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公开(公告)号：US09711704B2
公开(公告)日：2017-07-18
申请号：US15232494
申请日：2016-08-09
Inventor： Jun-Peng Shi , Pei-Song Cai , Hao Huang , Xing-Hua Liang , Zhen-Duan Lin , Chih-Wei Chao , Chen-Ke Hsu
CPC classification number: H01L33/647 , H01L24/97 , H01L25/0753 , H01L33/483 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2924/12041
Abstract: A light-emitting diode (LED) package, including: a substrate with front and back surfaces, including: at least two metal blocks; an insulation portion, wherein the metal blocks are disposed in the insulation portion and have at least portions of upper and lower surfaces exposed; and an electrical insulation region between the at least two metal blocks; an LED chip disposed over, and forming one or more electrical connections with, the at least two metal blocks; and a package encapsulant disposed over the LED chip surface and covering at least a portion of the substrate; wherein the at least two metal blocks have protrusion connection portions that extend to an edge of the substrate.
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公开(公告)号：US10510938B2
公开(公告)日：2019-12-17
申请号：US15621351
申请日：2017-06-13
Inventor： Jun-Peng Shi , Pei-Song Cai , Hao Huang , Xing-Hua Liang , Zhen-Duan Lin , Chih-Wei Chao , Chen-Ke Hsu
Abstract: A light-emitting diode (LED) package includes a substrate with upper and lower surfaces, including: a metal block; an electrically insulating region surrounding at least a portion of the metal block; an LED chip mounted on the substrate and in electrical communication with the metal block; and an encapsulant covering at least an upper surface of the LED chip. A light-emitting system includes a plurality of light-emitting diode (LED) chips; and a package support for the plurality of LED chips.
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公开(公告)号：US11538965B2
公开(公告)日：2022-12-27
申请号：US16948441
申请日：2020-09-18
Inventor： Junpeng Shi , Zhen-Duan Lin , Chen-Ke Hsu , Ping Zhang
IPC: H01L33/50 , H01L25/075
Abstract: A light-emitting diode (LED) filament structure includes a substrate, an LED chip unit, a first chromic layer, and a light conversion layer. The LED chip unit is disposed on the substrate, and includes first and second LED chips emitting different excitation lights. The first chromic layer covers the first and second LED chips. The light conversion layer covers the LED chip unit and the first chromic layer. The first chromic layer is configured to transition between an inactivated state and an activated state to prevent or allow the excitation light from the first or second LED chips to pass therethrough, so as to excite the light conversion layer to emit different excited lights having different color temperatures.
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公开(公告)号：US09437793B2
公开(公告)日：2016-09-06
申请号：US14606038
申请日：2015-01-27
Inventor： Jun-Peng Shi , Pei-Song Cai , Hao Huang , Xing-Hua Liang , Zhen-Duan Lin , Chih-Wei Chao , Chen-Ke Hsu
CPC classification number: H01L33/647 , H01L24/97 , H01L25/0753 , H01L33/483 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2924/12041
Abstract: A package support including: metal frames connected together; one or more dielectric materials disposed in an inner gap of the metal frames; wherein: the package support has a frame region and a function region; wherein the function region has complete upper and lower surfaces configured to prevent leakage if at least one of the entire upper or lower surfaces is covered with an encapsulant material. A fabrication method allows for manufacturing the package support with a high cell density, relatively low price, high reflectivity, good heat dissipation, and high reliability. The LED package using the package support has a smaller size and improved dissipation properties.
Abstract translation: 包装支架包括：连接在一起的金属框架; 设置在金属框架的内部间隙中的一个或多个介电材料; 其中：所述包装支架具有框架区域和功能区域; 其中所述功能区域具有完整的上表面和下表面，其被配置为如果整个上表面或下表面中的至少一个被密封剂材料覆盖，则防止泄漏。 制造方法允许以高电池密度，相对低的价格，高反射率，良好的散热性和高可靠性制造封装支架。 使用封装支持的LED封装具有更小的尺寸和改善的耗散性能。
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