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公开(公告)号：US20050064740A1
公开(公告)日：2005-03-24
申请号：US10979366
申请日：2004-11-01
申请人： William Brodsky , Benson Chan , Michael Gaynes , Voya Markovich
发明人： William Brodsky , Benson Chan , Michael Gaynes , Voya Markovich
CPC分类号： H01R12/523 , H05K3/325 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165 , Y10T29/49213
摘要： The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.
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公开(公告)号：US20070111558A1
公开(公告)日：2007-05-17
申请号：US11650748
申请日：2007-01-08
申请人： William Brodsky , William Buchler , Benson Chan , Michael Gaynes
发明人： William Brodsky , William Buchler , Benson Chan , Michael Gaynes
IPC分类号： H01R12/00
CPC分类号： H01R13/2414 , H01R12/714 , H01R13/2407 , H05K7/1069
摘要： A method and apparatus for interconnecting an electronic module to a substrate through resilient wire conductors in an interposer arrangement. A carrier layer of insulating material with an array of apertures, arranged to align with both the electrical pads on an electronic module and electrical contacts on a substrate, each hold, for example, a resilient wadded wire connector. Each connector extends through the aperture provided and beyond the upper and lower surfaces of the carrier layer. Each resilient wadded wire connector and aperture is encapsulated with a elastomeric insulating material sufficiently deformable so as to allow said resilient wadded wire connector to deform upon application of a normal force from each side tending to depress the connector into its aperture. The encapsulation prevents loss or smear of a wadded wire connector when handling.
摘要翻译： 一种用于通过插入件布置中的弹性导线将电子模块与衬底相互连接的方法和装置。 具有孔阵列的绝缘材料的载体层，被布置成与电子模块上的电焊盘和基板上的电接触对准，每个保持例如弹性填充的电线连接器。 每个连接器延伸穿过提供的并超出载体层的上表面和下表面的孔。 每个弹性填充的电线连接器和孔被具有充分可变形的弹性体绝缘材料封装，从而允许所述弹性填充电线连接器在施加来自每个侧面的法向力时变形，以将连接器压入其孔。 封装防止在处理时填充电线连接器的损坏或污迹。
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公开(公告)号：US20060057867A1
公开(公告)日：2006-03-16
申请号：US11262134
申请日：2005-10-28
申请人： William Brodsky , William Buchler , Benson Chan , Michael Gaynes
发明人： William Brodsky , William Buchler , Benson Chan , Michael Gaynes
IPC分类号： H01R12/00
CPC分类号： H01R13/2414 , H01R12/714 , H01R13/2407 , H05K7/1069
摘要： A method and apparatus for interconnecting an electronic module to a substrate through resilient wire conductors in an interposer arrangement. A carrier layer of insulating material with an array of apertures, arranged to align with both the electrical pads on an electronic module and electrical contacts on a substrate, each hold, for example, a resilient wadded wire connector. Each connector extends through the aperture provided and beyond the upper and lower surfaces of the carrier layer. Each resilient wadded wire connector and aperture is encapsulated with a elastomeric insulating material sufficiently deformable so as to allow said resilient wadded wire connector to deform upon application of a normal force from each side tending to depress the connector into its aperture. The encapsulation prevents loss or smear of a wadded wire connector when handling.
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公开(公告)号：US20050282409A1
公开(公告)日：2005-12-22
申请号：US10873037
申请日：2004-06-22
申请人： William Brodsky , William Buchler , Benson Chan , Michael Gaynes
发明人： William Brodsky , William Buchler , Benson Chan , Michael Gaynes
CPC分类号： H01R13/2414 , H01R12/714 , H01R13/2407 , H05K7/1069
摘要： A method and apparatus for interconnecting an electronic module to a substrate through resilient wire conductors in an interposer arrangement. A carrier layer of insulating material with an array of apertures, arranged to align with both the electrical pads on an electronic module and electrical contacts on a substrate, each hold, for example, a resilient wadded wire connector. Each connector extends through the aperture provided and beyond the upper and lower surfaces of the carrier layer. Each resilient wadded wire connector and aperture is encapsulated with a elastomeric insulating material sufficiently deformable so as to allow said resilient wadded wire connector to deform upon application of a normal force from each side tending to depress the connector into its aperture. The encapsulation prevents loss or smear of a wadded wire connector when handling.
摘要翻译： 一种用于通过插入件布置中的弹性导线将电子模块与衬底相互连接的方法和装置。 具有孔阵列的绝缘材料的载体层，被布置成与电子模块上的电焊盘和基板上的电接触对准，每个保持例如弹性填充的电线连接器。 每个连接器延伸穿过提供的并超出载体层的上表面和下表面的孔。 每个弹性填充的电线连接器和孔被具有充分可变形的弹性体绝缘材料封装，从而允许所述弹性填充电线连接器在施加来自每个侧面的法向力时变形，以将连接器压入其孔。 封装防止在处理时填充电线连接器的损坏或污迹。
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5.发明授权公开(公告)号：US08001026B2
公开(公告)日：2011-08-16
申请号：US12648045
申请日：2009-12-28
申请人： William Brodsky , William Speth
发明人： William Brodsky , William Speth
IPC分类号： G06Q40/00
摘要： A method and system for creating a stock index for a group of investment management companies is disclosed. The method may include obtaining first trade information for each security representative of the group of investment management companies during a first time period, aggregating the first trade information for a predetermined time period, storing the aggregated first trade information, calculating from the aggregated first trade information an index for the group of investment management companies, determining a standardized measure of the index based on the aggregated first trade information obtained in the first time period, and periodically recalculating the index based on second trade information for each security representative of the group of investment management companies during a second time period.
摘要翻译： 披露了一批投资管理公司创建股票指数的方法和制度。 该方法可以包括在第一时间段期间为投资管理公司组的每个安全代表获取第一交易信息，将预定时间段内的第一交易信息聚合，存储聚合的第一交易信息，从汇总的第一交易信息 投资管理公司集团的指标，根据第一期获得的第一批交易信息确定标准化指标，并根据投资集团各证券代理人的第二交易信息定期重新计算指标 管理公司在第二时期。
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6.发明申请公开(公告)号：US20100191669A1
公开(公告)日：2010-07-29
申请号：US12648045
申请日：2009-12-28
申请人： William Brodsky , William Speth
发明人： William Brodsky , William Speth
IPC分类号： G06Q40/00
摘要： A method and system for creating a stock index for a group of investment management companies is disclosed. The method may include obtaining first trade information for each security representative of the group of investment management companies during a first time period, aggregating the first trade information for a predetermined time period, storing the aggregated first trade information, calculating from the aggregated first trade information an index for the group of investment management companies, determining a standardized measure of the index based on the aggregated first trade information obtained in the first time period, and periodically recalculating the index based on second trade information for each security representative of the group of investment management companies during a second time period.
摘要翻译： 披露了一批投资管理公司创建股票指数的方法和制度。 该方法可以包括在第一时间段期间为投资管理公司组的每个安全代表获取第一交易信息，将预定时间段内的第一交易信息聚合，存储聚合的第一交易信息，从汇总的第一交易信息 投资管理公司集团的指标，根据第一期获得的第一批交易信息确定标准化指标，并根据投资集团各证券代理人的第二交易信息定期重新计算指标 管理公司在第二时期。
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7.发明申请公开(公告)号：US20080059356A1
公开(公告)日：2008-03-06
申请号：US11513893
申请日：2006-08-31
申请人： William Brodsky , William Speth
发明人： William Brodsky , William Speth
IPC分类号： G06Q40/00
摘要： A method and system for creating a stock index for a group of investment management companies is disclosed. The method may include obtaining first trade information for each security representative of the group of investment management companies during a first time period, aggregating the first trade information for a predetermined time period, storing the aggregated first trade information, calculating from the aggregated first trade information an index for the group of investment management companies, determining a standardized measure of the index based on the aggregated first trade information obtained in the first time period, and periodically recalculating the index based on second trade information for each security representative of the group of investment management companies during a second time period.
摘要翻译： 披露了一批投资管理公司创建股票指数的方法和制度。 该方法可以包括在第一时间段期间为投资管理公司组的每个安全代表获取第一交易信息，将预定时间段内的第一交易信息聚合，存储聚合的第一交易信息，从汇总的第一交易信息 投资管理公司集团的指标，根据第一期获得的第一批交易信息确定标准化指标，并根据投资集团各证券代理人的第二交易信息定期重新计算指标 管理公司在第二时期。
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公开(公告)号：US20070259538A1
公开(公告)日：2007-11-08
申请号：US11381858
申请日：2006-05-05
IPC分类号： H01R12/00
CPC分类号： H01R12/52 , H01L2924/00013 , H05K1/0262 , H05K1/144 , H05K3/3447 , H05K3/368 , H05K2201/10424 , H01L2224/29099
摘要： A connector for a voltage regulator module (VRM) that provides for a parallel coupling to a printed wiring board (PWB) without surface mounting of the VRM includes a plurality of conductive power blades mounted within slots of insulators. The VRM connector is coupled to PWB and VRM and provides for spacing between the VRM and the PWB. The VRM connector provides for high current flow and reduced circuit heating.
摘要翻译： 用于在没有VRM的表面安装的情况下提供与印刷线路板（PWB）的并联耦合的电压调节器模块（VRM）的连接器包括安装在绝缘体的槽内的多个导电动力叶片。 VRM连接器连接到PWB和VRM，并提供VRM和PWB之间的间隔。 VRM连接器提供高电流和减少电路加热。
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公开(公告)号：US20070227769A1
公开(公告)日：2007-10-04
申请号：US11760919
申请日：2007-06-11
CPC分类号： H01R13/2407 , H01R12/52 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49169 , Y10T29/49204 , Y10T29/49208
摘要： A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).
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公开(公告)号：US20060205273A1
公开(公告)日：2006-09-14
申请号：US10906810
申请日：2005-03-08
申请人： William Brodsky , James Busby , Bruce Chamberlin , Mitchell Ferrill , Robin Susko , James Wilcox
发明人： William Brodsky , James Busby , Bruce Chamberlin , Mitchell Ferrill , Robin Susko , James Wilcox
IPC分类号： H01R13/40
CPC分类号： H01L23/49811 , H01L24/16 , H01L24/81 , H01L2224/0501 , H01L2224/05011 , H01L2224/05026 , H01L2224/05548 , H01L2224/056 , H01L2224/81141 , H01L2224/81191 , H01L2224/81193 , H01L2924/00014 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01082 , H01L2924/12044 , H01L2924/14 , H01L2924/30107 , H01R4/01 , H01R12/52 , H05K3/325 , H05K2201/068 , H05K2201/209 , H05K2203/1105 , H01L2224/05099
摘要： A method and structure is disclosed for forming a removable interconnect for semiconductor packages, where the connector is adapted to repeatedly change from a first shape into a second shape upon being subjected to a temperature change and to repeatedly return to the first shape when not being subjected to the temperature change. The connector can be disconnected when the connector is in its second shape and the connector cannot be disconnected when the connector is in its first shape.
摘要翻译： 公开了一种用于形成用于半导体封装的可移除互连的方法和结构，其中连接器适于在经受温度变化时从第一形状重复地变为第二形状，并且在不受影响时重复地返回到第一形状 到温度变化。 当连接器处于其第二形状时，连接器可以断开，并且当连接器处于其第一形状时连接器不能断开。
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