Internal electrode paste and production method of electronic device
    6.
    发明授权
    Internal electrode paste and production method of electronic device 失效
    电子器件的内部电极糊和生产方法

    公开(公告)号:US07485244B2

    公开(公告)日:2009-02-03

    申请号:US10549515

    申请日:2004-03-25

    IPC分类号: H01B1/22 B05D5/12

    CPC分类号: H01G4/008 H01G4/012 H01G4/30

    摘要: An internal electrode paste comprises electrode material powder, a binder resin containing a polyvinyl butyral resin as the main component, and a solvent. The internal electrode paste furthermore comprises a plasticizer, and the plasticizer is contained by 25 parts by weight or more and 150 parts by weight or less with respect to 100 parts by weight of the binder resin. The binder resin is contained by 2.5 to 5.5 parts by weight with respect to 100 parts by weight of the electrode material powder. It is possible to provide an internal electrode paste having enough strength and an adhesive force for the dry transfer method, and a production method of an electronic device using the paste.

    摘要翻译: 内部电极糊料包括电极材料粉末,含有聚乙烯醇缩丁醛树脂作为主要成分的粘合剂树脂和溶剂。 内部电极糊还含有增塑剂,相对于100重量份粘合剂树脂,增塑剂的含量为25重量份以上且150重量份以下。 粘合剂树脂相对于100重量份的电极材料粉末含有2.5-5.5重量份。 可以提供具有足够的强度和用于干法转印方法的粘合力的内部电极浆料,以及使用该糊料的电子器件的制造方法。

    Method for preparing conductive paste for inner electrode of multi-layered ceramic electronic component
    7.
    发明申请
    Method for preparing conductive paste for inner electrode of multi-layered ceramic electronic component 审中-公开
    制备多层陶瓷电子部件内电极用导电膏的方法

    公开(公告)号:US20070034841A1

    公开(公告)日:2007-02-15

    申请号:US10573959

    申请日:2004-09-28

    IPC分类号: H01B1/22

    CPC分类号: H01G4/008 H01G4/012 H01G4/30

    摘要: It is an object of the present invention to provide a method for preparing a conductive paste for an inner electrode of a multi-layered ceramic electronic component that enables preparation of a conductive paste in which a conductive material is dispersed with a high dispersibility while controlling the concentration of the conductive material in a desired manner. The method for preparing a conductive paste for an inner electrode of a multi-layered ceramic electronic component includes a kneading step of kneading a conductive powder, a binder and a solvent to form a clay-like mixture and a slurrying step of adding the same solvent as that used at the kneading step to the mixture obtained by the kneading step to lower the viscosity of the mixture, thereby slurrying the mixture.

    摘要翻译: 本发明的目的是提供一种制备多层陶瓷电子部件的内部电极用导电性糊料的方法,该方法能够制备导电性糊剂,其中导电性材料以高分散性分散,同时控制 导电材料以所需方式浓缩。 制备多层陶瓷电子部件的内部电极用导电性糊剂的方法包括:捏合上述导电性粉末,粘合剂和溶剂以形成粘土状混合物的混炼工序和将该溶剂 与通过捏合步骤获得的混合物在捏合步骤中使用的那样降低混合物的粘度,从而使混合物成浆。

    Multilayer ceramic substrate
    8.
    发明授权
    Multilayer ceramic substrate 有权
    多层陶瓷基板

    公开(公告)号:US07749592B2

    公开(公告)日:2010-07-06

    申请号:US11702542

    申请日:2007-02-06

    IPC分类号: B32B9/00 H05K1/11

    摘要: A multilayer ceramic substrate includes a plurality of stacked glass ceramic layers and internal conductors. The glass ceramic layers contain at least one diffusion element selected from the group consisting of Ti, Zr and Mn. The internal conductors contain Ag as a conductive material. The multilayer ceramic substrate is produced by the steps of adding at least one diffusion element selected from the group consisting of Ti, Zr and Mn to conductive paste and diffusing the diffusion element in the glass ceramic layers around the conductive paste. As a result, defects otherwise possibly generated around the internal conductors can be eliminated with exactitude.

    摘要翻译: 多层陶瓷基板包括多个堆叠的玻璃陶瓷层和内部导体。 玻璃陶瓷层含有至少一种选自Ti,Zr和Mn的扩散元件。 内部导体包含Ag作为导电材料。 通过以下步骤制造多层陶瓷基板:将至少一种选自Ti,Zr和Mn的扩散元件添加到导电浆料中,并使扩散元件在导电浆料周围的玻璃陶瓷层中扩散。 结果,可以精确地消除在内部导体周围产生的缺陷。