Method for manufacturing polychromatic light emitting diode device having wavelength conversion layer made of semiconductor
    1.
    发明授权
    Method for manufacturing polychromatic light emitting diode device having wavelength conversion layer made of semiconductor 有权
    用于制造具有由半导体制成的波长转换层的多色发光二极管器件的方法

    公开(公告)号:US08580590B2

    公开(公告)日:2013-11-12

    申请号:US13434860

    申请日:2012-03-30

    IPC分类号: H01L21/00

    CPC分类号: H01L33/08 H01L33/0079

    摘要: A method for manufacturing a polychromatic light emitting diode device, comprising steps of providing an epitaxial substrate and forming a multiple semiconductor layer on the epitaxial substrate, wherein the multiple semiconductor layer comprises an n-type semiconductor layer, a p-type semiconductor layer and an active layer. The active layer emits light of a first wavelength. Thereafter a first wavelength conversion layer is formed on the multiple semiconductor layer. The first wavelength conversion layer is made of semiconductor and absorbs a portion of the light of a first wavelength and emits light of a second wavelength, wherein the second wavelength is longer than the first wavelength.

    摘要翻译: 一种制造多色发光二极管器件的方法,包括以下步骤:在外延衬底上提供外延衬底和形成多重半导体层,其中所述多重半导体层包括n型半导体层,p型半导体层和 活动层 有源层发射第一波长的光。 此后,在多个半导体层上形成第一波长转换层。 第一波长转换层由半导体制成,并吸收一部分第一波长的光并发射第二波长的光,其中第二波长比第一波长长。

    III-NITRIDE SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
    2.
    发明申请
    III-NITRIDE SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开
    III-NITRIDE半导体发光器件及其制造方法

    公开(公告)号:US20110210312A1

    公开(公告)日:2011-09-01

    申请号:US13106872

    申请日:2011-05-13

    IPC分类号: H01L33/02

    摘要: A semiconductor light-emitting device includes a substrate, a buffer layer, an n-type semiconductor layer, a conformational active layer and a p-type semiconductor layer. The n-type semiconductor layer includes a first surface and a second surface, and the first surface directly contacts the buffer layer. The second surface includes a plurality of recesses, and a conformational active layer formed on the second surface and within the plurality of recesses. Widths of upper portions of the recesses are larger than widths of lower portions of the recesses. Therefore, the stress between the n-type semiconductor layer and the conformational active layer can be released with the recesses.

    摘要翻译: 半导体发光器件包括衬底,缓冲层,n型半导体层,构象活性层和p型半导体层。 n型半导体层包括第一表面和第二表面,并且第一表面直接接触缓冲层。 第二表面包括多个凹部,以及形成在第二表面上和多个凹部内的构象活性层。 凹部的上部的宽度大于凹部的下部的宽度。 因此,可以用凹部来释放n型半导体层与构象活性层之间的应力。

    LIGHT-EMITTING DEVICE OF GROUP III NITRIDE-BASED SEMICONDUCTOR AND MANUFACTURING METHOD THEREOF
    7.
    发明申请
    LIGHT-EMITTING DEVICE OF GROUP III NITRIDE-BASED SEMICONDUCTOR AND MANUFACTURING METHOD THEREOF 审中-公开
    III类氮化物半导体发光器件及其制造方法

    公开(公告)号:US20090166650A1

    公开(公告)日:2009-07-02

    申请号:US12343984

    申请日:2008-12-24

    IPC分类号: H01L33/00 H01L21/02 H01L21/04

    CPC分类号: H01L33/007

    摘要: A light-emitting device of Group III nitride-based semiconductor comprises a substrate, a first Group III nitride layer and a second Group III nitride layer. The substrate comprises a first surface and a plurality of convex portions protruding from the first surface. Each convex portion is surrounded by a part of the first surface. The first Group III nitride layer is jointly formed by lateral growth starting at top surfaces of the convex portions. The second Group III nitride layer is formed on the first surface, wherein a thickness of the second Group III nitride layer is less than a height of the convex portion. Moreover, the first Group III nitride layer and the second Group III nitride layer are made of a same material.

    摘要翻译: III族氮化物基半导体的发光器件包括衬底,第一III族氮化物层和第二III族氮化物层。 基板包括从第一表面突出的第一表面和多个凸部。 每个凸部被第一表面的一部分包围。 第一III族氮化物层通过从凸部的顶表面开始的横向生长共同形成。 第二III族氮化物层形成在第一表面上,其中第二III族氮化物层的厚度小于凸部的高度。 此外,第一III族氮化物层和第二III族氮化物层由相同的材料制成。

    LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING THE SAME
    10.
    发明申请
    LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    发光元件及其制造方法

    公开(公告)号:US20110186856A1

    公开(公告)日:2011-08-04

    申请号:US12965926

    申请日:2010-12-13

    IPC分类号: H01L33/30

    CPC分类号: H01L33/30

    摘要: A method for manufacturing a light emitting element includes providing a substrate, forming a buffer layer on the substrate, forming a GaN layer on the buffer layer, forming a rough layer on the GaN layer at low temperature, and forming an epitaxial layer on the rough layer, wherein a refraction index of the epitaxial layer exceeds a refraction index of the rough layer. Thus, most light scatters at the rough layer, and then emits upwardly to a light emitting surface, enhancing light extraction efficiency thereof. An epitaxial process of the method is processed in situ in an MOCVD reactor.

    摘要翻译: 一种制造发光元件的方法包括提供衬底,在衬底上形成缓冲层,在缓冲层上形成GaN层,在低温下在GaN层上形成粗糙层,在粗糙层上形成外延层 层,其中所述外延层的折射率超过所述粗糙层的折射率。 因此,大多数光在粗糙层散射,然后向上发射到发光表面,提高其光提取效率。 该方法的外延工艺在MOCVD反应器中原位处理。