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公开(公告)号：US20110095313A1
公开(公告)日：2011-04-28
申请号：US12891731
申请日：2010-09-27
Applicant: Peng-Yi Wu , Shih-Cheng Huang , Po-Min Tu , Wen-Yu Lin , Tzu-Chien Hong
Inventor： Peng-Yi Wu , Shih-Cheng Huang , Po-Min Tu , Wen-Yu Lin , Tzu-Chien Hong
IPC: H01L33/30
CPC classification number: H01L33/007 , H01L33/44
Abstract: A method for manufacturing light-emitting diode (LED) first provides a substrate, then a protrusive patterned layer is formed on the substrate. The protrusive patterned layer exposes portions of the substrate, and the exposed portions are defined as a plurality of exposed regions. Next, a plurality of island semiconductor multi-layer is individually formed in each exposed region of the substrate.
Abstract translation: 一种制造发光二极管（LED）的方法首先提供一种衬底，然后在衬底上形成凸出的图案层。 突出图案层露出基板的部分，并且暴露部分被定义为多个暴露区域。 接下来，在基板的每个曝光区域中分别形成多个岛状半导体多层。
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公开(公告)号：US20100259928A1
公开(公告)日：2010-10-14
申请号：US12495818
申请日：2009-07-01
Applicant: Hung-Yi Ou Yang , Wen-Yu Lin
Inventor： Hung-Yi Ou Yang , Wen-Yu Lin
CPC classification number: H05B33/0803 , F21K9/00 , F21V23/06 , F21Y2105/10 , F21Y2115/10 , H01R12/79 , H05K1/148
Abstract: A light-emitting diode (LED) module includes a plurality of LED units and a converter having a first side. The LED units respectively include a circuit board having a second side perpendicular to the first side and a third side parallel to the first side, a plurality of LEDs positioned on the circuit board, and a connector positioned on the second side proximal to the converter. The LED module further includes a plurality of flexible flat cables (FFCs) used to electrically connect the connectors to the converter, respectively.
Abstract translation: 发光二极管（LED）模块包括多个LED单元和具有第一侧的转换器。 LED单元分别包括具有垂直于第一侧的第二侧和与第一侧平行的第三侧的电路板，位于电路板上的多个LED以及位于转换器附近的第二侧的连接器。 LED模块还包括分别用于将连接器电连接到转换器的多个柔性扁平电缆（FFC）。
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公开(公告)号：US20080089061A1
公开(公告)日：2008-04-17
申请号：US11754322
申请日：2007-05-28
Applicant: Chung-Chih Hsieh , Tsao-Yuan Fu , Chi-Sheng Lin , Wen-Yu Lin
Inventor： Chung-Chih Hsieh , Tsao-Yuan Fu , Chi-Sheng Lin , Wen-Yu Lin
CPC classification number: G02F1/133608 , G02F1/133606
Abstract: A direct type backlight module including a frame, a plurality of light sources, an optical plate and an upper frame is provided. The frame includes a bottom frame and a side frame extending upward from the edge of the bottom frame. The light sources are disposed on the bottom frame, and the optical plate is disposed on the side frame above the light sources. The frame and the upper frame are assembled, wherein the optical plate is located between the upper frame and the frame. The upper frame has at lease one protrusion located above the optical plate and protruding to the optical plate. Therefore, the deformation of the optical plate can be reduced.
Abstract translation: 提供了包括框架，多个光源，光学板和上部框架的直接型背光模块。 框架包括底框架和从底框架的边缘向上延伸的侧框架。 光源设置在底架上，并且光学板设置在光源上方的侧框架上。 组装框架和上框架，其中光学板位于上框架和框架之间。 上框架具有至少一个位于光学板上方并突出到光学板的突起。 因此，可以减小光学板的变形。
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公开(公告)号：US20080062721A1
公开(公告)日：2008-03-13
申请号：US11470634
申请日：2006-09-07
Applicant: Wen-Yu Lin
Inventor： Wen-Yu Lin
IPC: F21V7/04
CPC classification number: G02F1/133608 , G02F1/133603 , G02F1/133604
Abstract: A back light module includes a frame, multiple light sources and an optical film. The frame has a bottom and several laterals. The bottom having multiple holes is connected with the laterals. The light sources correspond to the holes, respectively, and are fixed inside the frame. The optical film is disposed on the frame and above the light sources.
Abstract translation: 背光模块包括框架，多个光源和光学膜。 框架有一个底部和几个边。 具有多个孔的底部与侧面连接。 光源分别对应于孔，并固定在框架内。 光学膜设置在框架上并且在光源上方。
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公开(公告)号：US08581283B2
公开(公告)日：2013-11-12
申请号：US13015590
申请日：2011-01-28
Applicant: Po-Min Tu , Shih-Cheng Huang , Wen-Yu Lin , Chih-Peng Hsu , Shih-Hsiung Chan
Inventor： Po-Min Tu , Shih-Cheng Huang , Wen-Yu Lin , Chih-Peng Hsu , Shih-Hsiung Chan
IPC: H01L33/10
CPC classification number: H01L33/007 , H01L21/0237 , H01L21/02458 , H01L21/0254 , H01L21/02639 , H01L21/0265
Abstract: A photoelectric device having Group III nitride semiconductor includes a conductive layer, a metallic mirror layer located on the conductive layer, and a Group III nitride semiconductor layer located on the metallic mirror layer. The Group III nitride semiconductor layer defines a number of microstructures thereon. Each microstructure includes at least one angled face, and the angled face of each microstructure is a crystal face of the Group III nitride semiconductor layer.
Abstract translation: 具有III族氮化物半导体的光电器件包括导电层，位于导电层上的金属镜层和位于金属镜面层上的III族氮化物半导体层。 III族氮化物半导体层在其上限定了许多微结构。 每个微结构包括至少一个成角度的面，并且每个微结构的倾斜面是III族氮化物半导体层的晶体面。
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Patent Agency Ranking
公开(公告)号：US20120231154A1
公开(公告)日：2012-09-13
申请号：US13353322
申请日：2012-01-19
Applicant: Wen-Hsiung Liao , Wen-Yu Lin , Wei-Chien Chang
Inventor： Wen-Hsiung Liao , Wen-Yu Lin , Wei-Chien Chang
CPC classification number: H05K3/1258 , H05K3/4629 , H05K3/4685
Abstract: A method for fabricating a ceramic device is provided. A green sheet is adhered on an adhesive film. A photoresist film is then formed on the green sheet. A photolithographic process is carried out to form circuit trenches in the photoresist film. The circuit trenches are filled with metal paste, thereby forming a circuit pattern. The photoresist film is then removed.
Abstract translation: 提供一种制造陶瓷器件的方法。 生片粘附在粘合膜上。 然后在生片上形成光致抗蚀剂膜。 进行光刻工艺以在光致抗蚀剂膜中形成电路沟槽。 电路沟槽填充有金属膏，从而形成电路图案。 然后除去光致抗蚀剂膜。
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公开(公告)号：US08174842B2
公开(公告)日：2012-05-08
申请号：US12495818
申请日：2009-07-01
Applicant: Hung-Yi Ou Yang , Wen-Yu Lin
Inventor： Hung-Yi Ou Yang , Wen-Yu Lin
CPC classification number: H05B33/0803 , F21K9/00 , F21V23/06 , F21Y2105/10 , F21Y2115/10 , H01R12/79 , H05K1/148
Abstract: A light-emitting diode (LED) module includes a plurality of LED units and a converter having a first side. The LED units respectively include a circuit board having a second side perpendicular to the first side and a third side parallel to the first side, a plurality of LEDs positioned on the circuit board, and a connector positioned on the second side proximal to the converter. The LED module further includes a plurality of flexible flat cables (FFCs) used to electrically connect the connectors to the converter, respectively.
Abstract translation: 发光二极管（LED）模块包括多个LED单元和具有第一侧的转换器。 LED单元分别包括具有垂直于第一侧的第二侧和与第一侧平行的第三侧的电路板，位于电路板上的多个LED以及位于转换器附近的第二侧的连接器。 LED模块还包括分别用于将连接器电连接到转换器的多个柔性扁平电缆（FFC）。
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公开(公告)号：US20080007937A1
公开(公告)日：2008-01-10
申请号：US11309182
申请日：2006-07-07
Applicant: Hung-Yi Ou Yang , Wen-Yu Lin , Chia-Hung Chen , Wen-Chi Hung
Inventor： Hung-Yi Ou Yang , Wen-Yu Lin , Chia-Hung Chen , Wen-Chi Hung
IPC: G09F13/04
CPC classification number: G02F1/133608 , G02F1/133604
Abstract: A direct-type backlight module is disclosed, which includes a frame, at least one lamp support structure, at least one lamp and a diffusion plate. The frame has a bottom plate, and at least one opening is disposed in the bottom plate. The lamp support structure including a base and at least one holding and fixing member is fixed in the opening, wherein the base is disposed outside the bottom plate of the frame, and the holding and fixing member is disposed on the base and through the opening. The holding and fixing member has a lamp holding portion and a fixing portion, wherein the fixing portion is fixed in the opening, and the lamp holding portion is suitable for holding the lamp. The diffusion plate is disposed above the lamp.
Abstract translation: 公开了一种直接型背光模块，其包括框架，至少一个灯支撑结构，至少一个灯和扩散板。 框架具有底板，并且至少一个开口设置在底板中。 包括基座和至少一个保持固定构件的灯支撑结构被固定在开口中，其中基座设置在框架的底板的外侧，并且保持固定构件设置在基座上并穿过开口。 保持固定构件具有灯保持部和固定部，其中固定部固定在开口中，并且灯保持部适合于保持灯。 扩散板设置在灯的上方。
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9.发明授权Light-emitting semiconductor device having sub-structures for reducing defects of dislocation therein 有权具有用于减少其位错缺陷的子结构的发光半导体器件公开(公告)号：US08866161B2
公开(公告)日：2014-10-21
申请号：US13314186
申请日：2011-12-08
Applicant: Shih-Cheng Huang , Po-Min Tu , Ying-Chao Yeh , Wen-Yu Lin , Peng-Yi Wu , Shih-Hsiung Chan
Inventor： Shih-Cheng Huang , Po-Min Tu , Ying-Chao Yeh , Wen-Yu Lin , Peng-Yi Wu , Shih-Hsiung Chan
CPC classification number: H01L21/0254 , H01L21/02458 , H01L21/02505 , H01L21/02656 , H01L33/007 , H01S5/32341 , H01S2301/173 , H01S2304/12
Abstract: A structure of semiconductor device includes a first semiconductor layer; an intermediate layer on a surface of said first semiconductor layer; a second semiconductor layer on said intermediate layer, wherein said intermediate layer and said second semiconductor layer are integrated to a set of sub-structures; and a semiconductor light emitting device on said second semiconductor layer.
Abstract translation: 半导体器件的结构包括第一半导体层; 在所述第一半导体层的表面上的中间层; 在所述中间层上的第二半导体层，其中所述中间层和所述第二半导体层被集成到一组子结构中; 以及在所述第二半导体层上的半导体发光器件。
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公开(公告)号：US20100208451A1
公开(公告)日：2010-08-19
申请号：US12405219
申请日：2009-03-16
Applicant: Sheng-Chieh Chao , Hung-Yi Ou Yang , Wen-Yu Lin
Inventor： Sheng-Chieh Chao , Hung-Yi Ou Yang , Wen-Yu Lin
IPC: G02F1/13357 , H01J9/24
CPC classification number: G02F1/133604 , G02F2001/133613
Abstract: A backlight module includes a housing and a plurality of U-type lamps and a plurality of straight-type lamps. The U-type lamps and the straight-type lamps are arranged in an alternate way so that the pitches between the U-type lamps and the straight-type lamps may be various to provide a variation of brightness of the backlight module.
Abstract translation: 背光模块包括壳体和多个U型灯和多个直型灯。 U型灯和直型灯以交替的方式布置，使得U型灯和直型灯之间的间距可以是各种各样的，以提供背光模块的亮度变化。
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