公开(公告)号：US20100155253A1

公开(公告)日：2010-06-24

申请号：US12631632

申请日：2009-12-04

申请人： Kieun Kim ,  Adam L. Cohen ,  Willa M. Larsen ,  Richard T. Chen ,  Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael S. Lockard ,  Christopher A. Bang

发明人： Kieun Kim ,  Adam L. Cohen ,  Willa M. Larsen ,  Richard T. Chen ,  Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael S. Lockard ,  Christopher A. Bang

IPC分类号： C25D5/02 ,  B32B37/00 ,  C25D5/48

CPC分类号： G01R1/0483 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  G01R1/06716 ,  G01R1/06744 ,  G01R1/07314 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2886 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  Y10T156/10 ,  H01L2924/00

摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.

摘要翻译： 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性地蚀刻硅的图案化孔中模制，通过在曝光的光致抗蚀剂中形成的空隙中模制，通过在牺牲材料中的空隙中模制， 由于牺牲材料通过电介质材料的细小尺寸和定位的区域，经由热压等等仔细地尺寸和放置的蚀刻屏蔽部分上的尖端材料的各向同性蚀刻而形成。

公开(公告)号：US07273812B2

公开(公告)日：2007-09-25

申请号：US11178145

申请日：2005-07-07

申请人： Kieun Kim ,  Adam L. Cohen ,  Willa M. Larsen ,  Richard T. Chen ,  Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael S. Lockard ,  Christopher A. Bang

发明人： Kieun Kim ,  Adam L. Cohen ,  Willa M. Larsen ,  Richard T. Chen ,  Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael S. Lockard ,  Christopher A. Bang

IPC分类号： H01L21/44

CPC分类号： C25D1/003 ,  G01R3/00 ,  Y10T29/49222

摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.

摘要翻译： 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性地蚀刻硅的图案化孔中模制，通过在曝光的光致抗蚀剂中形成的空隙中模制，通过在牺牲材料中的空隙中模制， 由于牺牲材料通过电介质材料的细小尺寸和定位的区域，经由热压等等仔细地尺寸和放置的蚀刻屏蔽部分上的尖端材料的各向同性蚀刻而形成。

公开(公告)号：US07412767B2

公开(公告)日：2008-08-19

申请号：US11029217

申请日：2005-01-03

申请人： Kieun Kim ,  Adam L. Cohen ,  Willa M. Larsen ,  Richard T. Chen ,  Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael S. Lockard

发明人： Kieun Kim ,  Adam L. Cohen ,  Willa M. Larsen ,  Richard T. Chen ,  Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael S. Lockard

IPC分类号： H01R43/02 ,  H01R9/00

CPC分类号： G01R1/0483 ,  G01R1/06716 ,  G01R1/07357 ,  G01R31/2886 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49211 ,  Y10T29/49213

摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in over exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of a the tip material around carefully sized placed etching shields, via hot pressing, and the like.

摘要翻译： 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性蚀刻硅的图案化孔中模制，通过在暴露在光致抗蚀剂中的空隙中模制，通过在牺牲材料中的空隙中模制， 由于牺牲材料在电介质材料的精细尺寸和定位的区域上的形成，通过各种各向同性的蚀刻尖端材料，围绕小心尺寸放置的蚀刻屏蔽件，通过热压等形成。

公开(公告)号：US07241689B2

公开(公告)日：2007-07-10

申请号：US11029169

申请日：2005-01-03

申请人： Kieun Kim ,  Adam L. Cohen ,  Willa M. Larsen ,  Richard T. Chen ,  Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael S. Lockard

发明人： Kieun Kim ,  Adam L. Cohen ,  Willa M. Larsen ,  Richard T. Chen ,  Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael S. Lockard

IPC分类号： H01L21/44

CPC分类号： H01R13/187 ,  H01L24/72 ,  H01L2924/15747 ,  H01L2924/00

摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in over exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of a the tip material around carefully sized placed etching shields, via hot pressing, and the like.

摘要翻译： 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性蚀刻硅的图案化孔中模制，通过在暴露在光致抗蚀剂中的空隙中模制，通过在牺牲材料中的空隙中模制， 由于牺牲材料在电介质材料的精细尺寸和定位的区域上的形成，通过各种各向同性的蚀刻尖端材料，围绕小心尺寸放置的蚀刻屏蔽件，通过热压等形成。

公开(公告)号：US07363705B2

公开(公告)日：2008-04-29

申请号：US11028962

申请日：2005-01-03

申请人： Kieun Kim ,  Adam L. Cohen ,  Willa M. Larsen ,  Richard T. Chen ,  Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael S. Lockard

发明人： Kieun Kim ,  Adam L. Cohen ,  Willa M. Larsen ,  Richard T. Chen ,  Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael S. Lockard

IPC分类号： H01R9/00

CPC分类号： G01R3/00 ,  G01R1/06744 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49222

摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in over exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of a the tip material around carefully sized placed etching shields, via hot pressing, and the like.

摘要翻译： 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性蚀刻硅的图案化孔中模制，通过在暴露在光致抗蚀剂中的空隙中模制，通过在牺牲材料中的空隙中模制， 由于牺牲材料在电介质材料的精细尺寸和定位的区域上的形成，通过各种各向同性的蚀刻尖端材料，围绕小心尺寸放置的蚀刻屏蔽件，通过热压等形成。

公开(公告)号：US07878385B2

公开(公告)日：2011-02-01

申请号：US11929539

申请日：2007-10-30

申请人： Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Adam L. Cohen ,  Kieun Kim ,  Gang Zhang ,  Richard T. Chen ,  Christopher A. Bang ,  Vacit Arat ,  Michael S. Lockard ,  Uri Frodis ,  Pavel B. Lembrikov ,  Jeffrey A. Thompson

发明人： Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Adam L. Cohen ,  Kieun Kim ,  Gang Zhang ,  Richard T. Chen ,  Christopher A. Bang ,  Vacit Arat ,  Michael S. Lockard ,  Uri Frodis ,  Pavel B. Lembrikov ,  Jeffrey A. Thompson

IPC分类号： B23K31/02

CPC分类号： B23K35/0222 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  C25D1/12 ,  G01R1/06744 ,  G01R1/07307 ,  G01R1/07314 ,  G01R3/00 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L24/95 ,  H01L2221/68313 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/10126 ,  H01L2224/1147 ,  H01L2224/11831 ,  H01L2224/1184 ,  H01L2224/1191 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/81001 ,  H01L2224/81054 ,  H01L2224/81136 ,  H01L2224/8121 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3651 ,  H01L2924/3841 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00012

摘要： Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.

摘要翻译： 本发明的实施例涉及在临时衬底上形成微探针（即柔性电气或电子接触元件），切割单独的探针阵列，然后将阵列转移到空间变压器或其它永久衬底。 在将探针从其上形成探针的临时基底分离出来之前，本发明的一些实施方案将探针转移到永久性基底上，而其他实施方案相反。 一些实施例，在转移之前去除牺牲材料，而其它实施例在转移后去除牺牲材料。 一些实施例涉及使用一个或多个具有增强的纵横比（即，高度与宽度比）的焊料凸块来将第一和第二电气部件接合在一起，这是由于至少部分地由保持材料的环围绕凸块而得到的。 保留材料可以用作焊接掩模材料。

公开(公告)号：US20100134131A1

公开(公告)日：2010-06-03

申请号：US12625505

申请日：2009-11-24

申请人： Richard T. Chen ,  Ezekiel J.J. Kruglick ,  Christopher A. Bang ,  Vacit Arat ,  Adam L. Cohen ,  Kieun Kim ,  Gang Zhang ,  Dennis R. Smalley

发明人： Richard T. Chen ,  Ezekiel J.J. Kruglick ,  Christopher A. Bang ,  Vacit Arat ,  Adam L. Cohen ,  Kieun Kim ,  Gang Zhang ,  Dennis R. Smalley

IPC分类号： G01R31/02

CPC分类号： A61N1/00 ,  C25D1/00 ,  C25D1/003

摘要： Multilayer probe structures for testing semiconductor die are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include generally helical shaped configurations, helical shape configurations with narrowing radius as the probe extends outward from a substrate, bellows-like configurations, and the like. In some embodiments arrays of multiple probes are provided.

摘要翻译： 用于测试半导体管芯的多层探针结构通过多个覆盖层和粘附层中的一种或多种材料的沉积进行电化学制造。 在一些实施例中，结构可以包括大致螺旋形构造，当探针从衬底向外延伸，波纹管状构造等时具有窄半径的螺旋形构造。 在一些实施例中，提供了多个探针的阵列。

公开(公告)号：US20090256583A1

公开(公告)日：2009-10-15

申请号：US12429110

申请日：2009-04-23

申请人： Richard T. Chen ,  Ezekiel J.J. Kruglick ,  Christopher A. Bang ,  Vacit Arat ,  Adam L. Cohen ,  Kieun Kim ,  Gang Zhang ,  Dennis R. Smalley

发明人： Richard T. Chen ,  Ezekiel J.J. Kruglick ,  Christopher A. Bang ,  Vacit Arat ,  Adam L. Cohen ,  Kieun Kim ,  Gang Zhang ,  Dennis R. Smalley

IPC分类号： G01R1/067 ,  G01R31/02

CPC分类号： G01R3/00 ,  A61N1/00 ,  C25D1/00 ,  C25D1/003 ,  G01R1/06722 ,  G01R1/06744 ,  G01R1/06761

摘要： Multilayer probe structures for testing or otherwise making electrical contact with semiconductor die or other electronic components are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include configurations intended to enhance functionality, buildability, or both.

摘要翻译： 用于测试或以其他方式与半导体管芯或其他电子部件进行电接触的多层探针结构通过在多个覆盖层和附着层中的一种或多种材料的沉积进行电化学制造。 在一些实施例中，结构可以包括旨在增强功能性，可构建性或两者的配置。

公开(公告)号：US20080211524A1

公开(公告)日：2008-09-04

申请号：US11928868

申请日：2007-10-30

申请人： Richard T. Chen ,  Ezekiel J.J. Kruglick ,  Christopher A. Bang ,  Vacit Arat ,  Adam L. Cohen ,  Kieun Kim ,  Gang Zhang ,  Dennis R. Smalley

发明人： Richard T. Chen ,  Ezekiel J.J. Kruglick ,  Christopher A. Bang ,  Vacit Arat ,  Adam L. Cohen ,  Kieun Kim ,  Gang Zhang ,  Dennis R. Smalley

IPC分类号： G01R1/073

CPC分类号： A61N1/00 ,  C25D1/00 ,  C25D1/003

摘要： Multilayer probe structures for testing semiconductor die are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include generally helical shaped configurations, helical shape configurations with narrowing radius as the probe extends outward from a substrate, bellows-like configurations, and the like. In some embodiments arrays of multiple probes are provided.

摘要翻译： 用于测试半导体管芯的多层探针结构通过多个覆盖层和粘附层中的一种或多种材料的沉积进行电化学制造。 在一些实施例中，结构可以包括大致螺旋形构造，当探针从衬底向外延伸，波纹管状构造等时具有窄半径的螺旋形构造。 在一些实施例中，提供了多个探针的阵列。

公开(公告)号：US07504840B2

公开(公告)日：2009-03-17

申请号：US11244817

申请日：2005-10-06

申请人： Vacit Arat ,  Adam L. Cohen ,  Dennis R. Smalley ,  Ezekiel J. J. Kruglick ,  Richard T. Chen ,  Kieun Kim

发明人： Vacit Arat ,  Adam L. Cohen ,  Dennis R. Smalley ,  Ezekiel J. J. Kruglick ,  Richard T. Chen ,  Kieun Kim

IPC分类号： G01R31/02

CPC分类号： G01R1/06711 ,  G01R1/06716 ,  G01R1/06733 ,  G01R1/06744 ,  G01R3/00

摘要： Multilayer test probe structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments each probe structure may include a plurality of contact arms or contact tips that are used for contacting a specific pad or plurality of pads wherein the arms and/or tips are configured in such away so as to provide a scrubbing motion (e.g. a motion perpendicular to a primary relative movement motion between a probe carrier and the IC) as the probe element or array is made to contact an IC, or the like, and particularly when the motion between the probe or probes and the IC occurs primarily in a direction that is perpendicular to a plane of a surface of the IC. In some embodiments arrays of multiple probes are provided and even formed in desired relative position simultaneously.

摘要翻译： 多层测试探针结构通过在多个覆盖层和粘附层中的一种或多种材料的沉积进行电化学制造。 在一些实施例中，每个探针结构可以包括用于接触特定垫或多个垫的多个接触臂或接触尖端，其中臂和/或尖端被配置成如此远离以提供擦洗运动（例如， 当探针元件或阵列与探针载体和IC之间的初级相对移动运动垂直的运动）与IC等接触时，特别是当探针或探针与IC之间的运动主要发生在 方向垂直于IC的表面的平面。 在一些实施例中，多个探针的阵列被提供并且甚至同时形成在期望的相对位置。