摘要:
A method identifies a real time downstream to processing capability within a production environment using a computerized device. The processing sequences perform operations utilizing one or more tools. The method also determines if an upstream tool capacity is greater than a downstream tool capacity. When the upstream tool capacity is greater than the downstream tool capacity the method calculates an overlap value. The method then adjusts the run rate for the upstream tool to by dividing the run rate of the upstream tool by the overlap value. The method is a centralized system that references tool processing parameters to determine processing capability. In the cases where the upstream tool has a significantly shorter processing time than the downstream tool, the system is used to determine if value should be added at the upstream tool to avoid WIP build up at the downstream tool.
摘要:
A specimen handling apparatus is provided and includes a body in which a bore is defined and a needle having a tip portion and a bit, which is removably insertible into the bore with the tip portion at least partially exposed, the bore and the bit each being formed such that, when the bit is inserted into the bore, the needle is forced into one of first or second rotational positions relative to a long axis thereof.
摘要:
A specimen handling apparatus is provided and includes a body in which a bore is defined and a needle having a tip portion and a bit, which is removably insertible into the bore with the tip portion at least partially exposed, the bore and the bit each being formed such that, when the bit is inserted into the bore, the needle is forced into one of first or second rotational positions relative to a long axis thereof.
摘要:
A method for reducing contamination in immersion lithography includes retaining a semiconductor wafer on a support surface of a wafer chuck, the wafer chuck having a gap therein, the gap located adjacent an outer edge of the wafer, and the gap containing a volume of immersion lithography fluid therein; and providing a fluid circulation path within the wafer chuck so as to facilitate the radial outward movement of the immersion lithography fluid in the gap, thereby maintaining a meniscus of the immersion lithography fluid at a selected height with respect to a top surface of the semiconductor wafer.
摘要:
A method of forming an image in a photoresist layer. The method includes, providing a substrate; forming the photoresist layer over the substrate; forming a contamination gettering topcoat layer over the photoresist layer, the contamination gettering topcoat layer including one or more polymers and one or more cation complexing agents; exposing the photoresist layer to actinic radiation through a photomask having opaque and clear regions, the opaque regions blocking the actinic radiation and the clear regions being transparent to the actinic radiation, the actinic radiation changing the chemical composition of regions of the photoresist layer exposed to the radiation forming exposed and unexposed regions in the photoresist layer; and removing either the exposed regions of the photoresist layer or the unexposed regions of the photoresist layer. The contamination gettering topcoat layer includes one or more polymers, one or more cation complexing agents and a casting solvent.
摘要:
Methods of developing or removing a select region of block copolymer films using a polar supercritical solvent to dissolve a select portion are disclosed. In one embodiment, the polar supercritical solvent includes chlorodifluoromethane, which may be exposed to the block copolymer film using supercritical carbon dioxide (CO2) as a carrier or chlorodiflouromethane itself in supercritical form. The invention also includes a method of forming a nano-structure including exposing a polymeric film to a polar supercritical solvent to develop at least a portion of the polymeric film. The invention also includes a method of removing a poly(methyl methacrylate-b-styrene) (PMMA-b-S) based resist using a polar supercritical solvent.
摘要:
A method of aligning substrates, e.g., semiconductor wafers, is provided in which a first substrate can be at least coarsely aligned atop a second substrate. Each substrate can have a pattern thereon, wherein the pattern of the first substrate can be aligned with a window of the first substrate. A return signal can be returned from simultaneously illuminating the patterns of the first and second substrates through the window in the first substrate. The return signal can be compared to at least one stored signal to determine relative misalignment between the first and second substrates. A position of at least one of the first and second substrates can be altered relative to a position of the other of the first and second substrates to address the misalignment.
摘要:
A method, system and computer program product for controlling a processing system are disclosed. Alarms and information regarding operating components within the processing system are collected by a knowledge base and are related to one another therein. Data in the knowledge base is then analyzed to determine a root cause for the alarms.
摘要:
Methods of developing or removing a select region of block copolymer films using a polar supercritical solvent to dissolve a select portion are disclosed. In one embodiment, the polar supercritical solvent includes chlorodifluoromethane, which may be exposed to the block copolymer film using supercritical carbon dioxide (CO2) as a carrier or chlorodiflouromethane itself in supercritical form. The invention also includes a method of forming a nano-structure including exposing a polymeric film to a polar supercritical solvent to develop at least a portion of the polymeric film. The invention also includes a method of removing a poly(methyl methacrylate-b-styrene) (PMMA-b-S) based resist using a polar supercritical solvent.
摘要翻译:公开了使用极性超临界溶剂显影或除去嵌段共聚物膜的选择区域以溶解选择部分的方法。 在一个实施方案中,极性超临界溶剂包括氯二氟甲烷,其可以使用超临界二氧化碳(CO 2 CO 2)作为载体或氯二氟乙烷本身以超临界形式暴露于嵌段共聚物膜。 本发明还包括形成纳米结构的方法,包括将聚合物膜暴露于极性超临界溶剂以形成至少一部分聚合物膜。 本发明还包括使用极性超临界溶剂除去聚(甲基丙烯酸甲酯-b-苯乙烯)(PMMA-b-S)基抗蚀剂的方法。
摘要:
A method of aligning substrates, e.g., semiconductor wafers, is provided in which a first substrate can be at least coarsely aligned atop a second substrate. Each substrate can have a pattern thereon, wherein the pattern of the first substrate can be aligned with a window of the first substrate. A return signal can be returned from simultaneously illuminating the patterns of the first and second substrates through the window in the first substrate. The return signal can be compared to at least one stored signal to determine relative misalignment between the first and second substrates. A position of at least one of the first and second substrates can be altered relative to a position of the other of the first and second substrates to address the misalignment.