Method of curing hydrogen silsesquioxane and densification in nano-scale trenches
    1.
    发明申请
    Method of curing hydrogen silsesquioxane and densification in nano-scale trenches 审中-公开
    固化氢倍半硅氧烷和纳米级沟槽致密化的方法

    公开(公告)号:US20090032901A1

    公开(公告)日:2009-02-05

    申请号:US11919109

    申请日:2006-06-12

    IPC分类号: H01L21/762 H01L23/58

    摘要: Trenches in a semiconductor substrate are filled by (i) dispensing a film forming material on the semiconductor substrate and into the trenches; (ii) curing the dispensed film forming material in the presence of an oxidant at a first low temperature for a first predetermined period of time; (iii) curing the dispensed film forming material in the presence of an oxidant at a second low temperature for a second predetermined period of time; (iv) curing the dispensed film forming material in the presence of an oxidant at a third high temperature for a third predetermined period of time; and (v) forming filled oxide trenches in the semiconductor substrate. The film forming material is hydrogen silsesquioxane.

    摘要翻译: 通过(i)在半导体衬底上分配成膜材料并进入沟槽来填充半导体衬底中的沟槽; (ii)在第一低温下在氧化剂存在下固化所分配的成膜材料持续第一预定时间段; (iii)在第二低温下在氧化剂存在下固化所分配的成膜材料持续第二预定时间段; (iv)在第三高温下在氧化剂存在下固化分配的成膜材料持续第三预定时间; 和(v)在半导体衬底中形成填充的氧化物沟槽。 成膜材料是氢倍半硅氧烷。

    Method for producing hydrogenated silicon-oxycarbide films
    2.
    发明授权
    Method for producing hydrogenated silicon-oxycarbide films 有权
    氢化硅 - 碳氧化物薄膜的制造方法

    公开(公告)号:US07189664B2

    公开(公告)日:2007-03-13

    申请号:US10543672

    申请日:2004-01-26

    IPC分类号: H01L21/469

    CPC分类号: C23C16/30

    摘要: A method for producing hydrogenated silicon oxycarbide (H:SiOC) films having low dielectric constant. The method comprises using plasma-assisted polymerization to react a cyclic silane compound containing at least one strained silicon bond to produce the films. The resulting films are useful in the formation of semiconductor devices.

    摘要翻译: 一种具有低介电常数的氢化硅碳化氢(H:SiOC)薄膜的制造方法。 该方法包括使用等离子体辅助聚合反应含有至少一个应变硅键的环状硅烷化合物以制备膜。 所得膜可用于形成半导体器件。