Transmission line having a transforming impedance
    2.
    发明授权
    Transmission line having a transforming impedance 失效
    传输线具有变换阻抗

    公开(公告)号:US07157987B2

    公开(公告)日:2007-01-02

    申请号:US11023884

    申请日:2004-12-23

    IPC分类号: H03H7/38

    摘要: A transmission line for high-frequency differential signals and having a transforming impedance is formed into a substrate. The transmission line is comprised of a first slot, the opposing surfaces of which carry a conductive surface capable of carrying electrical signals. By virtue of their dimensions, spacing and dielectric filler, the conductive surfaces constitute a transmission line. A second slot, also with opposing surfaces, each of which also carry a conductive surface but which are spaced differently than the opposing surfaces of the first slot, provide a second transmission line but with a different impedance. The impedances between the two transmission lines are transformed by an impedance transition section of transmission line that is slot section the dimensions of which are tapered to meet the different slot dimensions of the two different transmission line segments.

    摘要翻译: 用于高频差分信号并具有变换阻抗的传输线被形成为衬底。 传输线包括第一槽,其相对表面承载能承载电信号的导电表面。 由于其尺寸,间距和介电填料,导电表面构成传输线。 第二槽还具有相对的表面,每个表面也承载导电表面,但是它们的间隔不同于第一槽的相对表面,提供第二传输线但具有不同的阻抗。 两条传输线之间的阻抗通过传输线的阻抗转变部分变换,该传输线是尺寸为锥形的槽部,以满足两个不同传输线段的不同槽尺寸。

    Transmission line with a transforming impedance and solder lands
    3.
    发明授权
    Transmission line with a transforming impedance and solder lands 失效
    具有变换阻抗和焊盘的传输线

    公开(公告)号:US07154355B2

    公开(公告)日:2006-12-26

    申请号:US11021830

    申请日:2004-12-24

    IPC分类号: H01P3/08

    摘要: A transmission line for high-frequency differential signals and having a transforming impedance is formed into a substrate. The transmission line is comprised of a slot, the opposing surfaces of which carry a conductive surface capable of carrying electrical signals. The conductive surface on the opposing surfaces is gradually receded along a length of the slot. An The transmission line of claim 1, further including a non-air dielectric filling the space between the opposing faces in said second length of said slot, said non-air dielectric having a thickness that extends from the depth D, to the bottom of the slot at the first end of said second length, the thickness of the non-air dielectric continuously increasing along said second length up to the substrate surface at the second end of the second length. equivalent amount of metallization is applied on the substrate's surface and electrically continuous with conductive surfaces on the slot's opposing sidewalls. The metallization on the substrate's surface provide solder lands. Dielectric in the slot prevents solder wicking.

    摘要翻译: 用于高频差分信号并具有变换阻抗的传输线被形成为衬底。 传输线包括一个槽,其相对表面承载能承载电信号的导电表面。 相对表面上的导电表面沿着槽的长度逐渐减小。 根据权利要求1所述的传输线,还包括填充所述槽的所述第二长度中的相对面之间的空间的非空气介质,所述非空气电介质具有从深度D延伸到所述槽的底部的厚度 在所述第二长度的第一端处,所述非空气介质的厚度在所述第二长度的第二端处沿着所述第二长度连续增加到所述衬底表面。 在衬底的表面上施加等量的金属化,并且与槽的相对的侧壁上的导电表面电连接。 衬底表面上的金属化提供焊接区域。 插槽中的介质防止焊锡芯吸。

    Transmission line with a transforming impedance and solder lands
    10.
    发明申请
    Transmission line with a transforming impedance and solder lands 审中-公开
    具有变换阻抗和焊盘的传输线

    公开(公告)号:US20070188261A1

    公开(公告)日:2007-08-16

    申请号:US11643076

    申请日:2006-12-21

    IPC分类号: H01P5/02 H01P3/08

    摘要: A transmission line for high-frequency differential signals and having a transforming impedance is formed into a substrate. The transmission line is comprised of a slot, the opposing surfaces of which carry a conductive surface capable of carrying electrical signals. The conductive surface on the opposing surfaces is gradually receded along a length of the slot. An equivalent amount of metallization is applied on the substrate's surface and electrically continuous with conductive surfaces on the slot's opposing sidewalls. The metallization on the substrate's surface provide solder lands. Dielectric in the slot prevents solder wicking.

    摘要翻译: 用于高频差分信号并具有变换阻抗的传输线被形成为衬底。 传输线包括一个槽,其相对表面承载能承载电信号的导电表面。 相对表面上的导电表面沿着槽的长度逐渐减小。 在基板的表面上施加等量的金属化,并且与狭槽相对的侧壁上的导电表面电连接。 衬底表面上的金属化提供焊接区域。 插槽中的介质防止焊锡芯吸。