公开(公告)号：US08705240B1

公开(公告)日：2014-04-22

申请号：US13620412

申请日：2012-09-14

申请人： Wael O. Zohni ,  William L. Schmidt ,  Michael John Sebastian Smith ,  Jeremy Matthew Plunkett

发明人： Wael O. Zohni ,  William L. Schmidt ,  Michael John Sebastian Smith ,  Jeremy Matthew Plunkett

IPC分类号： H05K7/20 ,  H01L23/34

CPC分类号： H05K7/20509 ,  H01L23/367 ,  H01L23/4093 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

摘要： One embodiment of the present invention sets forth a heat spreader module for dissipating thermal heat generated by electronic components. The assembly comprises a printed circuit board (PCB), electronic components disposed on the PCB, a thermal interface material (TIM) thermally coupled to the electronic components, and a heat spreader plate thermally coupled to the TIM. The heat spreader plate includes an embossed pattern. Consequently, surface area available for heat conduction between the heat spreader plate and surrounding medium may be increased relative to the prior art designs.

公开(公告)号：US08081474B1

公开(公告)日：2011-12-20

申请号：US12203100

申请日：2008-09-02

申请人： Wael O. Zohni ,  William L. Schmidt ,  Michael John Sebastian Smith ,  Jeremy Matthew Plunkett

发明人： Wael O. Zohni ,  William L. Schmidt ,  Michael John Sebastian Smith ,  Jeremy Matthew Plunkett

IPC分类号： H05K7/20 ,  H01L23/34

CPC分类号： H05K7/20509 ,  H01L23/367 ,  H01L23/4093 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

摘要： One embodiment of the present invention sets forth a heat spreader module for dissipating thermal heat generated by electronic components. The assembly comprises a printed circuit board (PCB), electronic components disposed on the PCB, a thermal interface material (TIM) thermally coupled to the electronic components, and a heat spreader plate thermally coupled to the TIM. The heat spreader plate includes an embossed pattern. Consequently, surface area available for heat conduction between the heat spreader plate and surrounding medium may be increased relative to the prior art designs.

摘要翻译： 本发明的一个实施例提出了一种散热器模块，用于耗散由电子部件产生的热量热。 组件包括印刷电路板（PCB），布置在PCB上的电子部件，热耦合到电子部件的热界面材料（TIM）和热耦合到TIM的散热板。 散热板包括压花图案。 因此，相对于现有技术的设计，可以增加散热板和周围介质之间可用于热传导的表面积。

公开(公告)号：US08080874B1

公开(公告)日：2011-12-20

申请号：US11855826

申请日：2007-09-14

申请人： Jeremy Werner ,  Daniel L. Rosenband ,  Jeremy Matthew Plunkett ,  William L. Schmidt ,  David T. Wang ,  Wael O. Zohni ,  Philip Arnold Ferolito ,  Michael John Sebastian Smith ,  Suresh Natarajan Rajan ,  Joseph C. Fjelstad

发明人： Jeremy Werner ,  Daniel L. Rosenband ,  Jeremy Matthew Plunkett ,  William L. Schmidt ,  David T. Wang ,  Wael O. Zohni ,  Philip Arnold Ferolito ,  Michael John Sebastian Smith ,  Suresh Natarajan Rajan ,  Joseph C. Fjelstad

IPC分类号： H01L23/34 ,  H01L23/48

CPC分类号： H05K1/181 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/5387 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/1203 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1304 ,  H01L2924/14 ,  H01L2924/1424 ,  H01L2924/1436 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K1/0281 ,  H05K1/141 ,  H05K1/147 ,  H05K2201/10454 ,  H05K2201/10484 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/2018 ,  Y02P70/611 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A system, method, and apparatus are included for providing additional space between an integrated circuit package and a circuit board. An integrated circuit package is provided including a plurality of integrated circuit package contacts. Also provided is a circuit board in electrical communication with the integrated circuit package. Further, the integrated circuit package, the integrated circuit contacts, and/or the circuit board is configured for providing additional space between the integrated circuit package and the circuit board to position at least a portion of at least one component between the integrated circuit package and the circuit board.

摘要翻译： 包括系统，方法和装置，用于在集成电路封装和电路板之间提供额外的空间。 提供了包括多个集成电路封装触点的集成电路封装。 还提供了与集成电路封装电通信的电路板。 此外，集成电路封装，集成电路触点和/或电路板被配置为在集成电路封装和电路板之间提供额外的空间，以将至少一部分的至少一部分置于集成电路封装和 电路板。

公开(公告)号：US08730670B1

公开(公告)日：2014-05-20

申请号：US13279068

申请日：2011-10-21

申请人： Wael O. Zohni ,  William Schmidt ,  Michael J. S. Smith ,  Jeremy Matthew Plunkett

发明人： Wael O. Zohni ,  William Schmidt ,  Michael J. S. Smith ,  Jeremy Matthew Plunkett

IPC分类号： H05K7/20

CPC分类号： H05K7/20509 ,  H01L23/367 ,  H01L23/4093 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

摘要： One embodiment of the present invention sets forth a heat spreader module for dissipating thermal heat generated by electronic components. The assembly comprises a printed circuit board (PCB), electronic components disposed on the PCB, a thermal interface material (TIM) thermally coupled to the electronic components, and a heat spreader plate thermally coupled to the TIM. The heat spreader plate includes an embossed pattern. Consequently, surface area available for heat conduction between the heat spreader plate and surrounding medium may be increased relative to the prior art designs.

摘要翻译： 本发明的一个实施例提出了一种散热器模块，用于耗散由电子部件产生的热量热。 组件包括印刷电路板（PCB），布置在PCB上的电子部件，热耦合到电子部件的热界面材料（TIM）和热耦合到TIM的散热板。 散热板包括压花图案。 因此，相对于现有技术的设计，可以增加散热板和周围介质之间可用于热传导的表面积。