公开(公告)号：US20100048106A1

公开(公告)日：2010-02-25

申请号：US12196860

申请日：2008-08-22

申请人： YULIN WANG ,  Alpay Yilmaz

发明人： YULIN WANG ,  Alpay Yilmaz

IPC分类号： B24B57/02 ,  B24B7/00 ,  B24B29/00

CPC分类号： B24B57/02 ,  B24B37/04 ,  B24B37/042

摘要： A chemical mechanical polisher comprises a polishing platen capable of supporting a polishing pad, and first and second substrate carriers that are each capable of holding a substrate against the polishing pad. First and second slurry dispensers, each comprise (i) an arm comprising a pivoting end and a distal end, (ii) at least one slurry dispensing nozzle on the distal end, and (iii) a dispenser drive capable of rotating the arm about the pivoting end to swing the slurry dispensing nozzle at the distal end to dispense slurry across the polishing platen.

摘要翻译： 化学机械抛光机包括能够支撑抛光垫的研磨台板，以及能够将基板保持在抛光垫上的第一和第二基板载体。 第一和第二浆液分配器，每个包括（i）包括枢转端和远端的臂，（ii）在远端上的至少一个浆料分配喷嘴，以及（iii）能够围绕 枢转端以使浆料分配喷嘴在远端摆动，以将浆料分配到抛光台板上。

公开(公告)号：US20100041316A1

公开(公告)日：2010-02-18

申请号：US12191959

申请日：2008-08-14

申请人： Yulin Wang ,  Roy Nangoy ,  Alpay Yilmaz

发明人： Yulin Wang ,  Roy Nangoy ,  Alpay Yilmaz

IPC分类号： B24B1/00

CPC分类号： H01L21/3212 ,  B24B37/042 ,  B24B53/017

摘要： A method for polishing a substrate on a pad large enough to accommodate polishing at least two substrates simultaneously The method includes simultaneously pressing a first substrate and a second substrate against a single polishing surface of a polishing module, providing polishing fluid from a first fluid delivery arm in front of the first substrate while the first substrate is pressed against the polishing surface, providing polishing fluid from a second fluid delivery arm at a location in front of the second substrate while the second substrate is pressed against the polishing surface, conditioning the polishing surface with a first conditioner at a location behind the first substrate while the first substrate is pressed against the polishing surface, and conditioning the polishing surface with a second conditioner at a location behind the second substrate while the second substrate is pressed against the polishing surface.

摘要翻译： 一种用于在衬垫上抛光足够大的衬底以适应同时抛光至少两个衬底的方法。该方法包括同时将第一衬底和第二衬底压在抛光模块的单个研磨表面上，从第一流体输送臂 在第一衬底被压靠在抛光表面上的同时，在第二衬底的前面的位置处提供来自第二流体输送臂的抛光流体，同时将第二衬底压在抛光表面上，调节抛光表面 在第一衬底被压靠在抛光表面上的同时在第一衬底后面的位置处的第一调节器，并且在第二衬底被压靠在抛光表面上的同时在第二衬底后面的位置用第二调理器调理抛光表面。

公开(公告)号：US08414357B2

公开(公告)日：2013-04-09

申请号：US12196860

申请日：2008-08-22

申请人： Yulin Wang ,  Alpay Yilmaz

发明人： Yulin Wang ,  Alpay Yilmaz

IPC分类号： B24B7/22

CPC分类号： B24B57/02 ,  B24B37/04 ,  B24B37/042

摘要： A chemical mechanical polisher comprises a polishing platen capable of supporting a polishing pad, and first and second substrate carriers that are each capable of holding a substrate against the polishing pad. First and second slurry dispensers, each comprise (i) an arm comprising a pivoting end and a distal end, (ii) at least one slurry dispensing nozzle on the distal end, and (iii) a dispenser drive capable of rotating the arm about the pivoting end to swing the slurry dispensing nozzle at the distal end to dispense slurry across the polishing platen.

摘要翻译： 化学机械抛光机包括能够支撑抛光垫的研磨台板，以及能够将基板保持在抛光垫上的第一和第二基板载体。 第一和第二浆液分配器，每个包括（i）包括枢转端和远端的臂，（ii）在远端上的至少一个浆料分配喷嘴，以及（iii）能够围绕 枢转端以使浆料分配喷嘴在远端摆动，以将浆料分配到抛光台板上。

公开(公告)号：US07611400B2

公开(公告)日：2009-11-03

申请号：US11741609

申请日：2007-04-27

申请人： Alpay Yilmaz ,  Lakshmanan Karuppiah

发明人： Alpay Yilmaz ,  Lakshmanan Karuppiah

IPC分类号： B24B53/00

CPC分类号： B24B53/017 ,  H01L21/67051 ,  H01L21/67092 ,  H01L21/67253

摘要： A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioning mechanism selectively positions the conditioning element over the polishing surface and over the rinse station. At least one sensor is provided and is configured to detect a first position and a second position of the conditioning element when disposed over the rinse station.

摘要翻译： 提供了一种用于监测抛光垫调节机构的方法和装置。 在一个实施例中，半导体衬底抛光系统包括冲洗台，抛光表面，调节元件和调节机构。 调理机构选择性地将调理元件定位在抛光表面上和漂洗台上。 提供至少一个传感器，并且被配置为当设置在漂洗站上时检测调理元件的第一位置和第二位置。

公开(公告)号：US20070235344A1

公开(公告)日：2007-10-11

申请号：US11399560

申请日：2006-04-06

申请人： Renhe Jia ,  You Wang ,  Gerald Alonzo ,  Yongqi Hu ,  Zhihong Wang ,  Jie Diao ,  Stan D Tsai ,  Alpay Yilmaz ,  Lakshmanan Karuppiah ,  Liang-Yuh Chen

发明人： Renhe Jia ,  You Wang ,  Gerald Alonzo ,  Yongqi Hu ,  Zhihong Wang ,  Jie Diao ,  Stan D Tsai ,  Alpay Yilmaz ,  Lakshmanan Karuppiah ,  Liang-Yuh Chen

IPC分类号： B23H5/08

CPC分类号： B23H5/08 ,  C25F3/02 ,  H01L21/32125

摘要： A method for electrochemical mechanical polishing (ECMP) is disclosed. The polishing rate and surface finish of the layer on the wafer are improved by controlling the surface speed of both the platen and head, controlling the current applied to the pad, and preselecting the density of the perforations on the fully conductive polishing pad. ECMP produces much higher removal rates, good surface finishes, and good planarization efficiency at a lower down force. Generally, increasing the surface speed of both the platen and the head will increase the surface smoothness. Also, increasing the current density on the wafer will increase the surface smoothness. There is virtually no difference in the smoothness of the wafer surface between the center, middle, and edge of the wafer. For copper, removal rates of 10,000 Å/min and greater can be achieved.

摘要翻译： 公开了一种用于电化学机械抛光（ECMP）的方法。 通过控制压板和头部的表面速度，控制施加到垫的电流以及预选在全导电抛光垫上的穿孔密度来提高晶片上层的抛光速率和表面光洁度。 ECMP在较低的下压力下产生高得多的去除率，良好的表面光洁度和良好的平面化效率。 通常，增加压板和头部的表面速度将增加表面平滑度。 此外，增加晶片上的电流密度将增加表面平滑度。 在晶片的中心，中间和边缘之间的晶片表面的平滑度几乎没有差别。 对于铜，可以实现10,000 / min以上的去除率。

公开(公告)号：US08308529B2

公开(公告)日：2012-11-13

申请号：US12427411

申请日：2009-04-21

申请人： Allen L. D'Ambra ,  Alpay Yilmaz

发明人： Allen L. D'Ambra ,  Alpay Yilmaz

IPC分类号： B24B5/00 ,  B24B41/02

CPC分类号： B24B37/345 ,  B24B27/0076 ,  B24B37/042 ,  B24B41/005

摘要： Embodiments of a system and method for polishing substrates are provided. In one embodiment, a polishing system is provided that includes a polishing module, a cleaner and a robot. The robot has a range of motion sufficient to transfer substrates between the polishing module and cleaner. The polishing module includes at least two polishing stations, at least one load cup and at least four polishing heads. The polishing heads are configured to move independently between the at least two polishing stations and the at least one load cup.

摘要翻译： 提供了用于抛光基板的系统和方法的实施例。 在一个实施例中，提供了包括抛光模块，清洁器和机器人的抛光系统。 机器人具有足以在抛光模块和清洁器之间传送基板的运动范围。 抛光模块包括至少两个抛光台，至少一个装载杯和至少四个抛光头。 抛光头构造成在至少两个抛光台和至少一个装载杯之间独立地移动。

公开(公告)号：US20070095677A1

公开(公告)日：2007-05-03

申请号：US11554928

申请日：2006-10-31

申请人： You Wang ,  Stan Tsai ,  Lakshmanan Karuppiah ,  Jie Diao ,  Renhe Jia ,  Alpay Yilmaz

发明人： You Wang ,  Stan Tsai ,  Lakshmanan Karuppiah ,  Jie Diao ,  Renhe Jia ,  Alpay Yilmaz

IPC分类号： B23H3/00

CPC分类号： B23H5/08 ,  B24B37/042 ,  B24B37/046 ,  B24B53/017 ,  C25F1/00 ,  H01L21/32125

摘要： A method for conditioning an Ecmp pad is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of providing an electrical bias voltage between the top surface of the pad assembly and an electrode, and electrochemically removing contaminants from the top surface of the pad.

摘要翻译： 提供了一种调节Ecmp垫的方法。 在一个实施例中，用于电化学处理衬底的方法包括以下步骤：在衬垫组件的顶表面和电极之间提供电偏置电压，以及电化学去除衬垫顶表面的污染物。

公开(公告)号：US07210981B2

公开(公告)日：2007-05-01

申请号：US11273766

申请日：2005-11-14

申请人： Alpay Yilmaz ,  Lakshmanan Karuppiah

发明人： Alpay Yilmaz ,  Lakshmanan Karuppiah

IPC分类号： B24B53/00

CPC分类号： B24B53/017 ,  H01L21/67051 ,  H01L21/67092 ,  H01L21/67253

摘要： A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioning mechanism selectively positions the conditioning element over the polishing surface and over the rinse station. At least one sensor is provided and is configured to detect a first position and a second position of the conditioning element when disposed over the rinse station.

摘要翻译： 提供了一种用于监测抛光垫调节机构的方法和装置。 在一个实施例中，半导体衬底抛光系统包括冲洗台，抛光表面，调节元件和调节机构。 调理机构选择性地将调理元件定位在抛光表面上和漂洗台上。 提供至少一个传感器，并且被配置为当设置在漂洗站上时检测调理元件的第一位置和第二位置。

公开(公告)号：US07044832B2

公开(公告)日：2006-05-16

申请号：US10988647

申请日：2004-11-15

申请人： Alpay Yilmaz ,  Simon Yavelberg ,  Toshikazu Tomita ,  Hui Chen ,  Noel Manto ,  David J. Lischka ,  Hung Chih Chen

发明人： Alpay Yilmaz ,  Simon Yavelberg ,  Toshikazu Tomita ,  Hui Chen ,  Noel Manto ,  David J. Lischka ,  Hung Chih Chen

IPC分类号： B24B49/00

CPC分类号： B24B37/345

摘要： Embodiments of a load cup for transferring a substrate are provided. The load cup includes a pedestal assembly having a substrate support and a de-chucking nozzle. The de-chucking nozzle is positioned to flow a fluid between the polishing head and the back side of a substrate during transfer of the substrate from the polishing head to the substrate support.

摘要翻译： 提供了用于转移衬底的负载杯的实施例。 负载杯包括具有基板支撑件和去夹紧喷嘴的基座组件。 在将基板从抛光头转移到基板支撑件的过程中，去夹紧喷嘴定位成使流体在基板的抛光头和背面之间流动。

公开(公告)号：US20130199405A1

公开(公告)日：2013-08-08

申请号：US13368477

申请日：2012-02-08

申请人： Jagan Rangarajan ,  Alpay Yilmaz

发明人： Jagan Rangarajan ,  Alpay Yilmaz

IPC分类号： B60L15/00

CPC分类号： B24B37/04 ,  B24B27/0023

摘要： Embodiments of the present invention relate to an apparatus and a method for transferring substrate processing equipment. One embodiment of the present invention includes a track assembly having a continuous guide rail formed from a unitary body. The track assembly also includes vertically arranged stator strips for driving motor coils of a plurality of carriages. The motor coils in the carriages may be modular including coil segments of various lengths. The coil segments and the carriages may be driven individually and jointly.

摘要翻译： 本发明的实施例涉及一种用于转移衬底处理设备的装置和方法。 本发明的一个实施例包括具有由整体形成的连续导轨的轨道组件。 轨道组件还包括用于驱动多个滑架的电动机线圈的垂直布置的定子条。 托架中的马达线圈可以是模块化的，包括各种长度的线圈段。 线圈段和托架可以单独和共同地驱动。