公开(公告)号：US20050285199A1

公开(公告)日：2005-12-29

申请号：US11137691

申请日：2005-05-25

申请人： Wolfgang Stadler ,  Werner Ertle ,  Bernd Goller ,  Michael Horn ,  Manfred Hermann ,  Giuseppe Miccoli

发明人： Wolfgang Stadler ,  Werner Ertle ,  Bernd Goller ,  Michael Horn ,  Manfred Hermann ,  Giuseppe Miccoli

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L23/50 ,  H01L23/62

CPC分类号： H01L24/05 ,  H01L23/562 ,  H01L24/03 ,  H01L2224/02166 ,  H01L2224/05624 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/30105 ,  H01L2924/00014

摘要： A semiconductor circuit containing a pad for electrical bonding of the semiconductor circuit and a metal arrangement disposed beneath the pad. The metal arrangement is in a metal layer of the semiconductor circuit located closest to the pad and is electrically insulated from the pad and from a strip conductor located beneath the metal arrangement. More than one metal layer can contain a metal arrangement. Each metal arrangement is a full-area plate that overlaps all edges of the pad or has a regular structure of small square plates. If adjacent metal arrangements are constructed from small plates, the plates in one metal arrangement overlap to cover gaps in the other metal arrangement.

摘要翻译： 一种半导体电路，包括用于半导体电路的电接合的焊盘和设置在焊盘下方的金属布置。 金属布置在最靠近焊盘的半导体电路的金属层中，并且与焊盘和位于金属布置下方的带状导体电绝缘。 多于一个金属层可以包含金属布置。 每个金属布置是与面板的所有边缘重叠或具有小方块的规则结构的全区域板。 如果相邻的金属布置由小板构成，则一个金属布置中的板重叠以覆盖另一金属布置中的间隙。

公开(公告)号：US20110294238A1

公开(公告)日：2011-12-01

申请号：US13192974

申请日：2011-07-28

申请人： Werner Ertle ,  Bernd Goller ,  Michael Horn ,  Bernd Kothe

发明人： Werner Ertle ,  Bernd Goller ,  Michael Horn ,  Bernd Kothe

IPC分类号： H01L21/66

CPC分类号： H01L24/06 ,  H01L22/32 ,  H01L24/05 ,  H01L2224/02166 ,  H01L2224/0392 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/4943 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention relates to an arrangement of contact areas and test areas on patterned semiconductor chips. The contact areas and the test areas are electrically connected to one another via a conduction web. Whereas the contact areas are arranged in a first region, which has no components of an integrated circuit, the test areas lie in a second region of the top side of the semiconductor chip, which region has components of an integrated circuit.

摘要翻译： 本发明涉及图案化半导体芯片上的接触区域和测试区域的布置。 接触区域和测试区域通过传导网彼此电连接。 而接触区域布置在没有集成电路的部件的第一区域中，测试区域位于半导体芯片的顶侧的第二区域中，该区域具有集成电路的部件。

公开(公告)号：US08044394B2

公开(公告)日：2011-10-25

申请号：US10522502

申请日：2003-07-29

申请人： Werner Ertle ,  Bernd Goller ,  Michael Horn ,  Bernd Kothe

发明人： Werner Ertle ,  Bernd Goller ,  Michael Horn ,  Bernd Kothe

IPC分类号： H01L23/58

CPC分类号： H01L24/06 ,  H01L22/32 ,  H01L24/05 ,  H01L2224/02166 ,  H01L2224/0392 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/4943 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention relates to an arrangement of contact areas and test areas on patterned semiconductor chips. The contact areas and the test areas are electrically connected to one another via a conduction web. Whereas the contact areas are arranged in a first region, which has no components of an integrated circuit, the test areas lie in a second region of the top side of the semiconductor chip, which region has components of an integrated circuit.

摘要翻译： 本发明涉及图案化半导体芯片上的接触区域和测试区域的布置。 接触区域和测试区域通过传导网彼此电连接。 而接触区域布置在没有集成电路的部件的第一区域中，测试区域位于半导体芯片的顶侧的第二区域中，该区域具有集成电路的部件。

公开(公告)号：US20060097386A1

公开(公告)日：2006-05-11

申请号：US10522502

申请日：2003-07-29

申请人： Werner Ertle ,  Bernd Goller ,  Michael Horn ,  Bernd Kothe

发明人： Werner Ertle ,  Bernd Goller ,  Michael Horn ,  Bernd Kothe

IPC分类号： H01L23/34

CPC分类号： H01L24/06 ,  H01L22/32 ,  H01L24/05 ,  H01L2224/02166 ,  H01L2224/0392 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/4943 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention relates to an arrangement of contact areas and test areas on patterned semiconductor chips. The contact areas and the test areas are electrically connected to one another via a conduction web. Whereas the contact areas are arranged in a first region, which has no components of an integrated circuit, the test areas lie in a second region of the top side of the semiconductor chip, which region has components of an integrated circuit.

摘要翻译： 本发明涉及图案化半导体芯片上的接触区域和测试区域的布置。 接触区域和测试区域通过传导网彼此电连接。 而接触区域布置在没有集成电路的部件的第一区域中，测试区域位于半导体芯片的顶侧的第二区域中，该区域具有集成电路的部件。

公开(公告)号：US08753901B2

公开(公告)日：2014-06-17

申请号：US13192974

申请日：2011-07-28

申请人： Ertle Werner ,  Bernd Goller ,  Michael Horn ,  Bernd Kothe

发明人： Ertle Werner ,  Bernd Goller ,  Michael Horn ,  Bernd Kothe

IPC分类号： H01L21/66 ,  G01R31/26

CPC分类号： H01L24/06 ,  H01L22/32 ,  H01L24/05 ,  H01L2224/02166 ,  H01L2224/0392 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/4943 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention relates to an arrangement of contact areas and test areas on patterned semiconductor chips. The contact areas and the test areas are electrically connected to one another via a conduction web. Whereas the contact areas are arranged in a first region, which has no components of an integrated circuit, the test areas lie in a second region of the top side of the semiconductor chip, which region has components of an integrated circuit.

摘要翻译： 本发明涉及图案化半导体芯片上的接触区域和测试区域的布置。 接触区域和测试区域通过传导网彼此电连接。 而接触区域布置在没有集成电路的部件的第一区域中，测试区域位于半导体芯片的顶侧的第二区域中，该区域具有集成电路的部件。

公开(公告)号：US08271159B2

公开(公告)日：2012-09-18

申请号：US11886496

申请日：2006-03-15

申请人： Jürgen Kröber ,  Michael Horn ,  Mirja Abel ,  Günther Reith

发明人： Jürgen Kröber ,  Michael Horn ,  Mirja Abel ,  Günther Reith

IPC分类号： B60T8/172

CPC分类号： B60W30/04 ,  B60G17/0162 ,  B60G2400/61 ,  B60G2800/012 ,  B60G2800/9122 ,  B60G2800/9124 ,  B60T8/172 ,  B60T8/1755 ,  B60T2230/03 ,  B60T2250/02 ,  B60W40/13 ,  B60W2520/14 ,  G01G19/086

摘要： A method of stabilizing a vehicle, in particular for stabilizing the vehicle with respect to tilting movements, to the load condition of the vehicle, performs a control depending on a load condition of the vehicle, and the load condition of the vehicle is determined by way of a vehicle mass that is established due to a balance of forces that act on the vehicle, and/or by way of a characteristic speed of the vehicle.

摘要翻译： 一种使车辆稳定的方法，特别是用于将车辆相对于倾斜运动稳定到车辆的负载状态，根据车辆的负载状况进行控制，并且车辆的负载状况由车辆确定 由于作用于车辆的力的平衡和/或通过车辆的特征速度而建立的车辆质量。

公开(公告)号：US20080133101A1

公开(公告)日：2008-06-05

申请号：US11630591

申请日：2005-06-24

申请人： Jurgen Woywod ,  Ralph Gronau ,  Artur Kost ,  Michael Horn

发明人： Jurgen Woywod ,  Ralph Gronau ,  Artur Kost ,  Michael Horn

IPC分类号： B60T8/1755

CPC分类号： B60T8/17554 ,  B60T2220/03 ,  B60T2230/03

摘要： A method for suppressing a lateral rollover tendency of an at least two-axle and at least two-track vehicle, wherein when a first threshold value of a dynamic and/or static quantity correlating with a vehicle lateral acceleration is exceeded, maximum brake pressures are introduced into the wheel brakes of the vehicle as a rollover prevention, with the threshold value representing a value at which a risk of rollover is encountered at a permissible vehicle load of any type; and a second threshold value of a quantity correlating with the vehicle lateral acceleration is provided, at which low brake pressures are introduced, which is lower than the first threshold value, and wherein the quantity correlating with the vehicle lateral acceleration represents a low rollover tendency level.

摘要翻译： 一种用于抑制至少两轴和至少两轨道车辆的侧向翻转倾向的方法，其中当超过与车辆横向加速度相关的动态和/或静态量的第一阈值时，最大制动压力为 引入车辆的车轮制动器作为防止翻车，阈值表示在允许的任何类型的车辆负载下遇到翻车风险的值; 并且提供与车辆横向加速度相关的量的第二阈值，在该第二阈值处引入低于第一阈值的低制动压力，并且其中与车辆横向加速度相关的数量表示低的翻转趋势水平 。

公开(公告)号：US07139694B2

公开(公告)日：2006-11-21

申请号：US10110657

申请日：2001-08-07

申请人： Michael Horn ,  Hans-Hermann Wolf

发明人： Michael Horn ,  Hans-Hermann Wolf

IPC分类号： G06F17/60

CPC分类号： G06Q20/10 ,  G06Q20/04 ,  G06Q20/108 ,  G06Q20/1085 ,  G06Q20/12 ,  G06Q20/202 ,  G06Q20/204 ,  G06Q20/223 ,  G06Q20/28 ,  G06Q20/32 ,  G06Q20/3223 ,  G06Q20/382

摘要： Method for transferring an electronic sum of money from a credit memory associated with a money sender to an account or to a credit memory associated with a money receiver via a telecommunications and data network in real time, the necessary connections being set up via a transaction server.

摘要翻译： 用于经由电话和数据网络实时地将电子货币从与货币发送者相关联的信用存储器转移到帐户或与货币接收器相关联的信用存储器的方法，所述必要连接通过交易服务器 。

公开(公告)号：US20060093610A1

公开(公告)日：2006-05-04

申请号：US11271008

申请日：2005-11-10

申请人： Alois Lang ,  Michael Horn ,  Martin Imboden

发明人： Alois Lang ,  Michael Horn ,  Martin Imboden

IPC分类号： C07H21/04 ,  C12P21/06 ,  A61K39/40 ,  A61K48/00 ,  C07K16/12

CPC分类号： C07K16/1214 ,  A61K2039/505 ,  C07K2317/21 ,  C07K2317/56 ,  C07K2317/565 ,  Y10S530/809

摘要： The present application relates to a human monoclonal antibody specific for the serotype IATS O6 of P. aeruginosa, a hybridoma producing it, nucleic acids encoding it, and host cells transfected therewith. Further, the present invention relates to methods for producing said monoclonal antibody. In addition, the present invention relates to pharmaceutical compositions comprising at least one antibody or at least one nucleic acid encoding said antibody.

摘要翻译： 本申请涉及对铜绿假单胞菌血清型IATS O6，产生它的杂交瘤，编码它的核酸和用其转染的宿主细胞特异的人单克隆抗体。 此外，本发明涉及生产所述单克隆抗体的方法。 此外，本发明涉及包含至少一种抗体或编码所述抗体的至少一种核酸的药物组合物。

公开(公告)号：US06472130B1

公开(公告)日：2002-10-29

申请号：US09581670

申请日：2000-10-16

申请人： Stefan Geyer ,  Michael Horn

发明人： Stefan Geyer ,  Michael Horn

IPC分类号： G03F732

CPC分类号： G03F7/322

摘要： A solution of tetramethylammonium hydroxide in water comprises a surfactant component and a hydrotropic component. A process for preparing a solution for developing an exposed photoresist comprises the steps: preparation of a solution of tetramethylammonium hydroxide in water; addition of a surfactant component; and addition of a hydrotropic component.

摘要翻译： 四甲基氢氧化铵在水中的溶液包括表面活性剂组分和水溶助长分子。 制备用于显影曝光光刻胶的溶液的方法包括以下步骤：制备氢氧化四甲基铵在水中的溶液; 加入表面活性剂组分; 并加入水溶助长分子。