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    Corrosion inhibitor of NiCu for high performance writers
    1.
    发明授权
    Corrosion inhibitor of NiCu for high performance writers 失效
    NiCu防腐剂用于高性能作者

    公开(公告)号：US06387599B2

    公开(公告)日：2002-05-14

    申请号：US09756013

    申请日：2001-01-08

    申请人： Xuehua Wu ,  Yi-Chun Liu ,  Jei-Wei Chang ,  Kochan Ju

    发明人： Xuehua Wu ,  Yi-Chun Liu ,  Jei-Wei Chang ,  Kochan Ju

    IPC分类号： G03F730

    CPC分类号： G03F7/322 ,  C23F1/02 ,  G11B5/3163 ,  H05K3/064

    摘要： The problem of copper corrosion that occurs in the presence of strong alkaline developing solutions during photo rework has been overcome by protecting all exposed copper bearing surfaces from attack. Two ways of achieving this are described. In the first method, benzotriazole (BTA) is added to the developing solution which is then used in the normal way, developing time being unaffected by this modification. In the second method, the surface that is to receive the photoresist is first given a dip in a solution of BTA, following which the photoresist is immediately applied and processing, including development, proceeds as normal. For both methods the result is the elimination of all copper corrosion during development.

    摘要翻译： 通过保护所有暴露的铜轴承表面免受攻击，已经克服了在照相返修期间存在强碱性显影液存在的铜腐蚀问题。 描述实现这一点的两种方式。 在第一种方法中，将苯并三唑（BTA）加入显影液中，然后以正常方式使用，显影时间不受该改性的影响。 在第二种方法中，首先将待接收光致抗蚀剂的表面浸入BTA的溶液中，随后立即施加光致抗蚀剂，并且包括显影在内的处理正常进行。 对于这两种方法，结果是在开发过程中消除了所有的铜腐蚀。

    Masking frame plating method for forming masking frame plated layer
    2.
    发明授权
    Masking frame plating method for forming masking frame plated layer 失效
    用于形成掩蔽框架镀层的掩模框架电镀方法

    公开(公告)号：US06291138B1

    公开(公告)日：2001-09-18

    申请号：US09360121

    申请日：1999-07-23

    申请人： Xuehua Wu ,  Yi-Chun Liu ,  Yining Hu ,  Jei-Wei Chang ,  Kochan Ju

    发明人： Xuehua Wu ,  Yi-Chun Liu ,  Yining Hu ,  Jei-Wei Chang ,  Kochan Ju

    IPC分类号： G03C500

    CPC分类号： G11B5/3163 ,  G11B5/3116 ,  G11B5/3967 ,  Y10T29/49032

    摘要： A method for forming a plated layer. There is first provided a substrate. There is then formed over the substrate a masking frame employed for masking frame plating a masking frame plated layer within the masking frame, where the masking frame is fabricated to provide an overhang of an upper portion of the masking frame spaced further from the substrate with respect to a lower portion of the masking frame spaced closer to the substrate. Finally, there is then plated the masking frame plated layer within the masking frame. The method is useful for forming masking frame plated magnetic pole tip stack layers with enhanced planarity dimensional control within magnetic transducer elements.

    摘要翻译： 一种形成镀层的方法。 首先提供基板。 然后在衬底上形成掩蔽框架，用于掩蔽在屏蔽框架内对屏蔽框架镀层进行屏蔽电镀，其中制造掩模框架以提供与衬底间隔开的掩蔽框架的上部的突出部分， 到掩蔽框架的较靠近衬底间隔的部分。 最后，然后将屏蔽框架镀层电镀在屏蔽框架内。 该方法对于在磁换能器元件内形成具有增强的平面度尺寸控制的掩模框架电镀磁极尖端堆叠层是有用的。

    Corrosion inhibitor of NiCu for high performance writers
    3.
    发明授权
    Corrosion inhibitor of NiCu for high performance writers 失效
    NiCu防腐剂用于高性能作者

    公开(公告)号：US06395458B2

    公开(公告)日：2002-05-28

    申请号：US09756015

    申请日：2001-01-08

    申请人： Xuehua Wu ,  Yi-Chun Liu ,  Jei-Wei Chang ,  Kochan Ju

    发明人： Xuehua Wu ,  Yi-Chun Liu ,  Jei-Wei Chang ,  Kochan Ju

    IPC分类号： G03F732

    CPC分类号： G03F7/322 ,  C23F1/02 ,  G11B5/3163 ,  H05K3/064

    摘要： The problem of copper corrosion that occurs in the presence of strong alkaline developing solutions during photo rework has been overcome by protecting all exposed copper bearing surfaces from attack. Two ways of achieving this are described. In the first method, benzotriazole (BTA) is added to the developing solution which is then used in the normal way, developing time being unaffected by this modification. In the second method, the surface that is to receive the photoresist is first given a dip in a solution of BTA, following which the photoresist is immediately applied and processing, including proceeds as normal. For both methods the result is the elimination of all copper corrosion during development.

    摘要翻译： 通过保护所有暴露的铜轴承表面免受攻击，已经克服了在照相返修期间存在强碱性显影液存在的铜腐蚀问题。 描述实现这一点的两种方式。 在第一种方法中，将苯并三唑（BTA）加入显影液中，然后以正常方式使用，显影时间不受该改性的影响。 在第二种方法中，首先将待接收光致抗蚀剂的表面浸入BTA溶液中，随后立即施加光刻胶并进行处理，包括正常进行。 对于这两种方法，结果是在开发过程中消除了所有的铜腐蚀。

    Corrosion inhibitor for NiCu for high performance writers
    4.
    发明授权
    Corrosion inhibitor for NiCu for high performance writers 失效
    NiCu用于高性能作者的防腐蚀剂

    公开(公告)号：US06207350B1

    公开(公告)日：2001-03-27

    申请号：US09483931

    申请日：2000-01-18

    申请人： Xuehua Wu ,  Yi-Chun Liu ,  Jei-Wei Chang ,  Kochan Ju

    发明人： Xuehua Wu ,  Yi-Chun Liu ,  Jei-Wei Chang ,  Kochan Ju

    IPC分类号： G03F732

    CPC分类号： G03F7/322 ,  C23F1/02 ,  G11B5/3163 ,  H05K3/064

    摘要： The problem of copper corrosion that occurs in the presence of strong alkaline developing solutions during photo rework has been overcome by protecting all exposed copper bearing surfaces from attack. Two ways of achieving this are described. In the first method, benzotriazole (BTA) is added to the developing solution which is then used in the normal way, developing time being unaffected by this modification. In the second method, the surface that is to receive the photoresist is first given a dip in a solution of BTA, following which the photoresist is immediately applied and processing, including development, proceeds as normal. For both methods the result is the elimination of all copper corrosion during development.

    摘要翻译： 通过保护所有暴露的铜轴承表面免受攻击，已经克服了在照相返修期间存在强碱性显影液存在的铜腐蚀问题。 描述实现这一点的两种方式。 在第一种方法中，将苯并三唑（BTA）加入显影液中，然后以正常方式使用，显影时间不受该改性的影响。 在第二种方法中，首先将待接收光致抗蚀剂的表面浸入BTA的溶液中，随后立即施加光致抗蚀剂，并且包括显影在内的处理正常进行。 对于这两种方法，结果是在开发过程中消除了所有的铜腐蚀。

    Masking frame plating method for forming masking frame plated layer
    5.
    发明授权
    Masking frame plating method for forming masking frame plated layer 失效
    用于形成掩蔽框架镀层的掩模框架电镀方法

    公开(公告)号：US06627390B2

    公开(公告)日：2003-09-30

    申请号：US09893225

    申请日：2001-06-28

    申请人： Xue Hua Wu ,  Yi-Chun Liu ,  Yining Hu ,  Jei-Wei Chang ,  Kochan Ju

    发明人： Xue Hua Wu ,  Yi-Chun Liu ,  Yining Hu ,  Jei-Wei Chang ,  Kochan Ju

    IPC分类号： G03C500

    CPC分类号： G11B5/3163 ,  G11B5/3116 ,  G11B5/3967 ,  Y10T29/49032

    摘要： A method for forming a plated layer. There is first provided a substrate. There is then formed over the substrate a masking frame employed for masking frame plating a masking frame plated layer within the masking frame, where the masking frame is fabricated to provide an overhang of an upper portion of the masking frame spaced further from the substrate with respect to a lower portion of the masking frame spaced closer to the substrate. Finally, there is then plated the masking frame plated layer within the masking frame. The method is useful for forming masking frame plated magnetic pole tip stack layers with enhanced planarity dimensional control within magnetic transducer elements.

    摘要翻译： 一种形成镀层的方法。 首先提供基板。 然后在衬底上形成掩蔽框架，用于掩蔽在屏蔽框架内对屏蔽框架镀层进行屏蔽电镀，其中制造掩模框架以提供与衬底间隔开的掩蔽框架的上部的突出部分， 到掩蔽框架的较靠近衬底间隔的部分。 最后，然后将屏蔽框架镀层电镀在屏蔽框架内。 该方法对于在磁换能器元件内形成具有增强的平面度尺寸控制的掩模框架电镀磁极尖端堆叠层是有用的。

    Method for making embedded circuit structure
    7.
    发明授权
    Method for making embedded circuit structure 有权
    制作嵌入式电路结构的方法

    公开(公告)号：US08132321B2

    公开(公告)日：2012-03-13

    申请号：US12190602

    申请日：2008-08-13

    申请人： Yi-Chun Liu ,  Wei-Ming Cheng ,  Tsung-Yuan Chen ,  Shu-Sheng Chiang

    发明人： Yi-Chun Liu ,  Wei-Ming Cheng ,  Tsung-Yuan Chen ,  Shu-Sheng Chiang

    IPC分类号： H01K3/10

    CPC分类号： H05K3/465 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0055 ,  H05K3/383 ,  H05K3/421 ,  H05K3/4661 ,  H05K2203/0796 ,  H05K2203/1383

    摘要： An embedded structure of circuit board is provided. The embedded structure includes a substrate, a first patterned conductive layer disposed on the substrate and selectively exposing the substrate, a first dielectric layer covering the first patterned conductive layer and the substrate, a pad opening disposed in the first dielectric layer, and a via disposed in the pad opening and exposing the first patterned conductive layer, wherein the outer surface of the first dielectric layer has a substantially even surface.

    摘要翻译： 提供电路板的嵌入式结构。 所述嵌入式结构包括基板，设置在所述基板上并选择性地暴露所述基板的第一图案化导电层，覆盖所述第一图案化导电层和所述基板的第一介电层，设置在所述第一介电层中的焊盘开口， 在所述焊盘开口中并暴露所述第一图案化导电层，其中所述第一介电层的外表面具有基本上均匀的表面。

    EMBEDDED STRUCTURE AND METHOD FOR MAKING THE SAME
    8.
    发明申请
    EMBEDDED STRUCTURE AND METHOD FOR MAKING THE SAME 有权
    嵌入式结构及其制作方法

    公开(公告)号：US20100038124A1

    公开(公告)日：2010-02-18

    申请号：US12190602

    申请日：2008-08-13

    申请人： Yi-Chun Liu ,  Wei-Ming Cheng ,  Tsung-Yuan Chen ,  Shu-Sheng Chiang

    发明人： Yi-Chun Liu ,  Wei-Ming Cheng ,  Tsung-Yuan Chen ,  Shu-Sheng Chiang

    IPC分类号： H05K3/10 ,  H05K1/11

    CPC分类号： H05K3/465 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0055 ,  H05K3/383 ,  H05K3/421 ,  H05K3/4661 ,  H05K2203/0796 ,  H05K2203/1383

    摘要： An embedded structure of circuit board is provided. The embedded structure includes a substrate, a first patterned conductive layer disposed on the substrate and selectively exposing the substrate, a first dielectric layer covering the first patterned conductive layer and the substrate, a pad opening disposed in the first dielectric layer, and a via disposed in the pad opening and exposing the first patterned conductive layer, wherein the outer surface of the first dielectric layer has a substantially even surface.

    摘要翻译： 提供电路板的嵌入式结构。 所述嵌入式结构包括基板，设置在所述基板上并选择性地暴露所述基板的第一图案化导电层，覆盖所述第一图案化导电层和所述基板的第一介电层，设置在所述第一介电层中的焊盘开口， 在所述焊盘开口中并暴露所述第一图案化导电层，其中所述第一介电层的外表面具有基本上均匀的表面。

    Optical device and method for making the same
    9.
    发明授权
    Optical device and method for making the same 有权
    光学装置及其制造方法

    公开(公告)号：US07486371B2

    公开(公告)日：2009-02-03

    申请号：US11059417

    申请日：2005-02-17

    申请人： Chih-Ho Chiu ,  Hui-Lung Kuo ,  Mei-Chih Peng ,  Yi-Chun Liu ,  Pin-Chen Chen

    发明人： Chih-Ho Chiu ,  Hui-Lung Kuo ,  Mei-Chih Peng ,  Yi-Chun Liu ,  Pin-Chen Chen

    IPC分类号： G02F1/1339

    CPC分类号： G02B5/3016 ,  G02F1/13363

    摘要： A method for making an optical device comprises steps of: 1) Providing a substrate, a polymerizable liquid crystal material having a plurality of liquid crystal molecules, and a mold having rows of trenches; 2) Imprinting the polymerizable liquid crystal material on said substrate by the mold; 3) Proceeding a cross-linking process to cure the liquid crystal material so as to have long axes of the liquid crystal molecules be aligned along the rows of trenches. The optical device made from the present method conforms to an A-plate type retardation plate. Moreover, the optical device is capable of aligning liquid crystal molecules adjacent to it.

    摘要翻译： 一种制造光学器件的方法，包括以下步骤：1）提供基片，具有多个液晶分子的可聚合液晶材料和具有一排沟槽的模具; 2）通过模具将可聚合液晶材料印刷在所述基板上; 3）进行交联处理以固化液晶材料，使得液晶分子的长轴沿着沟槽排列。 由本方法制成的光学装置符合A板型延迟板。 此外，光学器件能够使与其相邻的液晶分子对准。