公开(公告)号：US20050282409A1

公开(公告)日：2005-12-22

申请号：US10873037

申请日：2004-06-22

申请人： William Brodsky ,  William Buchler ,  Benson Chan ,  Michael Gaynes

发明人： William Brodsky ,  William Buchler ,  Benson Chan ,  Michael Gaynes

IPC分类号： H01R12/00 ,  H01R13/24

CPC分类号： H01R13/2414 ,  H01R12/714 ,  H01R13/2407 ,  H05K7/1069

摘要： A method and apparatus for interconnecting an electronic module to a substrate through resilient wire conductors in an interposer arrangement. A carrier layer of insulating material with an array of apertures, arranged to align with both the electrical pads on an electronic module and electrical contacts on a substrate, each hold, for example, a resilient wadded wire connector. Each connector extends through the aperture provided and beyond the upper and lower surfaces of the carrier layer. Each resilient wadded wire connector and aperture is encapsulated with a elastomeric insulating material sufficiently deformable so as to allow said resilient wadded wire connector to deform upon application of a normal force from each side tending to depress the connector into its aperture. The encapsulation prevents loss or smear of a wadded wire connector when handling.

摘要翻译： 一种用于通过插入件布置中的弹性导线将电子模块与衬底相互连接的方法和装置。 具有孔阵列的绝缘材料的载体层，被布置成与电子模块上的电焊盘和基板上的电接触对准，每个保持例如弹性填充的电线连接器。 每个连接器延伸穿过提供的并超出载体层的上表面和下表面的孔。 每个弹性填充的电线连接器和孔被具有充分可变形的弹性体绝缘材料封装，从而允许所述弹性填充电线连接器在施加来自每个侧面的法向力时变形，以将连接器压入其孔。 封装防止在处理时填充电线连接器的损坏或污迹。

公开(公告)号：US20070111558A1

公开(公告)日：2007-05-17

申请号：US11650748

申请日：2007-01-08

申请人： William Brodsky ,  William Buchler ,  Benson Chan ,  Michael Gaynes

发明人： William Brodsky ,  William Buchler ,  Benson Chan ,  Michael Gaynes

IPC分类号： H01R12/00

CPC分类号： H01R13/2414 ,  H01R12/714 ,  H01R13/2407 ,  H05K7/1069

摘要： A method and apparatus for interconnecting an electronic module to a substrate through resilient wire conductors in an interposer arrangement. A carrier layer of insulating material with an array of apertures, arranged to align with both the electrical pads on an electronic module and electrical contacts on a substrate, each hold, for example, a resilient wadded wire connector. Each connector extends through the aperture provided and beyond the upper and lower surfaces of the carrier layer. Each resilient wadded wire connector and aperture is encapsulated with a elastomeric insulating material sufficiently deformable so as to allow said resilient wadded wire connector to deform upon application of a normal force from each side tending to depress the connector into its aperture. The encapsulation prevents loss or smear of a wadded wire connector when handling.

摘要翻译： 一种用于通过插入件布置中的弹性导线将电子模块与衬底相互连接的方法和装置。 具有孔阵列的绝缘材料的载体层，被布置成与电子模块上的电焊盘和基板上的电接触对准，每个保持例如弹性填充的电线连接器。 每个连接器延伸穿过提供的并超出载体层的上表面和下表面的孔。 每个弹性填充的电线连接器和孔被具有充分可变形的弹性体绝缘材料封装，从而允许所述弹性填充电线连接器在施加来自每个侧面的法向力时变形，以将连接器压入其孔。 封装防止在处理时填充电线连接器的损坏或污迹。

公开(公告)号：US20060057867A1

公开(公告)日：2006-03-16

申请号：US11262134

申请日：2005-10-28

申请人： William Brodsky ,  William Buchler ,  Benson Chan ,  Michael Gaynes

发明人： William Brodsky ,  William Buchler ,  Benson Chan ,  Michael Gaynes

IPC分类号： H01R12/00

CPC分类号： H01R13/2414 ,  H01R12/714 ,  H01R13/2407 ,  H05K7/1069

摘要： A method and apparatus for interconnecting an electronic module to a substrate through resilient wire conductors in an interposer arrangement. A carrier layer of insulating material with an array of apertures, arranged to align with both the electrical pads on an electronic module and electrical contacts on a substrate, each hold, for example, a resilient wadded wire connector. Each connector extends through the aperture provided and beyond the upper and lower surfaces of the carrier layer. Each resilient wadded wire connector and aperture is encapsulated with a elastomeric insulating material sufficiently deformable so as to allow said resilient wadded wire connector to deform upon application of a normal force from each side tending to depress the connector into its aperture. The encapsulation prevents loss or smear of a wadded wire connector when handling.

公开(公告)号：US20050064740A1

公开(公告)日：2005-03-24

申请号：US10979366

申请日：2004-11-01

申请人： William Brodsky ,  Benson Chan ,  Michael Gaynes ,  Voya Markovich

发明人： William Brodsky ,  Benson Chan ,  Michael Gaynes ,  Voya Markovich

IPC分类号： H05K3/32 ,  H01R12/00

CPC分类号： H01R12/523 ,  H05K3/325 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165 ,  Y10T29/49213

摘要： The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.

公开(公告)号：US20120049341A1

公开(公告)日：2012-03-01

申请号：US13290824

申请日：2011-11-07

申请人： Raschid Jose Bezama ,  Evan George Colgan ,  Michael Gaynes ,  John Harold Magerlein ,  Kenneth C. Marston ,  Xiaojin Wei

发明人： Raschid Jose Bezama ,  Evan George Colgan ,  Michael Gaynes ,  John Harold Magerlein ,  Kenneth C. Marston ,  Xiaojin Wei

IPC分类号： H01L23/34

CPC分类号： H01L23/473 ,  H01L23/3675 ,  H01L23/49833 ,  H01L23/4985 ,  H01L2023/4043 ,  H01L2023/4087 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/00

摘要： Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.

摘要翻译： 提供半导体封装结构，其被设计成具有与第一级芯片模块整体封装的液体冷却器。 特别地，用于将第一级芯片封装结构中的液体冷却器装置整体封装的装置包括其中液体冷却器装置直接热耦合到安装在柔性芯片载体衬底上的集成电路芯片倒装芯片的背面的结构。 液体冷却器装置通过金属加强结构机械耦合到封装基板，金属加强结构结合到柔性封装基板上，以向柔性封装基板提供机械刚性。

公开(公告)号：US20090283902A1

公开(公告)日：2009-11-19

申请号：US12120029

申请日：2008-05-13

申请人： Raschid Jose Bezama ,  Evan George Colgan ,  Michael Gaynes ,  John Harold Magerlein ,  Kenneth C. Marston ,  Xiaojin Wei

发明人： Raschid Jose Bezama ,  Evan George Colgan ,  Michael Gaynes ,  John Harold Magerlein ,  Kenneth C. Marston ,  Xiaojin Wei

IPC分类号： H01L23/473

CPC分类号： H01L23/473 ,  H01L23/3675 ,  H01L23/49833 ,  H01L23/4985 ,  H01L2023/4043 ,  H01L2023/4087 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/00

摘要： Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.

摘要翻译： 提供半导体封装结构，其被设计成具有与第一级芯片模块整体封装的液体冷却器。 特别地，用于将第一级芯片封装结构中的液体冷却器装置整体封装的装置包括其中液体冷却器装置直接热耦合到安装在柔性芯片载体衬底上的集成电路芯片倒装芯片的背面的结构。 液体冷却器装置通过金属加强结构机械耦合到封装基板，金属加强结构结合到柔性封装基板上，以向柔性封装基板提供机械刚性。

公开(公告)号：US20060268521A1

公开(公告)日：2006-11-30

申请号：US10908796

申请日：2005-05-26

申请人： Jeffrey Coffin ,  Michael Gaynes ,  David Questad ,  Kamal Sikka ,  Hilton Toy ,  Jamil Wakil

发明人： Jeffrey Coffin ,  Michael Gaynes ,  David Questad ,  Kamal Sikka ,  Hilton Toy ,  Jamil Wakil

IPC分类号： H05K7/20

CPC分类号： H01L23/34 ,  H01L23/3735 ,  H01L23/42 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/3511 ,  Y10T29/49004 ,  Y10T29/49083 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/4935

摘要： Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.

摘要翻译： 披露的是导热板。 每个板被构造成使得当板结合到发热结构并经受使得发热结构的预定温度范围内的温度时，板和发热结构之间可以实现均匀的粘合剂填充的间隙 经。 另外，本公开提供了形成板并将板结合到发热结构的相关方法。 在一个实施例中，板是弯曲的并被建模以使发热结构的弯曲表面在预定温度范围内匹配。 在另一个实施例中，板是多层导电结构，其被配置为在与热产生结构相关的热负荷下经历相同的翘曲。 因此，当板与发热结构接合时，能够在任何温度下实现和保持均匀的粘合剂填充间隙。

公开(公告)号：US20060255442A1

公开(公告)日：2006-11-16

申请号：US11125499

申请日：2005-05-10

申请人： Michael Gaynes ,  Kathleen Hinge ,  John Knickerbocker

发明人： Michael Gaynes ,  Kathleen Hinge ,  John Knickerbocker

IPC分类号： H01L23/02

CPC分类号： H05K1/0271 ,  H01L23/562 ,  H01L2224/16 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H05K1/181 ,  H05K3/0058 ,  H05K2201/068 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2201/2009 ,  H01L2924/00 ,  H01L2224/0401

摘要： Apparatus and methods are provided for constructing balanced semiconductor chip package structures that minimize bowing, in-plane strain and/or other thermally induced mechanical strains that may arise during thermal cycling, to thus prevent structural damage to chip package structures.

公开(公告)号：US08772927B2

公开(公告)日：2014-07-08

申请号：US13290824

申请日：2011-11-07

申请人： Raschid Jose Bezama ,  Evan George Colgan ,  Michael Gaynes ,  John Harold Magerlein ,  Kenneth C. Marston ,  Xiaojin Wei

发明人： Raschid Jose Bezama ,  Evan George Colgan ,  Michael Gaynes ,  John Harold Magerlein ,  Kenneth C. Marston ,  Xiaojin Wei

IPC分类号： H01L23/34

CPC分类号： H01L23/473 ,  H01L23/3675 ,  H01L23/49833 ,  H01L23/4985 ,  H01L2023/4043 ,  H01L2023/4087 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/00

摘要： Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.

摘要翻译： 提供半导体封装结构，其被设计成具有与第一级芯片模块整体封装的液体冷却器。 特别地，用于将第一级芯片封装结构中的液体冷却器装置整体封装的装置包括其中液体冷却器装置直接热耦合到安装在柔性芯片载体衬底上的集成电路芯片倒装芯片的背面的结构。 液体冷却器装置通过金属加强结构机械耦合到封装基板，金属加强结构结合到柔性封装基板上，以向柔性封装基板提供机械刚性。

公开(公告)号：US07763188B2

公开(公告)日：2010-07-27

申请号：US11072193

申请日：2005-03-04

申请人： Michael Gaynes ,  Jeffrey D. Gelorme ,  Luis J. Matienzo ,  Rebecca S. Northey ,  Michael B. Vincent

发明人： Michael Gaynes ,  Jeffrey D. Gelorme ,  Luis J. Matienzo ,  Rebecca S. Northey ,  Michael B. Vincent

IPC分类号： H01B1/06 ,  H01B1/02

CPC分类号： C09J163/00 ,  C08L63/00 ,  C09J9/02 ,  H05K1/095 ,  H05K3/321 ,  H05K3/4069 ,  H05K2203/122 ,  Y10T156/10 ,  Y10T428/24917

摘要： An electrically conductive adhesive (ECA) with low and stable contact resistance includes at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, copper particles, at least one curing agent and at least one organic acid catalyst. The ECA is useful for filling vias, and bonding together components of electronic circuit structures.

摘要翻译： 具有低且稳定的接触电阻的导电粘合剂（ECA）包括至少一种可熔融加工的反应性树脂，至少一种反应性稀释剂，至少一种流变添加剂，铜颗粒，至少一种固化剂和至少一种有机酸催化剂 。 ECA可用于填充通孔，并将电子电路结构的组件结合在一起。