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    INDUCTOR COMPONENT AND PRINTED WIRING BOARD INCORPORATING INDUCTOR COMPONENT AND METHOD FOR MANUFACTURING INDUCTOR COMPONENT
    5.
    发明申请
    INDUCTOR COMPONENT AND PRINTED WIRING BOARD INCORPORATING INDUCTOR COMPONENT AND METHOD FOR MANUFACTURING INDUCTOR COMPONENT 有权
    电感元件和印刷电路板电感元件的组成及制造电感元件的方法

    公开(公告)号：US20120212919A1

    公开(公告)日：2012-08-23

    申请号：US13360201

    申请日：2012-01-27

    申请人： Yasuhiko MANO ,  Shinobu Kato ,  Takashi Kariya

    发明人： Yasuhiko MANO ,  Shinobu Kato ,  Takashi Kariya

    IPC分类号： H05K7/06 ,  H05K1/02 ,  H05K3/30 ,  H05K1/16

    CPC分类号： H05K3/4602 ,  H01F17/0033 ,  H01F2017/004 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/0032 ,  H05K2201/1003 ,  H05K2203/1469 ,  H05K2203/1572 ,  Y10T29/4913

    摘要： A printed wiring board includes a core substrate having a cavity and having first and second surfaces, an inductor component accommodated in the cavity, a filler resin filling a gap formed between the substrate and component in the cavity, and a buildup layer formed on the first surface of the substrate and the component. The component has a coil layer, a second insulation layer formed on the coil layer, an electrode formed on the substance layer, and a via conductor formed in the substance layer and connecting the coil layer and the electrode, the component is accommodated in the cavity such that the electrode faces the first surface of the substrate, and the buildup layer includes an interlayer insulation layer formed on the first surface of the substrate and the component, a conductive layer formed on the insulation layer, and a connection via conductor connecting the conductive layer and electrode.

    摘要翻译： 一种印刷电路板包括具有空腔并具有第一和第二表面的芯基板，容纳在空腔中的电感器部件，填充在基板和空腔中的部件之间形成的间隙的填充树脂，以及形成在第一 基板表面和部件。 该部件具有线圈层，形成在线圈层上的第二绝缘层，形成在物质层上的电极和形成在物质层中并连接线圈层和电极的通孔导体，该部件容纳在腔体 使得电极面对衬底的第一表面，并且积聚层包括形成在衬底的第一表面上的层间绝缘层和构件，形成在绝缘层上的导电层，以及连接导体 层和电极。

    Inductor component and printed wiring board incorporating inductor component and method for manufacturing inductor component
    9.
    发明授权
    Inductor component and printed wiring board incorporating inductor component and method for manufacturing inductor component 有权
    包含电感器部件的电感器部件和印刷线路板以及用于制造电感器部件的方法

    公开(公告)号：US09265158B2

    公开(公告)日：2016-02-16

    申请号：US13360201

    申请日：2012-01-27

    申请人： Yasuhiko Mano ,  Shinobu Kato ,  Takashi Kariya

    发明人： Yasuhiko Mano ,  Shinobu Kato ,  Takashi Kariya

    IPC分类号： H05K3/46 ,  H05K1/18 ,  H01F17/00 ,  H05K3/00

    CPC分类号： H05K3/4602 ,  H01F17/0033 ,  H01F2017/004 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/0032 ,  H05K2201/1003 ,  H05K2203/1469 ,  H05K2203/1572 ,  Y10T29/4913

    摘要： A printed wiring board includes a core substrate having a cavity and having first and second surfaces, an inductor component accommodated in the cavity, a filler resin filling a gap formed between the substrate and component in the cavity, and a buildup layer formed on the first surface of the substrate and the component. The component has a coil layer, a second insulation layer formed on the coil layer, an electrode formed on the substance layer, and a via conductor formed in the substance layer and connecting the coil layer and the electrode, the component is accommodated in the cavity such that the electrode faces the first surface of the substrate, and the buildup layer includes an interlayer insulation layer formed on the first surface of the substrate and the component, a conductive layer formed on the insulation layer, and a connection via conductor connecting the conductive layer and electrode.

    摘要翻译： 一种印刷电路板包括具有空腔并具有第一和第二表面的芯基板，容纳在空腔中的电感器部件，填充在基板和空腔中的部件之间形成的间隙的填充树脂，以及形成在第一 基板表面和部件。 该部件具有线圈层，形成在线圈层上的第二绝缘层，形成在物质层上的电极和形成在物质层中并连接线圈层和电极的通孔导体，该部件容纳在腔体 使得电极面对衬底的第一表面，并且积聚层包括形成在衬底的第一表面上的层间绝缘层和构件，形成在绝缘层上的导电层，以及连接导体 层和电极。