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公开(公告)号：USD756942S1
公开(公告)日：2016-05-24
申请号：US29526620
申请日：2015-05-12
Designer： Junpeng Shi , Pei-Song Cai , Zhenduan Lin , Hao Huang
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公开(公告)号：US09966514B2
公开(公告)日：2018-05-08
申请号：US15192993
申请日：2016-06-24
Inventor： Chen-Ke Hsu , Junpeng Shi , Pei-Song Cai , Zhenduan Lin , Hao Huang , Chenjie Liao , Chih-Wei Chao , Qiuxia Lin
CPC classification number: H01L33/60 , H01L33/505 , H01L33/507 , H01L33/508 , H01L33/54 , H01L33/62 , H01L2224/04105 , H01L2224/19 , H01L2924/18162 , H01L2933/0016 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2933/0091
Abstract: A light emitting diode package structure allows for an improved light-emitting efficiency by including a first reflecting material layer with through holes; a flip chip on the first reflecting material layer, with the electrodes inlaid in the through holes of the first reflecting material layer; a first transparent material layer surrounding the side surface of the flip chip except the electrodes; and a second reflecting material layer surrounding the first transparent material layer. An interface between the first transparent material layer and the reflecting material layer is an inclined plane, an arc plane, or an irregular shape, to thereby facilitate upward light reflection of the flip chip. A wavelength conversion material layer is over the first reflecting material layer, the flip chip, and the second reflecting material layer.
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公开(公告)号：US09711704B2
公开(公告)日：2017-07-18
申请号：US15232494
申请日：2016-08-09
Inventor： Jun-Peng Shi , Pei-Song Cai , Hao Huang , Xing-Hua Liang , Zhen-Duan Lin , Chih-Wei Chao , Chen-Ke Hsu
CPC classification number: H01L33/647 , H01L24/97 , H01L25/0753 , H01L33/483 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2924/12041
Abstract: A light-emitting diode (LED) package, including: a substrate with front and back surfaces, including: at least two metal blocks; an insulation portion, wherein the metal blocks are disposed in the insulation portion and have at least portions of upper and lower surfaces exposed; and an electrical insulation region between the at least two metal blocks; an LED chip disposed over, and forming one or more electrical connections with, the at least two metal blocks; and a package encapsulant disposed over the LED chip surface and covering at least a portion of the substrate; wherein the at least two metal blocks have protrusion connection portions that extend to an edge of the substrate.
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Patent Agency Ranking
公开(公告)号：USD768095S1
公开(公告)日：2016-10-04
申请号：US29541826
申请日：2015-10-08
Designer： Junpeng Shi , Pei-Song Cai , Zhenduan Lin , Hao Huang
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公开(公告)号：US09437793B2
公开(公告)日：2016-09-06
申请号：US14606038
申请日：2015-01-27
Inventor： Jun-Peng Shi , Pei-Song Cai , Hao Huang , Xing-Hua Liang , Zhen-Duan Lin , Chih-Wei Chao , Chen-Ke Hsu
CPC classification number: H01L33/647 , H01L24/97 , H01L25/0753 , H01L33/483 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2924/12041
Abstract: A package support including: metal frames connected together; one or more dielectric materials disposed in an inner gap of the metal frames; wherein: the package support has a frame region and a function region; wherein the function region has complete upper and lower surfaces configured to prevent leakage if at least one of the entire upper or lower surfaces is covered with an encapsulant material. A fabrication method allows for manufacturing the package support with a high cell density, relatively low price, high reflectivity, good heat dissipation, and high reliability. The LED package using the package support has a smaller size and improved dissipation properties.
Abstract translation: 包装支架包括：连接在一起的金属框架; 设置在金属框架的内部间隙中的一个或多个介电材料; 其中：所述包装支架具有框架区域和功能区域; 其中所述功能区域具有完整的上表面和下表面，其被配置为如果整个上表面或下表面中的至少一个被密封剂材料覆盖，则防止泄漏。 制造方法允许以高电池密度，相对低的价格，高反射率，良好的散热性和高可靠性制造封装支架。 使用封装支持的LED封装具有更小的尺寸和改善的耗散性能。
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公开(公告)号：US10510938B2
公开(公告)日：2019-12-17
申请号：US15621351
申请日：2017-06-13
Inventor： Jun-Peng Shi , Pei-Song Cai , Hao Huang , Xing-Hua Liang , Zhen-Duan Lin , Chih-Wei Chao , Chen-Ke Hsu
Abstract: A light-emitting diode (LED) package includes a substrate with upper and lower surfaces, including: a metal block; an electrically insulating region surrounding at least a portion of the metal block; an LED chip mounted on the substrate and in electrical communication with the metal block; and an encapsulant covering at least an upper surface of the LED chip. A light-emitting system includes a plurality of light-emitting diode (LED) chips; and a package support for the plurality of LED chips.
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公开(公告)号：USD761215S1
公开(公告)日：2016-07-12
申请号：US29526628
申请日：2015-05-12
Designer： Junpeng Shi , Pei-Song Cai , Zhenduan Lin , Hao Huang
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公开(公告)号：US10367126B2
公开(公告)日：2019-07-30
申请号：US14725822
申请日：2015-05-29
Inventor： Junpeng Shi , Pei-Song Cai , Hao Huang , Zhenduan Lin , Chih-Wei Chao , Chen-Ke Hsu
IPC: H01L33/00 , H01L33/62 , H01L33/60 , H01L33/64 , H01L25/075
Abstract: A light-emitting device includes a base having an insulating part and a metal block; a light-emitting diode (LED) chip over the base; a water soluble paste between the LED chip and the base metal block for chip fixing and heat conduction; packaging glue covering the LED chip; and the LED chip bottom, water soluble paste and the base metal block form an all-metal thermal conducting path to achieve low a thermal resistance.
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