公开(公告)号：US20110102122A1

公开(公告)日：2011-05-05

申请号：US12985475

申请日：2011-01-06

申请人： Yasuhiko MANO ,  Takashi KARIYA ,  Shinobu KATO

发明人： Yasuhiko MANO ,  Takashi KARIYA ,  Shinobu KATO

IPC分类号： H01F5/00 ,  H05K3/00

CPC分类号： H05K3/4046 ,  H01F17/0006 ,  H01F17/06 ,  H01F41/046 ,  H01F2017/002 ,  H01F2017/065 ,  H01L23/645 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0233 ,  H05K1/115 ,  H05K1/185 ,  H05K3/42 ,  H05K3/4602 ,  H05K2201/086 ,  H05K2201/09581 ,  Y10T29/4902 ,  H01L2224/05599

摘要： A printed wiring board including a substrate having a first surface and a second surface on the opposite side of the second surface, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, a magnetic body embedded in the substrate and extending in a thickness direction of the substrate, the magnetic body having a through-hole formed through the magnetic body and extending in the thickness direction of the substrate, and a through-hole conductor formed on an inner surface of the through-hole of the magnetic body such that the first and second conductive circuits are electrically connected to each other through the through-hole conductor.

摘要翻译： 一种印刷电路板，包括具有在所述第二表面的相对侧上的第一表面和第二表面的基板，形成在所述基板的第一表面上的第一导电电路，形成在所述基板的第二表面上的第二导电电路， 磁性体，其嵌入到所述基板中并沿着所述基板的厚度方向延伸，所述磁性体具有通过所述磁性体形成并在所述基板的厚度方向上延伸的通孔，以及形成在所述基板的内部的通孔导体 磁体的通孔的表面，使得第一和第二导电电路通过通孔导体彼此电连接。

公开(公告)号：US20120212919A1

公开(公告)日：2012-08-23

申请号：US13360201

申请日：2012-01-27

申请人： Yasuhiko MANO ,  Shinobu Kato ,  Takashi Kariya

发明人： Yasuhiko MANO ,  Shinobu Kato ,  Takashi Kariya

IPC分类号： H05K7/06 ,  H05K1/02 ,  H05K3/30 ,  H05K1/16

CPC分类号： H05K3/4602 ,  H01F17/0033 ,  H01F2017/004 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/0032 ,  H05K2201/1003 ,  H05K2203/1469 ,  H05K2203/1572 ,  Y10T29/4913

摘要： A printed wiring board includes a core substrate having a cavity and having first and second surfaces, an inductor component accommodated in the cavity, a filler resin filling a gap formed between the substrate and component in the cavity, and a buildup layer formed on the first surface of the substrate and the component. The component has a coil layer, a second insulation layer formed on the coil layer, an electrode formed on the substance layer, and a via conductor formed in the substance layer and connecting the coil layer and the electrode, the component is accommodated in the cavity such that the electrode faces the first surface of the substrate, and the buildup layer includes an interlayer insulation layer formed on the first surface of the substrate and the component, a conductive layer formed on the insulation layer, and a connection via conductor connecting the conductive layer and electrode.

摘要翻译： 一种印刷电路板包括具有空腔并具有第一和第二表面的芯基板，容纳在空腔中的电感器部件，填充在基板和空腔中的部件之间形成的间隙的填充树脂，以及形成在第一 基板表面和部件。 该部件具有线圈层，形成在线圈层上的第二绝缘层，形成在物质层上的电极和形成在物质层中并连接线圈层和电极的通孔导体，该部件容纳在腔体 使得电极面对衬底的第一表面，并且积聚层包括形成在衬底的第一表面上的层间绝缘层和构件，形成在绝缘层上的导电层，以及连接导体 层和电极。

公开(公告)号：US20100117779A1

公开(公告)日：2010-05-13

申请号：US12692907

申请日：2010-01-25

申请人： Yasuhiko MANO ,  Takashi Kariya ,  Shinobu Kato

发明人： Yasuhiko MANO ,  Takashi Kariya ,  Shinobu Kato

IPC分类号： H01F5/00

CPC分类号： H05K3/4046 ,  H01F17/0006 ,  H01F17/06 ,  H01F41/046 ,  H01F2017/002 ,  H01F2017/065 ,  H01L23/645 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0233 ,  H05K1/115 ,  H05K1/185 ,  H05K3/42 ,  H05K3/4602 ,  H05K2201/086 ,  H05K2201/09581 ,  Y10T29/4902 ,  H01L2224/05599

摘要： An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board.

摘要翻译： 嵌入印刷电路板的电感器包括沿着印刷电路板的厚度方向延伸的导体和与导体接触而不间隙的磁体。 例如，磁性体由具有圆柱形管状的铁氧体构成。 导体由在圆筒形管状铁氧体的内周面上电镀形成的铜膜构成。 电感器沿印刷电路板的厚度方向插入。

公开(公告)号：US20130020116A1

公开(公告)日：2013-01-24

申请号：US13484448

申请日：2012-05-31

申请人： Yasuhiko MANO ,  Shinobu Kato ,  Haruhiko Morita ,  Satoshi Kurokawa

发明人： Yasuhiko MANO ,  Shinobu Kato ,  Haruhiko Morita ,  Satoshi Kurokawa

IPC分类号： H05K1/02 ,  H05K1/11

CPC分类号： H05K1/0237 ,  H05K1/116 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/096

摘要： A printed wiring board has a packaging substrate having multiple pads, and a transmission substrate mounted on the multiple pads of the packaging substrate. The packaging substrate has a pad group constituted of pads which mount an electronic component, the multiple pads mounting the transmission substrate includes a first pad positioned in a peripheral portion of the packaging substrate and a second pad positioned between the first pad and the pad group, the second pad is electrically connected to a signal pad of the pads in the pad group, and the transmission substrate includes a horizontal wiring which electrically connects the second pad and the first pad and which transmits a signal between the second pad and the first pad.

摘要翻译： 印刷电路板具有包括多个焊盘的封装基板和安装在封装基板的多个焊盘上的传输基板。 封装基板具有由安装电子部件的焊盘构成的焊盘组，安装传输基板的多个焊盘包括位于封装基板周边部分的第一焊盘和位于第一焊盘和焊盘组之间的第二焊盘， 第二焊盘电连接到焊盘组中的焊盘的信号焊盘，并且传输基板包括电连接第二焊盘和第一焊盘并在第二焊盘和第一焊盘之间传输信号的水平布线。