in a power converter. A power converter may be fashioned to be vertically oriented and surface mount soldered to a substrate such as a customer PCB.
-
公开(公告)号:USD721047S1
公开(公告)日:2015-01-13
申请号:US29448057
申请日:2013-03-08
Applicant: VLT, Inc.
Designer: Patrizio Vinciarelli , Sergey Luzanov
-
3.
公开(公告)号:US09190206B1
公开(公告)日:2015-11-17
申请号:US14107911
申请日:2013-12-16
Applicant: VLT, Inc.
Inventor: Sergey Luzanov
CPC classification number: H01F27/2804 , H01F5/00 , H01F27/02 , H01F27/29 , H01F27/292 , H01F41/02 , H01F41/041 , H01F2027/2809 , H05K1/111 , H05K1/141 , H05K3/303 , H05K3/366 , H05K3/403
Abstract: A vertical PCB inductive device is adapted to be surface mount soldered to a substrate. The inductive device may comprise a transformer having a plurality of windings or one or more discrete inductive devices. The inductive device, being amenable to volume production, may also provide cost savings by reducing the number of layers and the PCB area otherwise required by planar magnetics in a power converter. A power converter may be fashioned to be vertically oriented and surface mount soldered to a substrate such as a customer PCB.
Abstract translation: 垂直PCB感应装置适于表面安装焊接到基板。 感应装置可以包括具有多个绕组或一个或多个离散感应装置的变压器。 适于批量生产的感应装置还可以通过减少功率转换器中的平面磁体所需的层数和PCB面积来提供成本节约。 功率转换器可以被制成垂直取向并且表面安装焊接到例如客户PCB的基板上。
-
公开(公告)号:US09166481B1
公开(公告)日:2015-10-20
申请号:US13830262
申请日:2013-03-14
Applicant: VLT, INC.
Inventor: Patrizio Vinciarelli , Sergey Luzanov
CPC classification number: H02M3/33576 , H02M3/33569 , H02M2001/0058 , Y02B70/1433 , Y02B70/1491
Abstract: A method of synchronously operating a power converter in a series of converter operating cycles includes providing an oscillator for generating clock signals at an oscillator frequency, and generating timing control signals for each of multiple events based upon the clock signals. The method further includes to: (i) turn a primary switch ON and OFF at times when essentially zero voltage is impressed across the primary switch and essentially zero resonant current is flowing in the primary switch; and (ii) turn a secondary switch ON and OFF at times when essentially zero current is flowing in the secondary switch and essentially zero voltage is impressed across the secondary switch. The oscillator frequency is preset, and the timing of the timing control signals for one or more selected events may be set independently of other timing control signals and events.
Abstract translation: 一种在一系列转换器操作周期中同步操作功率转换器的方法包括提供用于以振荡器频率产生时钟信号的振荡器,并且基于时钟信号为每个多个事件产生定时控制信号。 该方法还包括:(i)在主开关上施加基本为零的电压的时候,使初级开关接通和断开,并且基本上零谐振电流在初级开关中流动; 并且(ii)在二次开关中基本为零的电流流动的时候使二次开关接通和断开,并且在次级开关上基本上零电压。 振荡器频率被预置,并且可以独立于其它定时控制信号和事件来设置用于一个或多个所选事件的定时控制信号的定时。
-
公开(公告)号:USD752000S1
公开(公告)日:2016-03-22
申请号:US29509740
申请日:2014-11-20
Applicant: VLT, INC.
Designer: Patrizio Vinciarelli , Sergey Luzanov
-
公开(公告)号:US09269661B1
公开(公告)日:2016-02-23
申请号:US14597086
申请日:2015-01-14
Applicant: VLT, INC.
Inventor: Patrizio Vinciarelli , Sergey Luzanov
IPC: H01L23/48 , H01L23/50 , H01L27/088 , H01L21/768
CPC classification number: H01L23/50 , H01L21/76895 , H01L23/4824 , H01L23/49844 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L27/088 , H01L2224/0401 , H01L2224/04026 , H01L2224/05551 , H01L2224/05552 , H01L2224/05555 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05669 , H01L2224/06051 , H01L2224/131 , H01L2224/16225 , H01L2224/291 , H01L2224/32225 , H01L2224/73203 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/014 , H01L2924/00
Abstract: A semiconductor device includes a semiconductor substrate with doped regions of a first type and doped regions of a second type. A first metallization layer connects to the doped regions of the first type through conductive paths, such that current is able to flow within the metallization layer along a plurality of linear axes. A second metallization layer connects to the doped regions of the second type through conductive paths, such that that current is able to flow within the metallization layer along a plurality of linear axes. Contacts on an exterior surface of the semiconductor device can be arranged concentrically.
-
公开(公告)号:US08610528B1
公开(公告)日:2013-12-17
申请号:US13724241
申请日:2012-12-21
Applicant: VLT, Inc.
Inventor: Sergey Luzanov
IPC: H01F27/29
CPC classification number: H01F27/2804 , H01F5/00 , H01F27/02 , H01F27/29 , H01F27/292 , H01F41/02 , H01F41/041 , H01F2027/2809 , H05K1/111 , H05K1/141 , H05K3/303 , H05K3/366 , H05K3/403
Abstract: A vertical PCB inductive device is adapted to be surface mount soldered to a substrate. The inductive device may comprise a transformer having a plurality of windings or one or more discrete inductive devices. The inductive device, being amenable to volume production, may also provide cost savings by reducing the number of layers and the PCB area otherwise required by planar magnetics in a power converter. A power converter may be fashioned to be vertically oriented and surface mount soldered to a substrate such as a customer PCB.
-
公开(公告)号:US08975694B1
公开(公告)日:2015-03-10
申请号:US13789065
申请日:2013-03-07
Applicant: VLT, Inc.
Inventor: Patrizio Vinciarelli , Sergey Luzanov
IPC: H01L29/66 , H01L23/535
CPC classification number: H01L23/50 , H01L21/76895 , H01L23/4824 , H01L23/49844 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L27/088 , H01L2224/0401 , H01L2224/04026 , H01L2224/05551 , H01L2224/05552 , H01L2224/05555 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05669 , H01L2224/06051 , H01L2224/131 , H01L2224/16225 , H01L2224/291 , H01L2224/32225 , H01L2224/73203 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/014 , H01L2924/00
Abstract: A semiconductor device includes a semiconductor substrate with doped regions of a first type and doped regions of a second type. A first metallization layer connects to the doped regions of the first type through conductive paths, such that current is able to flow within the metallization layer along a plurality of linear axes. A second metallization layer connects to the doped regions of the second type through conductive paths, such that that current is able to flow within the metallization layer along a plurality of linear axes. Contacts on an exterior surface of the semiconductor device can be arranged concentrically.
Abstract translation: 半导体器件包括具有第一类型的掺杂区域和第二类型的掺杂区域的半导体衬底。 第一金属化层通过导电路径连接到第一类型的掺杂区域,使得电流能够沿着多个线性轴线在金属化层内流动。 第二金属化层通过导电路径连接到第二类型的掺杂区域,使得电流能够沿着多个线性轴线在金属化层内流动。 半导体器件的外表面上的触点可以同心地布置。
-
-
-
-
-
-
-