公开(公告)号：US20060283688A1

公开(公告)日：2006-12-21

申请号：US11176742

申请日：2005-07-07

申请人： Wendell Blonigan ,  John White

发明人： Wendell Blonigan ,  John White

IPC分类号： B65G47/10

CPC分类号： H01L21/67706 ,  B65G49/064 ,  B65G2249/02 ,  B65G2249/04 ,  H01L21/67709 ,  H01L21/67736

摘要： Embodiments of a substrate handling system are provided herein. In one embodiment apparatus for handling a substrate includes a conveyor having a plurality of rollers arranged to convey a substrate thereon and a substrate handler. The substrate handler includes a first bracket and a first plurality of fingers extending horizontally from the first bracket. The first plurality of fingers has a substrate support surface and is disposed between adjacent ones of the plurality of rollers. The substrate handler is movable between an idle position having the first plurality of fingers disposed beneath a support elevation of the plurality of rollers, and a transfer position having the first plurality of fingers disposed above the plurality of rollers.

摘要翻译： 本文提供了基板处理系统的实施例。 在一个实施例中，用于处理衬底的装置包括具有布置成在其上传送衬底的多个辊和衬底处理器的传送器。 衬底处理器包括第一支架和从第一支架水平延伸的第一多个指状物。 第一多个指状物具有基底支撑表面并且设置在多个辊的相邻辊之间。 衬底处理器可在具有设置在多个辊的支撑高度的第一多个指状物的空闲位置之间移动，以及具有设置在多个辊上方的第一多个指状物的转移位置。

公开(公告)号：US20070102283A1

公开(公告)日：2007-05-10

申请号：US11271660

申请日：2005-11-10

申请人： Tae Won ,  Robert Bachrach ,  John White ,  Wendell Blonigan

发明人： Tae Won ,  Robert Bachrach ,  John White ,  Wendell Blonigan

IPC分类号： C23C14/00

CPC分类号： C23C14/12 ,  C23C14/0036 ,  C23C14/021 ,  C23C14/022 ,  C23C14/0641

摘要： A method for conditioning a surface of a substrate, particularly substrates useful in a fuel cell, is disclosed. In one aspect, a method is disclosed for treating a substrate to increase the substrate's resistance to acid etching. The method includes depositing a layer of etch-resistant material via a PVD process onto a surface of the substrate. The substrate may comprise a carbon composite material or a conductive polymer, among others. In one aspect, the layer of etch-resistant material is about 1000 Å thick or less. In another aspect, the layer of etch-resistant material is a TiN layer. In another embodiment, a method is provided for treating a surface of a substrate decrease the substrate's liquid contact angle. The method includes depositing a layer of hydrophilic material via a PVD process onto a surface of the substrate. In one aspect, the deposited material may be a low resistivity material.

摘要翻译： 公开了一种用于调节基板的表面，特别是可用于燃料电池的基板的方法。 在一个方面，公开了一种用于处理基底以增加基底对酸蚀刻的抵抗力的方法。 该方法包括通过PVD工艺将一层耐蚀刻材料沉积到衬底的表面上。 基底可以包括碳复合材料或导电聚合物等。 在一个方面，耐蚀刻材料层的厚度大约为1000埃或更小。 另一方面，耐蚀刻材料层是TiN层。 在另一个实施方案中，提供了一种用于处理衬底表面的方法，降低了衬底的液体接触角。 该方法包括通过PVD工艺将一层亲水材料沉积到基底的表面上。 在一个方面，沉积材料可以是低电阻率材料。

公开(公告)号：US20060034032A1

公开(公告)日：2006-02-16

申请号：US10919457

申请日：2004-08-16

申请人： John White ,  Wendell Blonigan

发明人： John White ,  Wendell Blonigan

IPC分类号： H01T23/00

CPC分类号： H01L21/6831 ,  C23C16/4586 ,  C23C16/5096

摘要： A method and apparatus for dechucking a substrate is provided. In one embodiment, a processing chamber is provided that includes a grounded chamber body having a substrate support assembly disposed in an interior volume. A dechucking circuit selectively couples the substrate support assembly to ground or to a power source. In another embodiment of the invention, a method for dechucking a substrate includes the steps of completing a plasma process on a substrate disposed on a grounded substrate support assembly, disconnecting the substrate support assembly from ground, and applying a dechucking voltage to the substrate support assembly.

摘要翻译： 提供了一种用于去除基板的方法和装置。 在一个实施例中，提供了处理室，其包括接地室主体，其具有设置在内部容积中的基板支撑组件。 解扣电路将衬底支撑组件选择性地耦合到地或电源。 在本发明的另一个实施例中，一种用于对基板进行去夹套的方法包括以下步骤：在设置在接地的基板支撑组件上的基板上完成等离子体处理，将基板支撑组件从地面断开，以及向基板支撑组件施加脱扣电压 。

公开(公告)号：US20060280588A1

公开(公告)日：2006-12-14

申请号：US11176861

申请日：2005-07-07

申请人： Wendell Blonigan ,  John White

发明人： Wendell Blonigan ,  John White

IPC分类号： B65G1/133 ,  H01L21/677

CPC分类号： B65G49/064 ,  B65G2249/02 ,  B65G2249/04 ,  H01L21/67706 ,  H01L21/67709 ,  H01L21/67736

摘要： Embodiments of a vacuum conveyor system are provided herein. In one embodiment, apparatus for conveying a substrate includes a vacuum sleeve and a plurality of rollers disposed within the vacuum sleeve for supporting and transporting the substrate thereupon. The plurality of rollers is adapted to simultaneously support the substrate thereupon at a plurality of elevations. A leading edge of the substrate is supported at an elevation above an adjacent one of the plurality of rollers in the direction of travel.

摘要翻译： 本文提供了真空输送系统的实施例。 在一个实施例中，用于输送基板的装置包括真空套筒和设置在真空套筒内的多个辊，用于在其上支撑和运输基板。 多个辊适于在多个高度处同时支撑基底。 基板的前缘在行进方向上支撑在多个辊中的相邻的一个上方的高度上。

公开(公告)号：US20060278497A1

公开(公告)日：2006-12-14

申请号：US11176085

申请日：2005-07-07

申请人： John White ,  Wendell Blonigan

发明人： John White ,  Wendell Blonigan

IPC分类号： B23Q7/00

CPC分类号： H01L21/67739 ,  C23C14/56 ,  C23C14/568 ,  C23C16/54

摘要： Embodiments of a vacuum conveyor system are provided herein. In one embodiment a vacuum conveyor system includes a first vacuum sleeve having a plurality of rollers that support and move substrates through the first vacuum sleeve. A port is provided for sealably coupling the first vacuum sleeve to a process chamber. A first substrate handler is disposed proximate the port. Multiple ports may be provided for sealably coupling the first vacuum sleeve to a plurality of process chambers. A dedicated substrate handler is provided for each process chamber. A second vacuum sleeve may be sealably coupled to an opposing side of the process chambers. The vacuum conveyor system may be modular with independent modules linked via load lock chambers. The plurality of rollers may compensate for any sag of the leading edge of a substrate being transported thereupon.

摘要翻译： 本文提供了真空输送系统的实施例。 在一个实施例中，真空输送系统包括具有支撑并移动基板通过第一真空套筒的多个辊的第一真空套筒。 提供端口用于将第一真空套筒密封地联接到处理室。 第一衬底处理器设置在端口附近。 可以提供多个端口用于将第一真空套管密封地联接到多个处理室。 为每个处理室提供专用的基板处理器。 第二真空套筒可以密封地联接到处理室的相对侧。 真空输送系统可以是模块化的，具有通过负载锁定室连接的独立模块。 多个辊可以补偿在其上运送的基板的前缘的任何下垂。

公开(公告)号：US20060060302A1

公开(公告)日：2006-03-23

申请号：US10946403

申请日：2004-09-21

申请人： John White ,  Robin Tiner ,  Beom Park ,  Wendell Blonigan

发明人： John White ,  Robin Tiner ,  Beom Park ,  Wendell Blonigan

IPC分类号： C23F1/00 ,  C23C16/00

CPC分类号： H01J37/32082 ,  H01J37/32174

摘要： An apparatus for providing a short return current path for RF current between a process chamber wall and a substrate support is provided. The RF grounding apparatus, which is RF grounded and is place above the substrate transfer port, establishes electrical contact with the substrate support only during substrate processing, such as deposition, to provide return current path for the RF current. One embodiment of the RF grounding apparatus comprises one or more low impedance flexible curtains, which are electrically connected to the grounded chamber wall, and to one or more low impedance blocks, which make contacts with the substrate support during substrate processing. Another embodiment of the RF grounding apparatus comprises a plurality of low impedance flexible straps, which are electrically connected to the grounded chamber wall, and to one or more low impedance blocks, which make contacts with the substrate support during substrate processing. Yet another embodiment of the RF grounding apparatus comprises a plurality of probes, which either are electrically connected to the grounded chamber wall or are grounded by other means, and actuators accompanying the probes. The actuators move the probes to make electrical contact with the substrate support during substrate processing.

公开(公告)号：US20050265818A1

公开(公告)日：2005-12-01

申请号：US11140777

申请日：2005-05-31

申请人： Wendell Blonigan ,  Carl Sorensen ,  John White ,  Robin Tiner

发明人： Wendell Blonigan ,  Carl Sorensen ,  John White ,  Robin Tiner

IPC分类号： H01L21/683 ,  B65G1/00 ,  B66C1/00 ,  B66C3/00 ,  H01L21/00 ,  H01L21/68 ,  H01L21/687

CPC分类号： H01L21/67259 ,  H01L21/68742 ,  H01L21/68778

摘要： Substrate support methods and apparatus include vertically aligned lift pins that have bearing surfaces that engage friction plates and/or magnetic fields to maintain the vertical orientation of the lift pins during substrate lifting. In some embodiments, a magnetic field and/or weighting may alternatively or additionally be used to control the vertical orientation of the lift pins, limit the angle of the lift pins, and/or prevent the lift pins from unintentionally binding in a susceptor as the susceptor is raised and prevent the resulting uneven support of the substrate.

摘要翻译： 衬底支撑方法和装置包括垂直对齐的提升销，其具有接合摩擦板和/或磁场的承载表面，以在衬垫提升期间保持提升销的垂直取向。 在一些实施例中，可以替代地或另外地使用磁场和/或加权来控制提升销的垂直定向，限制提升销的角度和/或防止提升销在基座中无意地结合，因为 感受器被升高并且防止由此产生的基板不均匀的支撑。

公开(公告)号：US20070086881A1

公开(公告)日：2007-04-19

申请号：US11613556

申请日：2006-12-20

申请人： Shinichi Kurita ,  Wendell Blonigan ,  Akihiro Hosokawa

发明人： Shinichi Kurita ,  Wendell Blonigan ,  Akihiro Hosokawa

IPC分类号： H01L21/677 ,  H01L21/306 ,  C23C16/00 ,  B65H1/00

CPC分类号： H01L21/68742 ,  B65G49/068 ,  B65G2249/02 ,  B65G2249/04 ,  C23C14/566 ,  C23C14/568 ,  C23C16/54 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67167 ,  H01L21/67201 ,  H01L21/67739 ,  H01L21/67745 ,  H01L21/67748

摘要： One embodiment relates to a loadlock having a first support structure therein to support one unprocessed substrate and a second support structure therein to support one processed substrate. The first support structure is located above the second support structure. The loadlock includes an elevator to control the vertical position of the support structures. The loadlock also includes a first aperture to permit insertion of an unprocessed substrate into the loadlock and removal of a processed substrate from the loadlock, as well as a second aperture to permit removal of an unprocessed substrate from the loadlock and insertion of a processed substrate into the loadlock. A cooling plate is also located in the loadlock. The cooling plate includes a surface adapted to support a processed substrate thereon. A heating device may be located in the loadlock above the first support structure.

摘要翻译： 一个实施例涉及一种其中具有第一支撑结构的负载锁，用于支撑一个未处理的基板和其中的第二支撑结构以支撑一个处理的基板。 第一支撑结构位于第二支撑结构的上方。 负载锁包括用于控制支撑结构的垂直位置的电梯。 负载锁还包括第一孔，以允许将未处理的衬底插入到装载锁中并从加载锁中移除经处理的衬底，以及第二孔，以允许将未处理的衬底从负载锁上移除并将经处理的衬底插入 负载锁。 一个冷却板也位于负载锁中。 冷却板包括适于在其上支撑经处理的基板的表面。 加热装置可以位于第一支撑结构上方的装载锁中。

公开(公告)号：US20060051507A1

公开(公告)日：2006-03-09

申请号：US11145003

申请日：2005-06-02

申请人： Shinichi Kurita ,  Wendell Blonigan ,  Makoto Inagawa

发明人： Shinichi Kurita ,  Wendell Blonigan ,  Makoto Inagawa

IPC分类号： C23C16/00

CPC分类号： H01L21/67236 ,  H01L21/67196

摘要： In a first aspect, a first multi-piece chamber is provided. The first multi-piece chamber includes (1) a central piece having a first side and a second side; (2) a first side piece adapted to couple with the first side of the central piece; and (3) a second side piece adapted to couple with the second side of the central piece. The central piece, the first side piece and the second side piece form a substantially cylindrical inner chamber region when coupled together. Numerous other aspects are provided.

摘要翻译： 在第一方面，提供了第一多件式室。 第一多件式室包括（1）具有第一侧和第二侧的中心件; （2）适于与所述中心件的第一侧联接的第一侧件; 和（3）适于与所述中心件的第二侧联接的第二侧件。 当连接在一起时，中心件，第一侧件和第二侧件形成基本上圆柱形的内室区域。 提供了许多其他方面。

公开(公告)号：US20050095088A1

公开(公告)日：2005-05-05

申请号：US10832795

申请日：2004-04-26

申请人： Shinichi Kurita ,  Wendell Blonigan ,  Yoshiaki Tanase

发明人： Shinichi Kurita ,  Wendell Blonigan ,  Yoshiaki Tanase

IPC分类号： B65G49/00 ,  B65G49/06 ,  H01L21/00 ,  H01L21/677 ,  H01L21/68 ,  B65G1/00

CPC分类号： H01L21/67201 ,  B65G49/064 ,  B65G49/067 ,  B65G49/068 ,  B65G2249/02 ,  H01L21/67236 ,  Y10S414/136 ,  Y10S414/137 ,  Y10S414/139

摘要： A load lock chamber and method for transferring large area substrates is provided. In one embodiment, a load lock chamber suitable for transferring large area substrates includes a plurality of vertically stacked single substrate transfer chambers. The configuration of vertically stacked single substrate transfer chambers contributes to reduced size and greater throughput as compared to conventional state of the art, dual slot dual substrate designs. Moreover, the increased throughput has been realized at reduced pumping and venting rates, which corresponds to reduced probability of substrate contamination due to particulates and condensation.

摘要翻译： 提供了一种负载锁定室和用于传送大面积基板的方法。 在一个实施例中，适于传送大面积衬底的负载锁定室包括多个垂直堆叠的单个衬底传送室。 垂直堆叠的单个基板传送室的配置与现有技术的双槽双面基板设计相比，有助于减小尺寸和更大的通量。 此外，在减少的泵送和排气速率下已经实现了增加的产量，这对应于由于颗粒和冷凝引起的底物污染的可能性降低。