-
公开(公告)号:US20160365653A1
公开(公告)日:2016-12-15
申请号:US15175095
申请日:2016-06-07
CPC分类号: G02B6/4246 , G02B6/4284 , H01R12/51 , H01R12/721 , H01R12/73 , H01R12/87
摘要: In a transceiver module, where one end of a module substrate is inserted and connected to a concave portion of a plug connector and when one end face of the module substrate is touched to the inner periphery face forming the concave portion, a projection portion formed at the periphery of the concave portion of the plug connector is fitted to a notch portion of the module substrate.
摘要翻译: 在模块基板的一端插入并连接到插头连接器的凹部的收发器模块中,并且当模块基板的一个端面被触摸到形成凹部的内周面时,形成在 插头连接器的凹部的周边与模块基板的切口部嵌合。
-
公开(公告)号:US20150255935A1
公开(公告)日:2015-09-10
申请号:US14600694
申请日:2015-01-20
申请人: Hitachi Metals, Ltd.
IPC分类号: H01R24/60
CPC分类号: H01R24/60 , H01R13/631 , H01R13/6471
摘要: A connector includes a plug connector and a receptacle connector. The plug connector has an insertion convex portion including: an end surface; outer side surfaces facing in parallel to each other across the end surface; and a first tapered surface connecting each outer side surface and the end surface. The receptacle connector has an insertion concave portion including: an insertion port; inner side surfaces facing in parallel to each other across the insertion port; and a second tapered surface connecting each inner side surface and an edge of the insertion port. The outer side surfaces of the insertion convex portion have first connection terminals arranged, the inner side surfaces of the insertion concave portion have second connection terminals arranged in contact with the first contact terminals, and the first tapered surface has a width twice as large as a width of the second tapered surface or larger.
摘要翻译: 连接器包括插头连接器和插座连接器。 插头连接器具有插入凸部,包括:端面; 所述外侧表面相对于所述端表面彼此平行地面对; 以及连接每个外侧表面和端表面的第一锥形表面。 插座连接器具有插入凹部,包括:插入口; 内侧表面相对于插入口彼此平行地面对; 以及连接插入口的每个内侧表面和边缘的第二锥形表面。 插入凸部的外侧表面具有布置的第一连接端子,插入凹部的内侧表面具有与第一接触端子相接触的第二连接端子,并且第一锥形表面的宽度为 第二锥形表面的宽度或更大。
-
3.
公开(公告)号:US20150098675A1
公开(公告)日:2015-04-09
申请号:US14508418
申请日:2014-10-07
申请人: Hitachi Metals, Ltd.
发明人: Kazuo ISHIYAMA , Yasunobu MATSUOKA , Hideo ARIMOTO , Norio CHUJO , Yoshinori SUNAGA , Kinya YAMAZAKI , Yoshiaki ISHIGAMI
CPC分类号: G02B6/4214 , G02B6/423 , G02B6/4249 , G02B6/428 , G02B6/4284 , G02B6/4292 , G02B6/43
摘要: There is provided a photoelectric conversion module that can be mounted two-dimensionally over a device board in a high-density, low-height manner and cooled efficiently with an easy-to-install collective-type radiator. In the photoelectric conversion module mounted over the device board, an optical connector is attached to that surface of an optical subassembly facing the device board. An electric connector has at least two sides thereof opened so that the optical transmission medium is threaded therethrough and extended through at least two facing sides of the optical subassembly. The optical transmission medium is thus extended between the optical subassembly and the device board in a vertically stacked manner.
摘要翻译: 提供了一种可以以高密度,低高度方式二维地安装在器件板上并且通过易于安装的集体式散热器而有效冷却的光电转换模块。 在安装在器件基板上的光电转换模块中,将光学连接器安装在面向器件板的光学子组件的表面上。 电连接器的至少两侧被打开,使得光传输介质被穿过并延伸穿过光学子组件的至少两个相对的侧面。 因此,光传输介质以垂直堆叠的方式在光学子组件和设备板之间延伸。
-
公开(公告)号:US20160062064A1
公开(公告)日:2016-03-03
申请号:US14936782
申请日:2015-11-10
申请人: Hitachi Metals, Ltd.
IPC分类号: G02B6/42
CPC分类号: G02B6/4268 , G02B6/4214 , G02B6/4219 , G02B6/423 , G02B6/4236 , G02B6/4269 , G02B6/428 , G02B6/4292 , G02B6/4295
摘要: An optical module includes a circuit board, a photoelectric conversion element mounted on the circuit board, an optical connector for optically connecting the photoelectric conversion element and an optical fiber, a semiconductor circuit element mounted on the circuit board and electrically connected to the photoelectric conversion element, a pressing member for pressing and fixing the optical connector to the circuit board, and a supporting member for supporting the pressing member. The supporting member includes a heat-absorbing surface and a heat-dissipating surface. The heat-absorbing surface is thermally connected to the semiconductor circuit element. The heat-dissipating surface dissipates heat of the semiconductor circuit element to be absorbed through the heat-absorbing surface.
-
公开(公告)号:US20150192745A1
公开(公告)日:2015-07-09
申请号:US14553168
申请日:2014-11-25
申请人: Hitachi Metals, Ltd.
发明人: Kinya YAMAZAKI , Masataka SATO , Akira OGURA , Shinji KOMATSUZAKI
IPC分类号: G02B6/38
CPC分类号: G02B6/4292 , G02B6/3652 , G02B6/3885 , G02B6/4214 , G02B6/4249
摘要: An optical fiber connecter includes a first holding member including a positioning groove to position the optical fiber in a direction orthogonal to a longitudinal direction of the optical fiber, a second holding member including an accommodating groove including a substantially flat bottom surface and accommodating the optical fiber movably in the direction orthogonal to the longitudinal direction, the second holding member being configured such that the optical fiber is pressed against the positioning groove of the first holding member thereby, and a fixing member to fix the optical fiber to the accommodating groove of the second holding member at a position being away in a drawing direction of the optical fiber from an end of the positioning groove in the drawing direction.
摘要翻译: 一种光纤连接器包括:第一保持构件,包括定位槽,用于沿与光纤的纵向方向正交的方向定位光纤;第二保持构件,包括容纳槽,该容纳槽包括基本平坦的底表面,并容纳光纤 所述第二保持部件构造成使得所述光纤被按压在所述第一保持部件的所述定位槽上,以及固定部件将所述光纤固定到所述第二保持部件的容纳槽 保持构件在沿着拉拔方向从定位槽的端部沿着光纤的拉拔方向离开的位置。
-
公开(公告)号:US20150160422A1
公开(公告)日:2015-06-11
申请号:US14542968
申请日:2014-11-17
申请人: HITACHI METALS, LTD.
发明人: Akira OGURA , Masataka SATO , Shinji KOMATSUZAKI , Kinya YAMAZAKI
CPC分类号: G02B6/4249 , G02B6/4206 , G02B6/4214
摘要: An optical communication module is composed of a photoelectric conversion element to transduce an optical signal into an electrical signal or an electrical signal into an optical signal, an optical fiber including an end and being optically coupled to the photoelectric conversion element, a receiving member including an outer surface and receiving the end of the optical fiber and the photoelectric conversion element, and a plurality of electrodes protruded from the outer surface of the receiving member and aligned in a straight line. The optical fiber is drawn from the outer surface of the receiving member and in an oblique direction relative to a direction of the alignment of the plurality of electrodes.
摘要翻译: 光通信模块由光电转换元件组成,用于将光信号转换为电信号或电信号转换为光信号,光纤包括端部并光耦合到光电转换元件,接收元件包括: 外表面并且接收光纤和光电转换元件的端部,以及从接收构件的外表面突出并且以直线对准的多个电极。 光纤从接收构件的外表面并相对于多个电极的对准方向在倾斜方向上拉出。
-
7.
公开(公告)号:US20160231516A1
公开(公告)日:2016-08-11
申请号:US14614508
申请日:2015-02-05
申请人: Hitachi Metals, Ltd.
CPC分类号: G02B6/4214 , G02B6/4269 , G02B6/428 , G02B6/4284 , G02B6/43 , H05K7/02 , H05K7/20418
摘要: Space usable in various usages is ensured between a board and a communication module mounted on the board. A communication module is mounted on a motherboard inside a signal transmission device, and the communication module includes: a module frame having a lower plate and an upper plate facing each other and that contains a module board between the lower plate and the upper plate; and a male connector that is protruded from the lower plate and connected to a female connector provided in the motherboard. When the male connector is connected to the female connector, a gap is formed between the lower plate of the module frame and the motherboard.
摘要翻译: 在板和安装在板上的通信模块之间确保了可用于各种用途的空间。 通信模块安装在信号传输装置内的母板上,通信模块包括:模块框架,具有彼此相对的下板和上板,并且在下板和上板之间包含模块板; 以及阳连接器,其从下板突出并连接到设置在母板中的阴连接器。 当阳连接器连接到阴连接器时,在模块框架的下板和主板之间形成间隙。
-
公开(公告)号:US20150123260A1
公开(公告)日:2015-05-07
申请号:US14505049
申请日:2014-10-02
申请人: Hitachi Metals, Ltd.
IPC分类号: H01L23/40 , H01L23/473 , H01L23/467
CPC分类号: H01L23/473 , G02B6/4269 , G02B6/4286 , G02B6/4292 , G02B6/43 , H01L23/36 , H01L23/3672 , H01L23/4006 , H01L23/467 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要: To efficiently cool an IC chip and a transmission module disposed on the same substrate, amounting structure of transmission module of the present invention includes a motherboard, a package substrate mounted on the motherboard, an IC chip and a plurality of connectors disposed on amounting surface of the package substrate, a plurality of transmission modules connected to the plurality of connectors, and module cooling members having a plurality of slits provided along an connector array direction. The connectors are disposed inside the slits of module cooling members, and the transmission modules can be connected to and disconnected from the connectors disposed through the slits. The transmission modules connected to the connectors are in contact with inside surfaces of the slits and thermally connected to the cooling members.
摘要翻译: 为了有效地冷却设置在同一基板上的IC芯片和传输模块,本发明的传输模块的结构构成包括主板,安装在主板上的封装基板,IC芯片和设置在 封装基板,连接到多个连接器的多个传输模块以及具有沿着连接器阵列方向设置的多个狭缝的模块冷却构件。 连接器设置在模块冷却部件的狭缝的内部,并且传输模块可以连接到通过狭缝设置的连接器和与其分离。 连接到连接器的传输模块与狭缝的内表面接触并热连接到冷却构件。
-
公开(公告)号:US20140140011A1
公开(公告)日:2014-05-22
申请号:US14046372
申请日:2013-10-04
申请人: Hitachi Metals, Ltd.
IPC分类号: H05K7/20
CPC分类号: H01L23/4338 , H01L23/40 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要: Thermal connection between a plurality of communication modules and a heatsink placed on these communication modules is securely achieved and maintained. In a signal transmission device in which a common heatsink is arranged on a plurality of communication modules equipped on a board, the signal transmission device has a coil spring provided between the board and the communication modules, and the communication modules are biased toward the heatsink by the coil spring so that an upper surface of the communication module is pressed against a bottom surface of the heatsink.
摘要翻译: 可靠地实现和维护多个通信模块与放置在这些通信模块上的散热器之间的热连接。 在配置在板上的多个通信模块上配置公共散热器的信号传输装置中,信号传输装置具有设置在板和通信模块之间的螺旋弹簧,并且通信模块通过 所述螺旋弹簧使得所述通信模块的上表面被压靠在所述散热器的底面上。
-
公开(公告)号:US20160014891A1
公开(公告)日:2016-01-14
申请号:US14752449
申请日:2015-06-26
申请人: Hitachi Metals, Ltd.
发明人: Akira OGURA , Kinya YAMAZAKI , Masataka SATO , Shinji KOMATSUZAKI
CPC分类号: H05K1/11 , H05K1/0268 , H05K1/0274 , H05K1/117 , H05K2201/10189 , H05K2201/10446
摘要: A transmission module includes an electrically insulative substrate body, a first card edge connector provided at a first end of the substrate body, a second card edge connector provided at a second end of the substrate body, a circuit element mounted on the substrate body, a control element mounted on the substrate body and provided with a built-in memory which controls the circuit element, a first wiring pattern formed on the substrate body for connecting an electrode of the first card edge connector and the control element together, and a second wiring pattern formed on the substrate body for connecting an electrode of the second card edge connector and the control element together.
摘要翻译: 传输模块包括电绝缘基板主体,设置在基板主体的第一端的第一卡缘连接器,设置在基板主体的第二端的第二卡缘连接器,安装在基板主体上的电路元件, 控制元件,其安装在基板主体上并设置有控制电路元件的内置存储器,形成在基板主体上用于将第一卡缘连接器的电极和控制元件连接在一起的第一布线图案,以及第二布线 形成在基板主体上用于将第二卡缘连接器的电极和控制元件连接在一起的图案。
-
-
-
-
-
-
-
-
-