摘要:
A system and method for isothermally distributing a temperature across a semiconductor device. A furnace assembly is provided, which includes a processing tube configured to removably receive a wafer carrier having a full compliment of semiconductor wafers. A heating assembly is provided which can include a heating element positioned to heat air or other gases allowed to enter the process tube. The furnace assembly and process tube are capable of being vertically raised and lowered into a position enclosing the heating assembly within the process tube. Once the heating assembly forms a seal with the process tube, the process tube is exhausted and purged of air. Gas is then allowed to flow into the process tube and exchange heat with the heating element. The heated gas circulates through the process tube to convectively change the temperature of the wafers.
摘要:
Systems and techniques for characterizing samples using optical techniques. Coherent light may be incident on a sample, and a diffraction pattern detected. Information indicative of diffraction pattern intensity may be used to determine one or more sample characteristics and/or one or more pattern characteristics. For example, sample characteristics such as stress, warpage, curvature, and contamination may be determined. The coherent light may be light of a single wavelength, or may be light of multiple wavelengths.
摘要:
A thermoelectric power generator includes a thermoelectric pile in a chamber. A window admits light and/or heat radiation such as solar radiation into the chamber, which is absorbed in a radiation absorbing body in thermal contact with a first side of the thermoelectric pile, whereby the temperature of the first side is raised. A second side of the thermoelectric pile is in thermal contact with the wall of the chamber, which is a heat sink to maintain the second side at a lower temperature. The temperature difference produces a voltage difference at electrical contacts to the thermoelectric pile, which is capable of powering electrical devices.
摘要:
Systems and techniques for contemporaneous Raman and photoluminescence spectroscopy. Light that has interacted with a sample is dispersed to separate wavelength components, including Raman and photoluminescence components. A first array detector is positioned to receive Raman components, and a second array detector is positioned to receive Raman components. The first array detector and the second array detector may comprise the same detector material, or different detector materials.
摘要:
A process, which includes implanting hydrogen ions into a silicon substrate, overlaying the silicon substrate on to a support substrate, and applying a flash anneal heat treatment to the silicon and support substrates to cause the silicon substrates to separate at a region defined by the implanted hydrogen ions.
摘要:
An apparatus and process for processing a substrate using components and particles formed in a remote plasma generation section of a processing chamber. The processing chamber includes a processing section and a plasma generation section. A plasma field is generated in the plasma generation section, such that the plasma field is generated remotely from the processing section. Components and particles from the plasma field can diffuse and/or drift from the plasma generation section through a passageway to the processing section. The processing chamber may include a plurality of plasma generation sections for generating additional plasma fields. In each instance, the additional plasma fields are generated remotely from the processing section.
摘要:
An improved system and method for obtaining data related to the operation of a processing system which converts from analog measurement data, usually obtained from meters and gages, to digital data. Visual images of various types of measuring instruments are collected and used for measuring a process functionality. An image sensor provides an image of a first feature of the measuring instrument. The image data is processed by an image processor, which is operable to detect a first feature and determine its position relative to a second feature of the measuring instrument. The difference in the relative positions (measured distance) can then be compared to a predetermined or expected value. If the measured and expected values are not substantially the same, a signal can be generated which instructs a controller to adjust the process functionality until the measured value reaches the expected value.
摘要:
A system for uniformly and controllably heating the active surface of a semiconductor wafer or substrate during processing. The present invention may include a radiation energy source provided, which is enclosed or substantially surrounded by a reflective/absorptive surface, which both reflects and absorbs the radiation, emitted from the energy source. In accordance with the present invention, the resultant energy output as seen by the wafer is substantially free of non-uniformity.
摘要:
A heat exchanger is used to transfer heat from water to liquid nitrogen. As heat is transferred from the water to the liquid nitrogen, the temperature of the water becomes lower and the liquid nitrogen converts to gaseous nitrogen. The cooled water and gaseous nitrogen are used by one or more semiconductor fabrication equipment in the semiconductor fabrication process. Thus, overall power consumption of the semiconductor fabrication process is lowered because water is cooled by passing the water by liquid nitrogen to convert the liquid nitrogen to gaseous nitrogen for use in the semiconductor fabrication process.
摘要:
A semiconductor processing system and method, which uses heat energy typically wasted in most common semiconductor processing systems, to generate power. The present invention includes a heat management system, which uses the waste heat and/or the excess heat generated by a thermal-processing chamber, to generate a current from a first thermoelectric device. The current from the first thermoelectric device is then delivered to a second thermoelectric device. The second thermoelectric device, driven by the current from the first thermoelectric device, can be used to remove heat from a cooling chamber or else add heat to another processing chamber.