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    Electrochemically fabricated microprobes
    6.
    发明授权
    Electrochemically fabricated microprobes 有权
    电化学制造的微型纺织品

    公开(公告)号：US07504840B2

    公开(公告)日：2009-03-17

    申请号：US11244817

    申请日：2005-10-06

    申请人： Vacit Arat ,  Adam L. Cohen ,  Dennis R. Smalley ,  Ezekiel J. J. Kruglick ,  Richard T. Chen ,  Kieun Kim

    发明人： Vacit Arat ,  Adam L. Cohen ,  Dennis R. Smalley ,  Ezekiel J. J. Kruglick ,  Richard T. Chen ,  Kieun Kim

    IPC分类号： G01R31/02

    CPC分类号： G01R1/06711 ,  G01R1/06716 ,  G01R1/06733 ,  G01R1/06744 ,  G01R3/00

    摘要： Multilayer test probe structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments each probe structure may include a plurality of contact arms or contact tips that are used for contacting a specific pad or plurality of pads wherein the arms and/or tips are configured in such away so as to provide a scrubbing motion (e.g. a motion perpendicular to a primary relative movement motion between a probe carrier and the IC) as the probe element or array is made to contact an IC, or the like, and particularly when the motion between the probe or probes and the IC occurs primarily in a direction that is perpendicular to a plane of a surface of the IC. In some embodiments arrays of multiple probes are provided and even formed in desired relative position simultaneously.

    摘要翻译： 多层测试探针结构通过在多个覆盖层和粘附层中的一种或多种材料的沉积进行电化学制造。 在一些实施例中，每个探针结构可以包括用于接触特定垫或多个垫的多个接触臂或接触尖端，其中臂和/或尖端被配置成如此远离以提供擦洗运动（例如， 当探针元件或阵列与探针载体和IC之间的初级相对移动运动垂直的运动）与IC等接触时，特别是当探针或探针与IC之间的运动主要发生在 方向垂直于IC的表面的平面。 在一些实施例中，多个探针的阵列被提供并且甚至同时形成在期望的相对位置。

    ELECTROCHEMICALLY FABRICATED MICROPROBES
    7.
    发明申请
    ELECTROCHEMICALLY FABRICATED MICROPROBES 审中-公开
    电化学微孔

    公开(公告)号：US20090066351A1

    公开(公告)日：2009-03-12

    申请号：US12203102

    申请日：2008-09-02

    申请人： Vacit Arat ,  Adam L. Cohen ,  Dennis R. Smalley ,  Ezekiel J. J. Kruglick ,  Richard T. Chen ,  Kieun Kim

    发明人： Vacit Arat ,  Adam L. Cohen ,  Dennis R. Smalley ,  Ezekiel J. J. Kruglick ,  Richard T. Chen ,  Kieun Kim

    IPC分类号： G01R1/067 ,  G01R31/02

    CPC分类号： G01R1/06711 ,  G01R1/06716 ,  G01R1/06733 ,  G01R1/06744 ,  G01R3/00

    摘要： Multilayer test probe structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments each probe structure may include a plurality of contact arms or contact tips that are used for contacting a specific pad or plurality of pads wherein the arms and/or tips are configured in such away so as to provide a scrubbing motion (e.g. a motion perpendicular to a primary relative movement motion between a probe carrier and the IC) as the probe element or array is made to contact an IC, or the like, and particularly when the motion between the probe or probes and the IC occurs primarily in a direction that is perpendicular to a plane of a surface of the IC. In some embodiments arrays of multiple probes are provided and even formed in desired relative position simultaneously.

    摘要翻译： 多层测试探针结构通过在多个覆盖层和粘附层中的一种或多种材料的沉积进行电化学制造。 在一些实施例中，每个探针结构可以包括用于接触特定垫或多个垫的多个接触臂或接触尖端，其中臂和/或尖端被配置成如此远离以提供擦洗运动（例如， 当探针元件或阵列与探针载体和IC之间的初级相对移动运动垂直的运动）与IC等接触时，特别是当探针或探针与IC之间的运动主要发生在 方向垂直于IC的表面的平面。 在一些实施例中，多个探针的阵列被提供并且甚至同时形成在期望的相对位置。

    Microprobe tips and methods for making
    9.
    发明授权
    Microprobe tips and methods for making 有权
    微型笔尖和制作方法

    公开(公告)号：US07412767B2

    公开(公告)日：2008-08-19

    申请号：US11029217

    申请日：2005-01-03

    申请人： Kieun Kim ,  Adam L. Cohen ,  Willa M. Larsen ,  Richard T. Chen ,  Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael S. Lockard

    发明人： Kieun Kim ,  Adam L. Cohen ,  Willa M. Larsen ,  Richard T. Chen ,  Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael S. Lockard

    IPC分类号： H01R43/02 ,  H01R9/00

    CPC分类号： G01R1/0483 ,  G01R1/06716 ,  G01R1/07357 ,  G01R31/2886 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49211 ,  Y10T29/49213

    摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in over exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of a the tip material around carefully sized placed etching shields, via hot pressing, and the like.

    摘要翻译： 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性蚀刻硅的图案化孔中模制，通过在暴露在光致抗蚀剂中的空隙中模制，通过在牺牲材料中的空隙中模制， 由于牺牲材料在电介质材料的精细尺寸和定位的区域上的形成，通过各种各向同性的蚀刻尖端材料，围绕小心尺寸放置的蚀刻屏蔽件，通过热压等形成。

    Microprobe tips and methods for making
    10.
    发明授权
    Microprobe tips and methods for making 有权
    微型笔尖和制作方法

    公开(公告)号：US07273812B2

    公开(公告)日：2007-09-25

    申请号：US11178145

    申请日：2005-07-07

    申请人： Kieun Kim ,  Adam L. Cohen ,  Willa M. Larsen ,  Richard T. Chen ,  Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael S. Lockard ,  Christopher A. Bang

    发明人： Kieun Kim ,  Adam L. Cohen ,  Willa M. Larsen ,  Richard T. Chen ,  Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael S. Lockard ,  Christopher A. Bang

    IPC分类号： H01L21/44

    CPC分类号： C25D1/003 ,  G01R3/00 ,  Y10T29/49222

    摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.

    摘要翻译： 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性地蚀刻硅的图案化孔中模制，通过在曝光的光致抗蚀剂中形成的空隙中模制，通过在牺牲材料中的空隙中模制， 由于牺牲材料通过电介质材料的细小尺寸和定位的区域，经由热压等等仔细地尺寸和放置的蚀刻屏蔽部分上的尖端材料的各向同性蚀刻而形成。