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公开(公告)号：US20070145543A1
公开(公告)日：2007-06-28
申请号：US11320274
申请日：2005-12-28
申请人： Xiang Zeng , Jiangqi He , Dong-Ho Han
发明人： Xiang Zeng , Jiangqi He , Dong-Ho Han
IPC分类号： H01L29/40
CPC分类号： H05K3/242 , H01L23/66 , H01L24/48 , H01L24/73 , H01L2224/48091 , H01L2224/48227 , H01L2224/73257 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/3011 , H05K1/0237 , H05K2201/093 , H05K2201/09318 , H05K2201/0969 , H05K2201/09727 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method including modifying a characteristic impedance along a length of a plating bar of a substrate package. An apparatus including a package substrate including a plurality of transmission lines therethrough, a portion of the plurality of transmission lines each including a plating bar coupled thereto, wherein the plating bar comprises portions having different characteristic impedance along its length. A system including a computing device including a microprocessor, the microprocessor coupled to a printed circuit board through a substrate, the substrate including a plurality of transmission lines therethrough, a portion of the plurality of transmission lines each including a plating bar coupled thereto, wherein the plating bar comprises portions having different characteristic impedance along its length.
摘要翻译： 一种方法，包括沿衬底封装的电镀条的长度改变特性阻抗。 一种包括包括穿过其中的多个传输线的封装基板的装置，所述多个传输线的一部分各自包括连接到其上的电镀板，其中所述电镀棒包括沿其长度具有不同特征阻抗的部分。 一种包括计算设备的系统，包括微处理器，所述微处理器通过衬底耦合到印刷电路板，所述衬底包括穿过其中的多个传输线，所述多个传输线中的一部分包括与其耦合的电镀板，其中， 电镀棒包括沿其长度具有不同特性阻抗的部分。
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公开(公告)号：US20080131997A1
公开(公告)日：2008-06-05
申请号：US12015985
申请日：2008-01-17
申请人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
发明人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
IPC分类号： H01L21/71
CPC分类号： H01L21/00 , H01L23/49833 , H01L23/5387 , H01L23/552 , H01L24/81 , H01L2224/16 , H01L2224/16235 , H01L2224/73253 , H01L2224/8121 , H01L2224/81815 , H01L2924/01079 , H01L2924/14 , H01L2924/15312 , H01L2924/16152 , H01L2924/3011 , H05K1/147 , H05K2201/10492 , H05K2201/10734 , H01L2924/00
摘要： Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.
摘要翻译： 本发明的实施例包括在封装结构的芯片侧上具有信号连接的集成电路封装的装置，方法和/或系统。
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公开(公告)号：US07345359B2
公开(公告)日：2008-03-18
申请号：US10795072
申请日：2004-03-05
申请人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
发明人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
IPC分类号： H01L23/02
CPC分类号： H01L21/00 , H01L23/49833 , H01L23/5387 , H01L23/552 , H01L24/81 , H01L2224/16 , H01L2224/16235 , H01L2224/73253 , H01L2224/8121 , H01L2224/81815 , H01L2924/01079 , H01L2924/14 , H01L2924/15312 , H01L2924/16152 , H01L2924/3011 , H05K1/147 , H05K2201/10492 , H05K2201/10734 , H01L2924/00
摘要： Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.
摘要翻译： 本发明的实施例包括用于在封装结构的芯片侧上具有信号连接的集成电路封装的装置，方法和/或系统。
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公开(公告)号：US07110263B2
公开(公告)日：2006-09-19
申请号：US10797753
申请日：2004-03-09
申请人： Jiangqi He , Joong-ho Kim , Hyunjun Kim , Dong-ho Han , Ping Sun
发明人： Jiangqi He , Joong-ho Kim , Hyunjun Kim , Dong-ho Han , Ping Sun
IPC分类号： H05K1/11
CPC分类号： H01P3/085 , H01P3/081 , H05K1/0253 , H05K2201/09236 , H05K2201/093 , H05K2201/09318 , H05K2201/09663 , H05K2201/09727
摘要： An apparatus comprises a signal layer including a first and second signal trace. The apparatus also comprises a first reference plane including a first slot substantially parallel to the first and second signal traces. Further, the apparatus includes a dielectric layer having at least a portion disposed between the signal layer and the first reference plane.
摘要翻译： 一种装置包括包括第一和第二信号迹线的信号层。 该装置还包括第一参考平面，该第一参考平面包括基本上平行于第一和第二信号迹线的第一槽。 此外，该装置包括具有设置在信号层和第一参考平面之间的至少一部分的电介质层。
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公开(公告)号：US20050194669A1
公开(公告)日：2005-09-08
申请号：US10795072
申请日：2004-03-05
申请人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
发明人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
IPC分类号： H01L21/60 , H01L23/02 , H01L23/498 , H01L23/538 , H01L23/552 , H05K1/14
CPC分类号： H01L21/00 , H01L23/49833 , H01L23/5387 , H01L23/552 , H01L24/81 , H01L2224/16 , H01L2224/16235 , H01L2224/73253 , H01L2224/8121 , H01L2224/81815 , H01L2924/01079 , H01L2924/14 , H01L2924/15312 , H01L2924/16152 , H01L2924/3011 , H05K1/147 , H05K2201/10492 , H05K2201/10734 , H01L2924/00
摘要： Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.
摘要翻译： 本发明的实施例包括在封装结构的芯片侧上具有信号连接的集成电路封装的装置，方法和/或系统。
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公开(公告)号：US20050063137A1
公开(公告)日：2005-03-24
申请号：US10669678
申请日：2003-09-24
申请人： Hyunjun Kim , Jiangqi He , Joong-Ho Kim , Dong-Ho Han
发明人： Hyunjun Kim , Jiangqi He , Joong-Ho Kim , Dong-Ho Han
CPC分类号： H01G4/228 , H01G2/06 , H01G4/30 , H01G4/40 , Y10T29/435
摘要： An apparatus and system, as well as fabrication methods therefor, may include a plurality of vertically-oriented plates separated by dielectric layers, wherein the vertically-oriented plates include a plurality of terminals coupled to a bottom side of the plates.
摘要翻译： 一种装置和系统及其制造方法可以包括由电介质层分开的多个垂直取向的板，其中垂直定向的板包括联接到板的底侧的多个端子。
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公开(公告)号：US07611924B2
公开(公告)日：2009-11-03
申请号：US12015985
申请日：2008-01-17
申请人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
发明人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
IPC分类号： H01L21/00
CPC分类号： H01L21/00 , H01L23/49833 , H01L23/5387 , H01L23/552 , H01L24/81 , H01L2224/16 , H01L2224/16235 , H01L2224/73253 , H01L2224/8121 , H01L2224/81815 , H01L2924/01079 , H01L2924/14 , H01L2924/15312 , H01L2924/16152 , H01L2924/3011 , H05K1/147 , H05K2201/10492 , H05K2201/10734 , H01L2924/00
摘要： Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.
摘要翻译： 本发明的实施例包括在封装结构的芯片侧上具有信号连接的集成电路封装的装置，方法和/或系统。
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公开(公告)号：US07432779B2
公开(公告)日：2008-10-07
申请号：US11709972
申请日：2007-02-22
申请人： Hyunjun Kim , Joong-Ho Kim , Dong-Ho Han , Jiangqi He
发明人： Hyunjun Kim , Joong-Ho Kim , Dong-Ho Han , Jiangqi He
IPC分类号： H03H7/38
摘要： Transmission line impedance matching for matching an impedance discontinuity on a transmission signal trace with one or more non-transmission traces disposed near the transmission signal trace at a region corresponding to the impedance discontinuity.
摘要翻译： 传输线阻抗匹配，用于匹配传输信号迹线上的阻抗不连续性，其中一个或多个非传输迹线布置在对应于阻抗不连续的区域处的传输信号迹线附近。
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公开(公告)号：US07218183B2
公开(公告)日：2007-05-15
申请号：US11352182
申请日：2006-02-10
申请人： Hyunjun Kim , Joong-Ho Kim , Dong-Ho Han , Jiangqi He
发明人： Hyunjun Kim , Joong-Ho Kim , Dong-Ho Han , Jiangqi He
IPC分类号： H03H7/38
摘要： Transmission line impedance matching for matching an impedance discontinuity on a transmission signal trace with one or more non-transmission traces disposed near the transmission signal trace at a region corresponding to the impedance discontinuity.
摘要翻译： 传输线阻抗匹配，用于匹配传输信号迹线上的阻抗不连续性，其中一个或多个非传输迹线布置在对应于阻抗不连续的区域处的传输信号迹线附近。
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公开(公告)号：US20050087877A1
公开(公告)日：2005-04-28
申请号：US10690928
申请日：2003-10-22
申请人： Dong-Ho Han , Joong-Ho Kim , Jiangqi He , Hyunjun Kim
发明人： Dong-Ho Han , Joong-Ho Kim , Jiangqi He , Hyunjun Kim
CPC分类号： H05K1/024 , H05K1/162 , H05K3/28 , H05K2201/0187 , H05K2201/09236 , H05K2201/09881
摘要： In some embodiments, an apparatus includes a substrate and a pair of signal traces formed on the substrate. The signal traces may be spaced apart from each other. The apparatus may also include a filler material on the substrate and between the signal traces. The filler material may have a dielectric constant that is higher than a dielectric constant of a material of which the substrate is formed.
摘要翻译： 在一些实施例中，装置包括衬底和形成在衬底上的一对信号迹线。 信号迹线可以彼此间隔开。 该装置还可以在衬底上和信号迹线之间包括填充材料。 填充材料可以具有高于形成衬底的材料的介电常数的介电常数。
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