公开(公告)号：US20070111016A1

公开(公告)日：2007-05-17

申请号：US11592943

申请日：2006-11-03

申请人： William Brenneman ,  Szuchain Chen ,  Harvey Cheskis

发明人： William Brenneman ,  Szuchain Chen ,  Harvey Cheskis

IPC分类号： B32B15/04 ,  B21C37/00 ,  B05D5/12

CPC分类号： H05K3/384 ,  B32B15/04 ,  C23C2222/20 ,  C25D3/56 ,  C25D7/0614 ,  C25D9/08 ,  C25D11/38 ,  H01L21/4846 ,  H01L21/486 ,  H05K3/0035 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2201/2054 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12993 ,  Y10T428/31678

摘要： A copper foil for lamination to a dielectric substrate is coated with a laser ablation inhibiting layer having an average surface roughness (Rz) of less than 1.0 micron and an average nodule height of less than 1.2 micron that is effective to provide a lamination peel strength to FR-4 of at least 4.5 pounds per inch. The coated foil further has a reflectivity value of at least 40. The coated foil is typically laminated to a dielectric substrate, such as glass reinforced epoxy or polyimide and imaged into a plurality of circuit traces. Blind vias may be drilled through the dielectric terminating at an interface between the foil and the dielectric. The coated foil of the invention resists laser ablation, thereby resisting piercing of the foil by the laser during drilling.

摘要翻译： 用于层叠到电介质基板的铜箔涂覆有具有小于1.0微米的平均表面粗糙度（R z）和小于1.2微米的平均结节高度的激光烧蚀抑制层，其为 有效地提供至少4.5磅/英寸的FR-4的层压剥离强度。 涂覆的箔还具有至少40的反射率值。涂覆的箔通常层压到电介质基底，例如玻璃增强的环氧树脂或聚酰亚胺并成像为多个电路迹线。 盲孔可以穿过电介质终止于箔和电介质之间的界面处。 本发明的涂覆箔可抵抗激光烧蚀，从而在钻孔期间抵抗激光穿透箔片。

公开(公告)号：US5650592A

公开(公告)日：1997-07-22

申请号：US42913

申请日：1993-04-05

申请人： Harvey Cheskis ,  Deepak Mahulikar

发明人： Harvey Cheskis ,  Deepak Mahulikar

IPC分类号： H01L23/06 ,  H01L23/14 ,  H01L23/373 ,  H01L23/02

CPC分类号： H01L23/3733 ,  H01L23/06 ,  H01L23/142 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H01L2924/167 ,  H01L2924/16787 ,  H01L2924/1679

摘要： There is provided a component for use in electronic packaging. The component is a composite having a graphite matrix which is infiltrated with a metal or a metal alloy and the external surfaces of the composite then coated with a metallic layer to provide environmental and mechanical protection. The packaging components are lightweight, have a coefficient of thermal expansion close to that of a silicon based integrated circuit device and further, have a high coefficient of thermal conductivity.

摘要翻译： 提供了用于电子包装的部件。 组分是具有用金属或金属合金渗透的石墨基质的复合材料，然后复合材料的外表面涂覆有金属层以提供环境和机械保护。 封装部件重量轻，热膨胀系数接近硅基集成电路器件的热膨胀系数，并且还具有高导热系数。