摘要:
In a first aspect, a first apparatus is provided. The first apparatus is a memory element that includes (1) one or more MOSFETs each including a dielectric material having a dielectric constant of about 3.9 to about 25; and (2) control logic coupled to at least one of the one or more MOSFETs. The control logic is adapted to (a) cause the memory element to operate in a first mode to store data; and (b) cause the memory element to operate in a second mode to change a threshold voltage of at least one of the one or more MOSFETs from an original threshold voltage to a changed threshold voltage such that the changed threshold voltage affects data stored by the memory element when operated in the first mode. Numerous other aspects are provided.
摘要:
In a first aspect, a first method of adjusting capacitance of a semiconductor device is provided. The first method includes the steps of (1) providing a transistor including a dielectric material having a dielectric constant of about 3.9 to about 25, wherein the transistor is adapted to operate in a first mode to provide a capacitance and further adapted to operate in a second mode to change a threshold voltage of the transistor from an original threshold voltage to a changed threshold voltage such that the changed threshold voltage affects a capacitance provided by the transistor when operated in the first mode; and (2) employing the transistor in a circuit. Numerous other aspects are provided.
摘要:
A method of fabricating a high performance metal-insulator-metal capacitor (MIMCAP) includes providing a first inter-level dielectric (ILD) layer over an isolation region; forming a MIMCAP pattern in the first ILD layer over the isolation region; depositing a conformal conductive liner over the MIMCAP pattern and the first ILD layer; depositing an insulator over the conformal conductive liner; forming a contact pattern through the conformal conductive liner, the insulator and the first inter-level dielectric (ILD) layer; depositing a second conformal conductive liner over the MIMCAP pattern, the contact pattern and the first ILD layer; and depositing a conductive stud over the second conformal conductive liner in the MIMCAP pattern and the contact pattern. The method is applicable to both a conventional bulk semiconductor substrate and a silicon-on-insulator (SOI) substrate.
摘要:
A solution for determining minimum operating voltages due to performance/power requirements would be valid for a wide range of actual uses. The solution includes a test flow methodology for dynamically reducing power consumption under applied conditions while maintaining application performance via a BIST circuit. There is additionally provided a test flow method for dynamically reducing power consumption to the lowest possible stand-by/very low power level under applied conditions that will still be sufficient to maintain data/state information. One possible application would be for controlling the voltage supply to a group of particular circuits on an ASIC (Application Specific Integrated Circuit). These circuits are grouped together in a voltage island where they would receive a voltage supply that can be different from the voltage supply other circuits on the same chip are receiving. The same solution could be applied to a portion of a microprocessor (the cache logic control, for example).
摘要:
An integrated circuit amplifier includes, in an exemplary embodiment, a first field effect transistor (FET) device configured as a source follower and a second FET device configured as a tunneling gate FET, the tunneling gate FET coupled to the source follower. The tunneling gate FET is further configured so as to set a transconductance of the amplifier and the source follower is configured so as to set an output conductance of the amplifier.
摘要:
In a first aspect, a first method of determining radiation intensity is provided. The first method includes the steps of (1) providing a semiconductor device having (a) a silicon mesa; and (b) photo-gate conductor material along at least three sidewalls of the silicon mesa; (2) forming a depletion region in the silicon mesa; and (3) in response to radiation impacting the semiconductor device, creating a signal in the semiconductor device, wherein the signal has a level related to an intensity of the radiation. In another aspect, a design structure embodied in a machine readable medium for designing manufacturing, or testing a design is provided. Numerous other aspects are provided.
摘要:
A method, device and system for monitoring ionizing radiation. The method including: collecting an ionizing radiation induced charge collected by the depletion region of a diode formed in a silicon layer below an oxide layer buried below a surface of a silicon substrate; and coupling a cathode of the diode to a precharged node of a clocked logic circuit such that the ionizing radiation induced charge collected by a depletion region of the diode will discharge the precharged node and change an output state of the clocked logic circuit.
摘要:
An integrated circuit chip and a semiconductor structure. The integrated circuit chip includes: a thick-body device containing a semiconductor mesa and a doped body contact; and a field effect transistor on a first sidewall of a semiconductor mesa, wherein the doped body contact is on a second sidewall of the semiconductor mesa, and wherein the semiconductor mesa is disposed between the field effect transistor and the doped body contact. The semiconductor structure includes: a buried oxide layer on a semiconductor wafer; a thin fin structure on the buried oxide layer, wherein the thin fin structure includes a first hard mask on a semiconductor fin, wherein the semiconductor fin is disposed between the first hard mask and a surface of the buried oxide layer; and a thick mesa structure on the buried oxide layer, and wherein the thick mesa structure includes a semiconductor mesa.
摘要:
An antifuse device (120) that includes a bias element (124) and an programmable antifuse element (128) arranged in series with one another so as to form a voltage divider having an output node (F) located between the bias and antifuse elements. When the antifuse device is in its unprogrammed state, each of the bias element and antifuse element is non-conductive. When the antifuse device is in its programmed state, the bias element remains non-conductive, but the antifuse element is conductive. The difference in the resistance of the antifuse element between its unprogrammed state and programmed state causes the difference in voltages seen at the output node to be on the order of hundreds of mili-volts when a voltage of 1 V is applied across the antifuse device. This voltage difference is so high that it can be readily sensed using a simple sensing circuit (228).
摘要:
A method and circuit for tunneling leakage current compensation, the method including: forcing a current of known value through a tunneling current leakage monitor device to provide a voltage signal; and regulating an on-chip power supply of the integrated circuit chip based on the voltage signal.