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公开(公告)号：US09660350B2
公开(公告)日：2017-05-23
申请号：US14400382
申请日：2013-05-06
Applicant: THOMSON LICENSING
Inventor： Dominique Lo Hine Tong , Philippe Minard , Jean-Luc Robert
CPC classification number: H01Q13/106 , H01P3/023 , H01Q1/38 , H01Q1/521 , H01Q9/42 , H01Q21/28 , H05K1/0298 , H05K3/22
Abstract: The present invention relates to a method for realizing a short-circuited slot-line on a multilayer substrate comprising at least a first conductive layer, a dielectric layer and a second conductive layer, the method comprising the following steps: etching in the first conductive layer a slot-line having an electrical length L, etching in the first conductive layer, around the slot-line, a first portion of a first band having an electrical length L1≦L, etching in the first conductive layer, around the slot-line, a second portion of said first band, having an electrical length L2≦L, etching in the second conductive layer, a second band in the form of a loop having an electrical length L3, one end of the second band being connected to the first part of the first band and the other end of the second band being connected to the second part of the first band so as to form a conductive loop. The method is used notably to realize isolating slot-lines and slot-antennae.
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2.发明授权公开(公告)号：US09362605B2
公开(公告)日：2016-06-07
申请号：US14131543
申请日：2011-07-11
Applicant: Hiroshi Shinoda , Takahide Terada , Kazunori Hara
Inventor： Hiroshi Shinoda , Takahide Terada , Kazunori Hara
Abstract: An electromagnetic wave propagation device includes multiple planar propagation media each formed by laminating at least one planar conductor and at least one planar dielectric, multiple transceivers for transmitting and receiving information among electronic apparatuses, and a first interface for transmitting and receiving the electromagnetic wave between the transceivers and the planar propagation media. Planar dielectric spacers are provided for isolating the multiple planar propagation media from one another. The planar propagation medium is disposed to have an overlapped part with at least the other of the planar propagation media so that an obverse face of the medium and a reverse face of the other medium are at least partially overlapped with each other. The planar conductor is provided with an electromagnetic wave linking unit at the overlapped part that transmits and receives the electromagnetic wave between the planar propagation media.
Abstract translation: 电磁波传播装置包括多个平面传播介质，每个平面传播介质通过层叠至少一个平面导体和至少一个平面介质，用于在电子设备之间发送和接收信息的多个收发器，以及用于在电子设备之间发送和接收电磁波的第一接口 收发器和平面传播介质。 提供平面电介质间隔物用于将多个平面传播介质彼此隔离。 平面传播介质设置成与平面传播介质中的至少另一个具有重叠部分，使得介质的正面和另一介质的反面至少部分地彼此重叠。 平面导体在重叠部分设置有电磁波连接单元，其在平面传播介质之间传送和接收电磁波。
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3.发明申请Mode Generator Device for a Satellite Antenna System and Method for Producing the Same 有权卫星天线系统的模式发生器装置及其制造方法公开(公告)号：US20140253379A1
公开(公告)日：2014-09-11
申请号：US14349741
申请日：2012-10-02
Applicant: NEWTEC CY
Inventor： Bart Baekelandt , Philip Sanders , Guy Verstraeten
CPC classification number: H01Q13/0233 , H01P1/16 , H01P3/023 , H01P3/123 , H01Q13/0208 , H01Q13/025 , H01Q19/132 , H04B14/008
Abstract: The present invention is related to a device for generating waveguide modes for use in a feed horn of a satellite antenna system, said waveguide modes comprising at least one excitation mode of higher order than the fundamental mode, said device comprising a waveguide containing a first waveguide section with at least three longitudinal slots extending in the inner side of said waveguide, characterised in that said waveguide contains a second waveguide section with at least three longitudinal slots extending in said inner side of said waveguide.
Abstract translation: 本发明涉及一种用于产生用于卫星天线系统的馈电喇叭的波导模式的装置，所述波导模式包括比基模更高次的至少一种激励模式，所述装置包括包含第一波导的波导 其中至少三个纵向狭槽在所述波导的内侧延伸，其特征在于，所述波导包含具有在所述波导的所述内侧中延伸的至少三个纵向槽的第二波导段。
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公开(公告)号：US20130082379A1
公开(公告)日：2013-04-04
申请号：US13248673
申请日：2011-09-29
Applicant: Michael Boers , Arya Reza Behzad , Ahmadreza Rofougaran , Sam Ziqun Zhao , Jesus Alfonso Castaneda
Inventor： Michael Boers , Arya Reza Behzad , Ahmadreza Rofougaran , Sam Ziqun Zhao , Jesus Alfonso Castaneda
IPC: H01L23/48
CPC classification number: H01L23/49811 , H01L23/5222 , H01L23/66 , H01L24/16 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L2223/6627 , H01L2223/6677 , H01L2223/6683 , H01L2224/0401 , H01L2224/0557 , H01L2224/05647 , H01L2224/131 , H01L2224/14181 , H01L2224/16225 , H01L2224/17181 , H01L2224/81815 , H01L2225/06531 , H01L2225/06572 , H01L2924/00014 , H01L2924/1461 , H01L2924/15311 , H01P1/182 , H01P3/023 , H01P3/12 , H01P3/121 , H01L2924/014 , H01L2924/00 , H01L2224/05552
Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.
Abstract translation: 公开了用于在集成电路内的集成电路和/或功能模块之间进行无线通信的方法和装置。 半导体器件制造操作使用预定的照相和/或化学处理步骤顺序在半导体衬底上形成一个或多个功能模块。 功能模块耦合到形成在半导体衬底上和/或连接到其上以形成集成电路的集成波导。 功能模块通过集成波导使用多址传输方案彼此通信以及其他集成电路。 一个或多个集成电路可以耦合到集成电路载体以形成多芯片模块。 多芯片模块可以耦合到半导体封装以形成封装的集成电路。
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公开(公告)号：US20070188257A1
公开(公告)日：2007-08-16
申请号：US11643075
申请日：2006-12-21
Applicant: David Brunker , Victor Zaderej
Inventor： David Brunker , Victor Zaderej
IPC: H01P3/08
CPC classification number: H05K9/0018 , H01P3/023 , H05K1/0221 , H05K1/024 , H05K3/107 , H05K2201/0715 , H05K2201/09036 , H05K2201/09236 , H05K2201/09618 , H05K2201/09981
Abstract: An electro-magnetically shielded slot-transmission line is formed by metallizing the opposing sides of a slot cut through a dielectric substrate. A ground plane is deposited on the bottom of the substrate. Conductive vias through the substrate and that contact the ground plane are located on both sides of the metallized slot surfaces. Conductive pads on the upper surface and which contact the vias provide additional shielding.
Abstract translation: 通过金属化通过电介质基板切割的槽的相对侧而形成电磁屏蔽槽传输线。 接地平面沉积在基底的底部。 通过基板并接触接地平面的导电孔位于金属化槽表面的两侧。 上表面上的导电焊盘与通孔接触提供额外的屏蔽。
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Patent Agency Ranking
公开(公告)号：US20040041668A1
公开(公告)日：2004-03-04
申请号：US10373091
申请日：2003-02-26
Inventor： Shigeyuki Mikami , Tetsuya Kochi , Hiroyasu Matsuzaki , Kazutaka Mukaiyama , Koichi Sakamoto , Yohei Ishikawa , Kiyoharu Kochi , Akiko Kochi
IPC: H01P001/203
Abstract: A high-frequency circuit device includes a dielectric substrate. A planar conductor is provided on each of top and bottom surfaces of the dielectric substrate and a slot line is formed on the top surface. Also, undesired-wave propagation preventing circuits, each including multistage band-elimination filters, are provided on the top surface of the dielectric substrate, with the slot line therebetween. Each of the band-elimination filters includes two conductive lines and a resonator which is provided at a portion of one of the conductive lines and which includes two spiral lines. Accordingly, propagation of an undesired wave of the band whose center is the resonance frequency of the resonator can be prevented.
Abstract translation: 高频电路装置包括电介质基板。 平面导体设置在电介质基板的每个顶表面和底表面上，并且在顶表面上形成槽线。 此外，在电介质基板的上表面上设置有包括多级带阻滤波器的不希望波传播阻止电路，其间具有槽线。 每个带除滤波器包括两条导线和一个谐振器，该谐振器设置在一条导线的一部分并且包括两条螺旋线。 因此，可以防止其中心是谐振器的谐振频率的频带的不需要的波的传播。
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公开(公告)号：US2907957A
公开(公告)日：1959-10-06
申请号：US32902652
申请日：1952-12-31
Applicant: CGS LAB INC
Inventor： DEWITZ GERHARD H
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8.发明申请公开(公告)号：US20140167882A1
公开(公告)日：2014-06-19
申请号：US14131543
申请日：2011-07-11
Applicant: Hiroshi Shinoda , Takahide Terada , Kazunori Hara
Inventor： Hiroshi Shinoda , Takahide Terada , Kazunori Hara
IPC: H01P5/12
Abstract: An electromagnetic wave propagation device includes multiple planar propagation media each formed by laminating at least one planar conductor and at least one planar dielectric, multiple transceivers for transmitting and receiving information among electronic apparatuses, and a first interface for transmitting and receiving the electromagnetic wave between the transceivers and the planar propagation media. Planar dielectric spacers are provided for isolating the multiple planar propagation media from one another. The planar propagation medium is disposed to have an overlapped part with at least the other of the planar propagation media so that an obverse face of the medium and a reverse face of the other medium are at least partially overlapped with each other. The planar conductor is provided with an electromagnetic wave linking unit at the overlapped part that transmits and receives the electromagnetic wave between the planar propagation media.
Abstract translation: 电磁波传播装置包括多个平面传播介质，每个平面传播介质通过层叠至少一个平面导体和至少一个平面介质，用于在电子设备之间发送和接收信息的多个收发器，以及用于在电子设备之间发送和接收电磁波的第一接口 收发器和平面传播介质。 提供平面电介质间隔物用于将多个平面传播介质彼此隔离。 平面传播介质设置成与平面传播介质中的至少另一个具有重叠部分，使得介质的正面和另一介质的反面至少部分地彼此重叠。 平面导体在重叠部分设置有电磁波连接单元，其在平面传播介质之间传送和接收电磁波。
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公开(公告)号：US20050168303A1
公开(公告)日：2005-08-04
申请号：US11023880
申请日：2004-12-23
Applicant: David Brunker , Richard Nelson , Philip Dambach
Inventor： David Brunker , Richard Nelson , Philip Dambach
CPC classification number: H01P3/023
Abstract: A slot transmission line patch connector, capable of bridging one or more slot transmission lines is comprised of an elongated dielectric connector body. The dielectric connector body is formed to have one or more slot transmission lines. Each transmission line formed in the dielectric body has first and second ends, each of which mates with corresponding first and second slot transmission lines. Alternate embodiments contemplate a dielectric body to which is attached one or more slot transmission line substrates, each of which supports one or more slot transmission lines. Each of the slot transmission line substrates provide one or more slot transmission lines that each bridge or “patch” together two, separate slot transmission lines together.
Abstract translation: 能够桥接一个或多个狭槽传输线的插槽传输线贴片连接器由细长的电介质连接器主体构成。 电介体连接器体形成为具有一个或多个槽传输线。 形成在电介质体中的每个传输线具有第一和第二端，每个端与第一和第二槽传输线相配合。 替代实施例设想一个电介质体，其上附着一个或多个槽传输线基板，每个槽传输线支撑一个或多个槽传输线。 每个时隙传输线基板提供一个或多个时隙传输线，每个时隙传输线将两个分离的时隙传输线桥接或“补片”在一起。
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公开(公告)号：US20040159460A1
公开(公告)日：2004-08-19
申请号：US10481252
申请日：2004-02-05
Inventor： George Passiopoulos , Ilpo Kokkonen , Olli Salmela
IPC: H01B007/08
CPC classification number: H05K1/0237 , H01P3/006 , H01P3/02 , H01P3/023 , H01P3/081 , H01P3/085 , H05K1/0224 , H05K1/0263 , H05K2201/09672 , H05K2201/0979
Abstract: A conductive structure having a conductor for carrying a signal at a one or more operating frequencies of the structure, the conductor comprising: at least two electrically conductive strips spaced apart by a dielectric and arranged in parallel to extend from a first node to a second node, the conductive strips being interconnected between the nodes by at least one inter-strip electrically conductive connection through the dielectric; the maximum physical dimension of the or each inter-strip connection and the maximum physical separation of potentially successive inter-strip connections being equal to or less than one quarter of the free space wavelength corresponding to the minimum operating frequency of the structure.
Abstract translation: 一种导电结构，具有用于在该结构的一个或多个工作频率处传送信号的导体，所述导体包括：至少两个由电介质隔开并且平行布置的导电条，以从第一节点延伸到第二节点 ，所述导电条通过所述电介质至少一个带间导电连接在所述节点之间互连; 每个条带间连接的最大物理尺寸和潜在连续条带间连接的最大物理间隔等于或小于对应于结构的最小工作频率的自由空间波长的四分之一。
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