Method and apparatus for performing automated circuit board solder
quality inspections
    4.
    再颁专利
    Method and apparatus for performing automated circuit board solder quality inspections 失效
    执行自动化电路板焊料质量检查的方法和装置

    公开(公告)号:USRE35423E

    公开(公告)日:1997-01-14

    申请号:US182841

    申请日:1994-01-14

    摘要: A method and apparatus for measuring structural characteristics of a manufactured circuit board containing solder joints by automated real-time digital X-ray radiographic inspection techniques. A circuit board under examination is automatically positioned by a digitally controlled multi-axis positioning system between an electronic X-ray source and an electronic X-ray imaging system, X-rays, in a beam of X-rays from the X-ray source, are directed towards the circuit board. The X-rays are absorbed, scattered and transmitted through the circuit board. The X-rays transmitted through the circuit board are directed upon the X-ray imaging system. The X-ray imaging system converts the transmitted X-rays into digital images which represent the radiographic density of the portion of the circuit board under examination. The digital images are stored within a digital image processor. A computer, under program control, performs calculational measurements on the digital images so as to measure the structural characteristics of the solder joints and components on the circuit board. The calculational measurements are compared to predetermined standards corresponding to acceptable quality standards programmed into the computer. In response to the comparison, the computer provides an accept/reject decision on the circuit board in addition to providing manufacturing process control information for correction of found defects.The questions raised in reexamination request No. 90/002,298, filed Mar. 15, 1991, have been considered and the results thereof are reflected in this reissue patent which constitutes the reexamination certificate required by 35 U.S.C. 307 as provided in 37 CRF 1.570(e).

    摘要翻译: 一种用于通过自动实时数字X射线照相检查技术测量制造的包含焊点的电路板的结构特性的方法和装置。 正在检查的电路板通过数字控制的多轴定位系统在电子X射线源和电子X射线成像系统之间通过X射线从X射线源X射线自动定位 ,指向电路板。 X射线被吸收,散射并透过电路板。 通过电路板传输的X射线被引导到X射线成像系统。 X射线成像系统将透射的X射线转换为表示正在检查的电路板的部分的放射照相密度的数字图像。 数字图像存储在数字图像处理器中。 计算机在程序控制下,对数字图像执行计算测量,以便测量电路板上焊点和部件的结构特性。 将计算测量与对应于编入计算机的可接受的质量标准的预定标准进行比较。 响应于比较,除了提供用于校正发现的缺陷的制造过程控制信息之外,计算机还在电路板上提供接受/拒绝决定。 已经考虑了1991年3月15日提交的第90 / 002,298号复审请求中提出的问题,其结果反映在该重新颁发专利中,该专利构成了35U.S.C.所要求的复审证书。 307如CRF 1.570(e)所述。

    Runtime flash device detection and configuration for flash data management software
    5.
    发明申请
    Runtime flash device detection and configuration for flash data management software 有权
    闪存数据管理软件的运行时闪存设备检测和配置

    公开(公告)号:US20070291552A1

    公开(公告)日:2007-12-20

    申请号:US11895185

    申请日:2007-08-23

    IPC分类号: G11C11/34

    CPC分类号: G11C16/20

    摘要: A memory device driver is described that can support multiple differing memory devices, in particular, differing Flash memory devices, by being internally re-configurable to match the driving and management requirements of the particular memory device. This allows for a limited number of operating system versions to be produced and maintained for a given system by the manufacturer, reducing the possibility of misconfiguration of the system/device by the inadvertent updating or programming of the wrong operating system version by an end user or service personnel. The resulting driver routine and/or operating system is also typically smaller than operating systems/drivers that compile in or load multiple separate drivers into themselves. In one embodiment of the present invention, the software driver is automatically configures itself by querying the memory device for a device ID and/or manufacturer code or by detecting a specific characteristic of the memory device being driven.

    摘要翻译: 描述了可以通过在内部可重新配置以匹配特定存储器件的驱动和管理要求来支持多个不同存储器件,特别是不同闪存器件的存储器件驱动器。 这允许制造商为给定的系统生产和维护有限数量的操作系统版本,从而减少由最终用户无意地更新或编程错误的操作系统版本的系统/设备的错误配置的可能性,或者 服务人员。 所产生的驱动程序例程和/或操作系统通常也小于在其中编译或加载多个单独驱动程序的操作系统/驱动程序。 在本发明的一个实施例中,软件驱动程序通过向存储器件询问设备ID和/或制造商代码或者通过检测被驱动的存储器件的特定特性来自动配置自身。

    Runtime flash device detection and configuration for flash data management software

    公开(公告)号:US07277978B2

    公开(公告)日:2007-10-02

    申请号:US10663279

    申请日:2003-09-16

    IPC分类号: G06F12/00

    CPC分类号: G11C16/20

    摘要: A memory device driver is described that can support multiple differing memory devices, in particular, differing Flash memory devices, by being internally re-configurable to match the driving and management requirements of the particular memory device. This allows for a limited number of operating system versions to be produced and maintained for a given system by the manufacturer, reducing the possibility of misconfiguration of the system/device by the inadvertent updating or programming of the wrong operating system version by an end user or service personnel. The resulting driver routine and/or operating system is also typically smaller than operating systems/drivers that compile in or load multiple separate drivers into themselves. In one embodiment of the present invention, the software driver is automatically configures itself by querying the memory device for a device ID and/or manufacturer code or by detecting a specific characteristic of the memory device being driven.

    Method and apparatus for performing automated circuit board solder
quality inspections
    8.
    发明授权
    Method and apparatus for performing automated circuit board solder quality inspections 失效
    执行自动化电路板焊料质量检查的方法和装置

    公开(公告)号:US4809308A

    公开(公告)日:1989-02-28

    申请号:US831997

    申请日:1986-02-20

    摘要: A method and apparatus for measuring structural characteristics of a manufactured circuit board containing solder joints by automated real-time digital X-ray radiographic inspection techniques. A circuit board under examination is automatically positioned by a digitally controlled multi-axis positioning system between an electronic X-ray source and an electronic X-ray imaging system. X-rays, in a beam of X-rays from the X-ray source, are directed towards the circuit board. The X-rays are absorbed, scattered and transmitted through the circuit board. The X-rays transmitted through the circuit board are directed upon the X-ray imaging system. The X-ray imaging system converts the transmitted X-rays into digital images which represent the radiographic density of the portion of the circuit board under examination. The digital images are stored within a digital image processor. A computer, under program control, performs calculational measurements on the digital images so as to measure the structural characteristics of the solder joints and components on the circuit board. The calculational measurements are compared to predetermined standards corresponding to acceptable quality standards programmed into the computer. In response to the comparison, the computer provides an accept/reject decision on the circuit board in addition to providing manufacturing process control information for correction of found defects.

    摘要翻译: 一种用于通过自动实时数字X射线照相检查技术测量制造的包含焊点的电路板的结构特性的方法和装置。 正在检查的电路板通过数字控制的多轴定位系统在电子X射线源和电子X射线成像系统之间自动定位。 来自X射线源的X射线束中的X射线被引向电路板。 X射线被吸收,散射并透过电路板。 通过电路板传输的X射线被引导到X射线成像系统。 X射线成像系统将透射的X射线转换为表示正在检查的电路板的部分的放射照相密度的数字图像。 数字图像存储在数字图像处理器中。 计算机在程序控制下,对数字图像执行计算测量,以便测量电路板上焊点和部件的结构特性。 将计算测量与对应于编入计算机的可接受的质量标准的预定标准进行比较。 响应于比较,除了提供用于校正发现的缺陷的制造过程控制信息之外,计算机还在电路板上提供接受/拒绝决定。

    Method for reading while writing to a single partition flash memory
    10.
    发明申请
    Method for reading while writing to a single partition flash memory 有权
    在写入单个分区闪存时进行读取的方法

    公开(公告)号:US20070033363A1

    公开(公告)日:2007-02-08

    申请号:US11545325

    申请日:2006-10-10

    申请人: Tieniu Li Van Nguyen

    发明人: Tieniu Li Van Nguyen

    IPC分类号: G06F13/00 G06F12/00

    CPC分类号: G11C16/26 G11C2216/20

    摘要: A device manager receives an operation request for a memory device. The device manager suspends interrupts to be serviced and determines if there is sufficient time available to perform the requested operation. If there is sufficient time available and the device manager is in an exclusive mode, the state of the memory device is checked to determine if it is currently executing an operation. If so, this operation is suspended and the requested operation is issued to the memory device. The device manager polls the memory device to determine when the requested operation has been completed. Upon completion, the interrupts are re-enabled and control of the memory device is returned to the system.

    摘要翻译: 设备管理器接收对存储器设备的操作请求。 设备管理器暂停要维修的中断,并确定是否有足够的时间来执行请求的操作。 如果有足够的时间可用并且设备管理器处于独占模式,则检查存储器件的状态以确定其是否正在执行操作。 如果是这样,则该操作被暂停,并且所请求的操作被发送到存储器设备。 设备管理器轮询存储设备以确定所请求的操作何时完成。 完成后,重新启用中断,并将存储设备的控制返回系统。