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公开(公告)号:US06720212B2
公开(公告)日:2004-04-13
申请号:US10098840
申请日:2002-03-14
IPC分类号: H01L2182
CPC分类号: H01L24/12 , H01L23/3114 , H01L24/11 , H01L2224/0231 , H01L2224/0401 , H01L2224/05147 , H01L2224/05166 , H01L2224/05181 , H01L2224/05184 , H01L2224/05548 , H01L2224/05624 , H01L2224/13099 , H01L2224/45144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/10253 , H01L2924/14 , H01L2924/19043 , H01L2924/00 , H01L2924/00014 , H01L2924/013
摘要: Disclosed is a method of ball grid array packaging, comprising the steps of providing a semiconductor die having a metal conductors thereon, covering said metal conductors with an insulative layer, etching through said insulative layer so as to provide one or more openings to said metal conductors, depositing a compliant material layer, etching through said compliant material layer so as to provide one or more openings to said metal conductors, depositing a substantially homogenous conductive layer, patterning said conductive layer so as to bring at least one of said metal conductors in electrical contact with one or more pads, each said pad comprising a portion of said conductive layer disposed upon said compliant material, and providing solder balls disposed upon said pads. Also disclosed is the apparatus made from the method.
摘要翻译: 公开了一种球栅阵列封装的方法,包括以下步骤:提供其上具有金属导体的半导体管芯,用绝缘层覆盖所述金属导体,蚀刻穿过所述绝缘层,以便向所述金属导体提供一个或多个开口 沉积柔性材料层,蚀刻穿过所述柔性材料层,以便向所述金属导体提供一个或多个开口;沉积基本上均匀的导电层;图案化所述导电层,以将所述金属导体中的至少一个导入电 与一个或多个焊盘接触,每个所述焊盘包括设置在所述柔性材料上的所述导电层的一部分,以及设置在所述焊盘上的焊球。 还公开了由该方法制成的装置。
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公开(公告)号:US6060398A
公开(公告)日:2000-05-09
申请号:US37288
申请日:1998-03-09
IPC分类号: H01L21/302 , H01L21/311 , H01L23/525
CPC分类号: H01L21/31144 , H01L21/31116 , H01L23/5256 , H01L2924/0002
摘要: A method and apparatus for protecting a neighboring area that is adjacent to a first area that is to be etched. The method includes creating a guard cell substantially surrounding the first area, but excluding the neighboring area. The guard cell is formed of a material that is substantially selective to the etch process subsequently employed to etch within the first area. After the guard cell is formed, an etch is performed within the first area, while the guard cell prevents etching of the neighboring are outside the guard cell.
摘要翻译: 一种用于保护与待蚀刻的第一区域相邻的相邻区域的方法和装置。 该方法包括创建基本上围绕第一区域但不包括相邻区域的保护单元。 保护电池由对第一区域中随后用于蚀刻的蚀刻工艺基本选择性的材料形成。 在形成保护单元之后,在第一区域内执行蚀刻,而保护单元防止相邻的蚀刻在保护单元之外。
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公开(公告)号:US06218279B1
公开(公告)日:2001-04-17
申请号:US09512648
申请日:2000-02-24
申请人: Stefan J. Weber , Axel Christoph Brintzinger , Roy Iggulden , Mark Hoinkis , Chandrasekhar Narayan , Robert Van den Berg
发明人: Stefan J. Weber , Axel Christoph Brintzinger , Roy Iggulden , Mark Hoinkis , Chandrasekhar Narayan , Robert Van den Berg
IPC分类号: H01L2144
CPC分类号: H01L23/5256 , H01L2924/0002 , H01L2924/00
摘要: A fuse for semiconductor devices in accordance with the present invention includes a substrate having a conductive path disposed on a surface thereof, a dielectric layer disposed on the substrate and a vertical fuse disposed perpendicularly to the surface through the dielectric layer and connecting to the conductive path, the vertical fuse forming a cavity having a liner material disposed along vertical surfaces of the cavity, the vertical surfaces being melted to blow the fuse. Methods for fabrication of the vertical fuse are also included.
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公开(公告)号:US06495901B2
公开(公告)日:2002-12-17
申请号:US09772377
申请日:2001-01-30
IPC分类号: H01L2348
CPC分类号: H01L23/5258 , H01L2924/0002 , H01L2924/00
摘要: A semiconductor device has a first conductor and a second conductor for fuse terminals. A fuse portion is disposed on a different level relative to both the first conductor and the second conductor. A first contact connects the fuse portion to the first conductor, and a second contact connects the fuse portion to the second conductor.
摘要翻译: 半导体器件具有用于熔丝端子的第一导体和第二导体。 保险丝部分相对于第一导体和第二导体设置在不同的水平上。 第一触点将熔丝部分连接到第一导体,第二触点将熔丝部分连接到第二导体。
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公开(公告)号:US06242789B1
公开(公告)日:2001-06-05
申请号:US09255767
申请日:1999-02-23
申请人: Stefan J. Weber , Axel Christoph Brintzinger , Roy Iggulden , Mark Hoinkis , Chandrasekhar Narayan , Robert Van Den Berg
发明人: Stefan J. Weber , Axel Christoph Brintzinger , Roy Iggulden , Mark Hoinkis , Chandrasekhar Narayan , Robert Van Den Berg
IPC分类号: H01L2900
CPC分类号: H01L23/5256 , H01L2924/0002 , H01L2924/00
摘要: A fuse for semiconductor devices in accordance with the present invention includes a substrate having a conductive path disposed on a surface thereof, a dielectric layer disposed on the substrate and a vertical fuse disposed perpendicularly to the surface through the dielectric layer and connecting to the conductive path, the vertical fuse forming a cavity having a liner material disposed along vertical surfaces of the cavity, the vertical surfaces being melted to blow the fuse. Methods for fabrication of the vertical fuse are also included.
摘要翻译: 根据本发明的用于半导体器件的熔丝包括:具有设置在其表面上的导电通路的基板,设置在基板上的电介质层和垂直于通过介电层垂直于表面设置并连接到导电路径的熔丝 垂直熔丝形成具有沿着空腔的垂直表面设置的衬垫材料的空腔,垂直表面被熔化以熔断熔断器。 还包括制造垂直保险丝的方法。
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公开(公告)号:US07087975B2
公开(公告)日:2006-08-08
申请号:US09751474
申请日:2000-12-28
IPC分类号: H01L29/00
CPC分类号: H01L23/5252 , H01L2924/0002 , H01L2924/00
摘要: A semiconductor device is provided which is formed of a wafer having on a surface thereof an area efficient arrangement of at least two antifuses in vertically stacked relation and sharing a common intermediate electrode therebetween. The arrangement includes at least one lower antifuse having a lower counter electrode and a lower fusible insulator portion defining a lower fuse element of an initial high electrical resistance state which interconnects the lower counter electrode with the common intermediate electrode, and at least one upper antifuse, which may be the same as or different from the lower antifuse, the upper antifuse having an upper counter electrode and an upper fusible insulator portion defining an upper fuse element of an initial high electrical resistance state which interconnects the upper counter electrode with the common intermediate electrode.
摘要翻译: 提供一种半导体器件,其由具有在其表面上的垂直堆叠关系中的至少两个反熔丝的区域有效布置的晶片形成,并且在其间共享公共中间电极。 该装置包括至少一个下部反熔丝,其具有下部对电极和下部可熔绝缘体部分,该熔断绝缘体部分限定了将下部反电极与公共中间电极互连的初始高电阻状态的下部熔丝元件,以及至少一个上部反熔丝, 其可以与下部反熔丝相同或不同,上部反熔丝具有上部对电极和上部可熔绝缘体部分,其限定具有初始高电阻状态的上部熔丝元件,其将上部对置电极与公共中间电极 。
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公开(公告)号:US06495918B1
公开(公告)日:2002-12-17
申请号:US09655461
申请日:2000-09-05
IPC分类号: H01L2348
CPC分类号: H01L23/562 , H01L23/585 , H01L2924/0002 , H01L2924/00
摘要: A semiconductor chip, in accordance with the present invention, includes a substrate and a crack stop structure. The crack structure includes a first conductive line disposed over the substrate and at least two first contacts connected to the substrate and to the first conductive line. The at least two first contacts are spaced apart from each other and extend longitudinally along a length of the first conductive line. A second conductive line is disposed over a portion of the first conductive line, and at least two second contacts are connected to the first conductive line and the second conductive line. The at least two second contacts are spaced apart from each other and extend longitudinally along a length of the second conductive line.
摘要翻译: 根据本发明的半导体芯片包括基板和裂纹停止结构。 裂纹结构包括设置在衬底上的第一导电线和连接到衬底和第一导电线的至少两个第一触点。 所述至少两个第一触点彼此间隔开并沿着第一导线的长度纵向延伸。 第二导线设置在第一导线的一部分上,并且至少两个第二触点连接到第一导线和第二导线。 所述至少两个第二触点彼此间隔开并沿着所述第二导线的长度纵向地延伸。
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