公开(公告)号：US20140035719A1

公开(公告)日：2014-02-06

申请号：US13866611

申请日：2013-04-19

申请人： Wen Feng LEE ,  Kuo Hsun Chen ,  Chun Teng Tseng ,  Yi An Sha ,  Ming Hsun Lu

发明人： Wen Feng LEE ,  Kuo Hsun Chen ,  Chun Teng Tseng ,  Yi An Sha ,  Ming Hsun Lu

IPC分类号： H01C7/00 ,  H01C17/00

CPC分类号： H01C7/008 ,  H01C1/028 ,  H01C1/1406 ,  H01C7/02 ,  H01C17/00 ,  H01C17/02 ,  Y10T29/49085

摘要： An over-current protection device has a PTC device, first and second electrodes and an insulation layer. The PTC device comprises first and second electrically conductive members and a PTC layer laminated between the first and second electrically conductive members. The first and second electrodes are electrically connected to the first and second electrically conductive members, respectively. The insulation layer is disposed on a surface of the first electrically conductive member. The device is a stack structure extending along a first direction, and comprises at least one hole extending along a second direction substantially perpendicular to the first direction. The value of the covered area of the hole divided by the area of the form factor of the over-current protection device is not less than 2%, and the value of the thickness of the device divided by the number of the PIC devices is less than 0.7 mm.

摘要翻译： 过电流保护装置具有PTC器件，第一和第二电极以及绝缘层。 PTC器件包括第一和第二导电构件和层压在第一和第二导电构件之间的PTC层。 第一和第二电极分别电连接到第一和第二导电构件。 绝缘层设置在第一导电构件的表面上。 该装置是沿着第一方向延伸的堆叠结构，并且包括沿着基本上垂直于第一方向的第二方向延伸的至少一个孔。 孔的覆盖面积除以过流保护装置的形状因子的面积的值不小于2％，并且器件的厚度值除以PIC器件的数量少 大于0.7毫米。

公开(公告)号：US08941462B2

公开(公告)日：2015-01-27

申请号：US13866611

申请日：2013-04-19

申请人： Wen Feng Lee ,  Kuo Hsun Chen ,  Chun Teng Tseng ,  Yi An Sha ,  Ming Hsun Lu

发明人： Wen Feng Lee ,  Kuo Hsun Chen ,  Chun Teng Tseng ,  Yi An Sha ,  Ming Hsun Lu

IPC分类号： H01C7/10 ,  H01C7/00 ,  H01C17/00 ,  H01C1/028 ,  H01C1/14 ,  H01C7/02 ,  H01C17/02

CPC分类号： H01C7/008 ,  H01C1/028 ,  H01C1/1406 ,  H01C7/02 ,  H01C17/00 ,  H01C17/02 ,  Y10T29/49085

摘要： An over-current protection device has a PTC device, first and second electrodes and an insulation layer. The PTC device comprises first and second electrically conductive members and a PTC layer laminated between the first and second electrically conductive members. The first and second electrodes are electrically connected to the first and second electrically conductive members, respectively. The insulation layer is disposed on a surface of the first electrically conductive member. The device is a stack structure extending along a first direction, and comprises at least one hole extending along a second direction substantially perpendicular to the first direction. The value of the covered area of the hole divided by the area of the form factor of the over-current protection device is not less than 2%, and the value of the thickness of the device divided by the number of the PTC devices is less than 0.7 mm.

摘要翻译： 过电流保护装置具有PTC器件，第一和第二电极以及绝缘层。 PTC器件包括第一和第二导电构件和层压在第一和第二导电构件之间的PTC层。 第一和第二电极分别电连接到第一和第二导电构件。 绝缘层设置在第一导电构件的表面上。 该装置是沿着第一方向延伸的堆叠结构，并且包括沿着基本上垂直于第一方向的第二方向延伸的至少一个孔。 孔的覆盖面积除以过电流保护装置的形状因子的面积的值不小于2％，并且器件的厚度值除以PTC器件的数量减少 大于0.7毫米。

公开(公告)号：US09224525B2

公开(公告)日：2015-12-29

申请号：US14017839

申请日：2013-09-04

申请人： Tong Cheng Tsai ,  Wen Feng Lee ,  Chun Teng Tseng ,  Chi Jen Su ,  Yi An Sha

发明人： Tong Cheng Tsai ,  Wen Feng Lee ,  Chun Teng Tseng ,  Chi Jen Su ,  Yi An Sha

IPC分类号： H05K1/16 ,  H05K7/00 ,  H01C7/02 ,  H01C1/14 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18

CPC分类号： H01C7/021 ,  H01C1/1406 ,  H05K1/0263 ,  H05K1/0373 ,  H05K1/181 ,  H05K2201/10196

摘要： An over-current protection device, which can be surface-mounted and stand upright on a circuit board and withstand 60 to 600 volts, comprises a PTC device, first and second electrodes. The PTC device is a laminated structure comprising first and second conductive layers and a PTC material layer. The first and second conductive layers are in physical contact with first and second planar surfaces of the PTC material layer, respectively. The first electrode is disposed on the first conductive layer. The second electrode is disposed on the second conductive layer and is separated from the first electrode. The first electrode, the second electrode and the PTC device commonly form an end surface which is substantially perpendicular to the first and second planar surfaces. The first electrode and the second electrode at the end surface serve as interfaces electrically connecting to the circuit board.

摘要翻译： 可以在电路板上表面安装并直立并承受60至600伏特的过流保护装置包括PTC装置，第一和第二电极。 PTC器件是包括第一和第二导电层和PTC材料层的层压结构。 第一和第二导电层分别与PTC材料层的第一和第二平坦表面物理接触。 第一电极设置在第一导电层上。 第二电极设置在第二导电层上并与第一电极分离。 第一电极，第二电极和PTC装置通常形成基本上垂直于第一和第二平面的端面。 端面处的第一电极和第二电极用作电连接到电路板的界面。

公开(公告)号：US09000881B2

公开(公告)日：2015-04-07

申请号：US13901068

申请日：2013-05-23

申请人： Fu Hua Chu ,  David Shau Chew Wang ,  Chun Teng Tseng ,  Yi An Sha

发明人： Fu Hua Chu ,  David Shau Chew Wang ,  Chun Teng Tseng ,  Yi An Sha

IPC分类号： H01C7/10 ,  H01C7/13 ,  H02H3/08 ,  H01C7/12 ,  H02H9/04

CPC分类号： H02H3/08 ,  H01C1/1406 ,  H01C7/02 ,  H01C7/021 ,  H01C7/12 ,  H02H9/044

摘要： A surface-mountable over-current protection device comprises a PTC material layer, first and second conductive layers, first and second electrodes, first and second electrically conductive connecting members. The PTC material layer has a resistivity less than 0.18 Ω-cm. The conductive layers are in contact with opposite surfaces of the PTC material layer. The first electrode comprises pair of first metal foils and is insulated from the second conductive layer. The second electrode comprises a pair of second metal foils and is insulated from the first conductive layer. The first electrically conductive connecting member connects to the first metal foils and conductive layer. The second electrically conductive connecting member connects to the second metal foils and conductive layer. The first electrically conductive connecting member comprises 40%-100% by area of the first lateral surface, and the second electrically conductive connecting member comprises 40%-100% by area of the second lateral surface.

摘要翻译： 表面安装式过流保护装置包括PTC材料层，第一和第二导电层，第一和第二电极，第一和第二导电连接构件。 PTC材料层的电阻率小于0.18＆OHgr; -cm。 导电层与PTC材料层的相对表面接触。 第一电极包括一对第一金属箔并且与第二导电层绝缘。 第二电极包括一对第二金属箔，并与第一导电层绝缘。 第一导电连接构件连接到第一金属箔和导电层。 第二导电连接构件连接到第二金属箔和导电层。 第一导电连接构件包括第一侧面的40％-100％的面积，第二导电连接构件包括第二侧面的40％-100％的面积。

公开(公告)号：US20140306605A1

公开(公告)日：2014-10-16

申请号：US14017806

申请日：2013-09-04

申请人： Kuo Chang LO ,  Wei Tsang Dai ,  Yi An Sha ,  Chun Teng Tseng

发明人： Kuo Chang LO ,  Wei Tsang Dai ,  Yi An Sha ,  Chun Teng Tseng

IPC分类号： H01C7/02 ,  H05B33/08

CPC分类号： H01C7/028 ,  H01C7/027 ,  H01C17/0652 ,  H01C17/06566 ,  H01C17/06586 ,  H05B33/0854 ,  H05B33/0857

摘要： A PTC composition comprises crystalline polymer and conductive ceramic filler dispersed therein. The crystalline polymer has a melting point less than 90° C. and comprises 5%-30% by weight of the PTC composition. The crystalline polymer comprises ethylene, vinyl copolymer or the mixture thereof. The vinyl copolymer comprises at least one of the functional group selected from the group consisting of ester, ether, organic acid, anhydride, imide or amide. The conductive ceramic filler comprises a resistivity less than 500 μΩ-cm and comprises 70%-95% by weight of the PTC composition. The PTC composition has a resistivity about 0.01-5 Ω-cm and its resistance at 85° C. is about 103 to 108 times that at 25° C.

摘要翻译： PTC组合物包含分散在其中的结晶聚合物和导电陶瓷填料。 该结晶聚合物具有小于90℃的熔点，并且包含5％-30％重量的PTC组合物。 结晶聚合物包括乙烯，乙烯基共聚物或其混合物。 乙烯基共聚物包含选自酯，醚，有机酸，酸酐，酰亚胺或酰胺中的至少一种官能团。 导电陶瓷填料包括电阻率小于500μΩ-OHgr·cm，并且包含70％-95％重量的PTC组合物。 PTC组合物的电阻率为约0.01-5Ω·cm-cm，其在85℃下的电阻为25℃时的约103〜108倍。

公开(公告)号：US08502638B1

公开(公告)日：2013-08-06

申请号：US13365726

申请日：2012-02-03

申请人： Yi An Sha ,  Chun Teng Tseng ,  David Shau Chew Wang

发明人： Yi An Sha ,  Chun Teng Tseng ,  David Shau Chew Wang

IPC分类号： H01C7/10

CPC分类号： H01C7/008 ,  H01C7/02 ,  H01C7/04

摘要： A thermistor includes a resistive device, a first insulation layer, a first electrode, a second electrode and a first heat-conductive layer. The resistive device includes a first electrically conductive member, a second electrically conductive member and a polymeric material layer laminated therebetween. The polymeric material layer exhibits positive temperature coefficient (PTC) or negative temperature coefficient (NTC) behavior. The first insulation layer is disposed on the first electrically conductive member. The first electrode is electrically coupled to the first electrically conductive member, whereas the second electrode is electrically coupled to the second electrically conductive member and is insulated from the first electrode. The first heat-conductive layer is disposed on the first insulation layer, and has a heat conductivity of at least 30 W/m-K and a thickness of 15-250 μm.

摘要翻译： 热敏电阻包括电阻器件，第一绝缘层，第一电极，第二电极和第一导热层。 电阻装置包括第一导电构件，第二导电构件和层压在其间的聚合材料层。 聚合材料层表现出正温度系数（PTC）或负温度系数（NTC）行为。 第一绝缘层设置在第一导电构件上。 第一电极电耦合到第一导电构件，而第二电极电耦合到第二导电构件并与第一电极绝缘。 第一导热层设置在第一绝缘层上，具有至少30W / m-K的导热率和15-250μmum的厚度。

公开(公告)号：US09177702B2

公开(公告)日：2015-11-03

申请号：US14017806

申请日：2013-09-04

申请人： Kuo Chang Lo ,  Wei Tsang Dai ,  Yi An Sha ,  Chun Teng Tseng

发明人： Kuo Chang Lo ,  Wei Tsang Dai ,  Yi An Sha ,  Chun Teng Tseng

IPC分类号： H05B33/00 ,  H01C7/02 ,  H05B33/08 ,  H01C17/065

CPC分类号： H01C7/028 ,  H01C7/027 ,  H01C17/0652 ,  H01C17/06566 ,  H01C17/06586 ,  H05B33/0854 ,  H05B33/0857

摘要： A PTC composition comprises crystalline polymer and conductive ceramic filler dispersed therein. The crystalline polymer has a melting point less than 90° C. and comprises 5%-30% by weight of the PTC composition. The crystalline polymer comprises ethylene, vinyl copolymer or the mixture thereof. The vinyl copolymer comprises at least one of the functional group selected from the group consisting of ester, ether, organic acid, anhydride, imide or amide. The conductive ceramic filler comprises a resistivity less than 500 μΩ-cm and comprises 70%-95% by weight of the PTC composition. The PTC composition has a resistivity about 0.01-5 Ω-cm and its resistance at 85° C. is about 103 to 108 times that at 25° C.

摘要翻译： PTC组合物包含分散在其中的结晶聚合物和导电陶瓷填料。 该结晶聚合物具有小于90℃的熔点，并且包含5％-30％重量的PTC组合物。 结晶聚合物包括乙烯，乙烯基共聚物或其混合物。 乙烯基共聚物包含选自酯，醚，有机酸，酸酐，酰亚胺或酰胺中的至少一种官能团。 导电陶瓷填料包括电阻率小于500μΩ-OHgr·cm，并且包含70％-95％重量的PTC组合物。 PTC组合物的电阻率为约0.01-5Ω·cm-cm，其在85℃下的电阻为25℃时的约103〜108倍。

公开(公告)号：US08830027B2

公开(公告)日：2014-09-09

申请号：US13604154

申请日：2012-09-05

申请人： Yi An Sha ,  Chun Teng Tseng ,  David Shau Chew Wang

发明人： Yi An Sha ,  Chun Teng Tseng ,  David Shau Chew Wang

IPC分类号： H01C7/00

CPC分类号： H01C1/084 ,  H01C1/148 ,  H01C7/008 ,  H01C7/028 ,  H01C7/049 ,  H01C7/18

摘要： A surface mountable thermistor comprises a resistive device, first and second electrodes, and at least one heat conductive dielectric layer. The resistive device contains first and second electrically conductive members and a polymeric material layer laminated therebetween. The polymeric material layer exhibits PTC or NTC behavior. The polymeric material layer and the first and second electrically conductive members commonly extend in a first direction. The first electrode is electrically coupled to the first electrically conductive member. The second electrode is electrically coupled to the second electrically conductive member and is insulated from the first electrode. The heat conductivity of the first electrode or the second electrode is at least 50 W/mK. The heat conductive dielectric layer comprises polymeric insulation matrix and heat conductive filler, and is disposed between the first electrode and the second electrode. The heat conductivity of heat conductive dielectric layer is between 1.2 W/mK-13 W/mK.

摘要翻译： 可表面安装的热敏电阻包括电阻器件，第一和第二电极以及至少一个导热电介质层。 电阻装置包含第一和第二导电构件和层压在其间的聚合材料层。 聚合材料层表现出PTC或NTC性能。 聚合材料层和第一和第二导电构件通常沿第一方向延伸。 第一电极电耦合到第一导电构件。 第二电极电耦合到第二导电构件并与第一电极绝缘。 第一电极或第二电极的导热率至少为50W / mK。 导热介电层包括聚合物绝缘基体和导热填料，并且设置在第一电极和第二电极之间。 导热介电层的导热系数在1.2W / mK-13W / mK之间。

公开(公告)号：US20140063671A1

公开(公告)日：2014-03-06

申请号：US13901068

申请日：2013-05-23

申请人： Fu Hua CHU ,  David Shau Chew Wang ,  Chun Teng Tseng ,  Yi An Sha

发明人： Fu Hua CHU ,  David Shau Chew Wang ,  Chun Teng Tseng ,  Yi An Sha

IPC分类号： H02H3/08

CPC分类号： H02H3/08 ,  H01C1/1406 ,  H01C7/02 ,  H01C7/021 ,  H01C7/12 ,  H02H9/044

摘要： A surface-mountable over-current protection device comprises a PTC material layer, first and second conductive layers, first and second electrodes, first and second electrically conductive connecting members. The PTC material layer has a resistivity less than 0.18 Ω-cm. The conductive layers are in contact with opposite surfaces of the PTC material layer. The first electrode comprises a pair of first metal foils and is insulated from the second conductive layer. The second electrode comprises a pair of second metal foils and is insulated from the first conductive layer. The first electrically conductive connecting member connects to the first metal foils and conductive layer. The second electrically conductive connecting member connects to the second metal foils and conductive layer. The first electrically conductive connecting member comprises 40%-100% by area of the first lateral surface, and the second electrically conductive connecting member comprises 40%-100% by area of the second lateral surface.

摘要翻译： 表面安装式过流保护装置包括PTC材料层，第一和第二导电层，第一和第二电极，第一和第二导电连接构件。 PTC材料层的电阻率小于0.18Ω·cm。 导电层与PTC材料层的相对表面接触。 第一电极包括一对第一金属箔并与第二导电层绝缘。 第二电极包括一对第二金属箔，并与第一导电层绝缘。 第一导电连接构件连接到第一金属箔和导电层。 第二导电连接构件连接到第二金属箔和导电层。 第一导电连接构件包括第一侧面的40％-100％的面积，第二导电连接构件包括第二侧面的40％-100％的面积。

公开(公告)号：US20140374649A1

公开(公告)日：2014-12-25

申请号：US14135849

申请日：2013-12-20

申请人： Kuo Hsun CHEN ,  Meng Chun Ko ,  Yi An Sha ,  Hsiang Yun Yang

发明人： Kuo Hsun CHEN ,  Meng Chun Ko ,  Yi An Sha ,  Hsiang Yun Yang

IPC分类号： C09J11/04

CPC分类号： C09J163/00 ,  C08G59/50 ,  C08G2650/56 ,  C08K3/22 ,  C08K3/28 ,  C08L71/00 ,  C09J109/02 ,  C09J113/00 ,  H01L33/64 ,  H05K7/20

摘要： An adhesive material comprises a polymeric component, a heat conductive filler and a curing agent. The polymeric component comprises 30%-60% by volume of the adhesive material, and comprises thermoset epoxy resin and polymeric modifier configured to improve impact resistance of the thermoset epoxy resin. The polymeric modifier comprises thermoplastic, rubber or the mixture thereof. The polymeric modifier comprises 4%-45% by volume of the polymeric component. The heat conductive filler is evenly dispersed in the polymeric component, and comprises 40%-70% by volume of the adhesive material. The curing agent is capable of curing the thermoset epoxy resin at a temperature below 140° C. The adhesive material has a heat conductivity greater than 3 W/m-K.

摘要翻译： 粘合剂材料包括聚合物组分，导热填料和固化剂。 聚合物组分占粘合剂材料的30重量％-60体积％，并且包含热固性环氧树脂和聚合物改性剂，其被配置成改善热固性环氧树脂的耐冲击性。 聚合物改性剂包括热塑性橡胶或其混合物。 聚合物改性剂包含4％-45％体积的聚合物组分。 导热填料均匀地分散在聚合物组分中，并且包含40％-70体积％的粘合剂材料。 固化剂能够在低于140℃的温度下固化热固性环氧树脂。粘合剂材料的导热率大于3W / m-K。