利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

34 条记录 (耗时 0.016 秒)

    Printed wiring board
    1.
    发明授权
    Printed wiring board 有权
    印刷电路板

    公开(公告)号：US08743557B2

    公开(公告)日：2014-06-03

    申请号：US13484448

    申请日：2012-05-31

    申请人： Yasuhiko Mano ,  Shinobu Kato ,  Haruhiko Morita ,  Satoshi Kurokawa

    发明人： Yasuhiko Mano ,  Shinobu Kato ,  Haruhiko Morita ,  Satoshi Kurokawa

    IPC分类号： H05K7/00 ,  H05K1/11

    CPC分类号： H05K1/0237 ,  H05K1/116 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/096

    摘要： A printed wiring board has a packaging substrate having multiple pads, and a transmission substrate mounted on the multiple pads of the packaging substrate. The packaging substrate has a pad group constituted of pads which mount an electronic component, the multiple pads mounting the transmission substrate includes a first pad positioned in a peripheral portion of the packaging substrate and a second pad positioned between the first pad and the pad group, the second pad is electrically connected to a signal pad of the pads in the pad group, and the transmission substrate includes a horizontal wiring which electrically connects the second pad and the first pad and which transmits a signal between the second pad and the first pad.

    摘要翻译： 印刷电路板具有包括多个焊盘的封装基板和安装在封装基板的多个焊盘上的传输基板。 封装基板具有由安装电子部件的焊盘构成的焊盘组，安装传输基板的多个焊盘包括位于封装基板周边部分的第一焊盘和位于第一焊盘和焊盘组之间的第二焊盘， 第二焊盘电连接到焊盘组中的焊盘的信号焊盘，并且传输基板包括电连接第二焊盘和第一焊盘并在第二焊盘和第一焊盘之间传输信号的水平布线。

    PRINTED WIRING BOARD
    6.
    发明申请
    PRINTED WIRING BOARD 有权
    印刷线路板

    公开(公告)号：US20130020116A1

    公开(公告)日：2013-01-24

    申请号：US13484448

    申请日：2012-05-31

    申请人： Yasuhiko MANO ,  Shinobu Kato ,  Haruhiko Morita ,  Satoshi Kurokawa

    发明人： Yasuhiko MANO ,  Shinobu Kato ,  Haruhiko Morita ,  Satoshi Kurokawa

    IPC分类号： H05K1/02 ,  H05K1/11

    CPC分类号： H05K1/0237 ,  H05K1/116 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/096

    摘要： A printed wiring board has a packaging substrate having multiple pads, and a transmission substrate mounted on the multiple pads of the packaging substrate. The packaging substrate has a pad group constituted of pads which mount an electronic component, the multiple pads mounting the transmission substrate includes a first pad positioned in a peripheral portion of the packaging substrate and a second pad positioned between the first pad and the pad group, the second pad is electrically connected to a signal pad of the pads in the pad group, and the transmission substrate includes a horizontal wiring which electrically connects the second pad and the first pad and which transmits a signal between the second pad and the first pad.

    摘要翻译： 印刷电路板具有包括多个焊盘的封装基板和安装在封装基板的多个焊盘上的传输基板。 封装基板具有由安装电子部件的焊盘构成的焊盘组，安装传输基板的多个焊盘包括位于封装基板周边部分的第一焊盘和位于第一焊盘和焊盘组之间的第二焊盘， 第二焊盘电连接到焊盘组中的焊盘的信号焊盘，并且传输基板包括电连接第二焊盘和第一焊盘并在第二焊盘和第一焊盘之间传输信号的水平布线。

    Package board integrated with power supply
    8.
    发明授权
    Package board integrated with power supply 有权
    封装板集成了电源

    公开(公告)号：US07751205B2

    公开(公告)日：2010-07-06

    申请号：US11482793

    申请日：2006-07-10

    申请人： Takashi Kariya ,  Yasuhiko Mano ,  Shuichi Kawano ,  Liyi Chen

    发明人： Takashi Kariya ,  Yasuhiko Mano ,  Shuichi Kawano ,  Liyi Chen

    IPC分类号： H05K7/00

    CPC分类号： H01L23/49827 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/16152 ,  H01L2924/207 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/0002 ,  H01L2224/0401 ,  H01L2924/01005

    摘要： This invention provides a small package board integrated with power supply capable of supplying a low level of voltage and high level of current to an IC while achieving a low height of its power supply. It becomes hard to saturate an inductor magnetically when the surface of a copper wire is coated with a magnetic layer, and the inductor can accordingly be provided with a sufficient degree of inductance. A multiplicity of inductors can be provided within a confined space by arranging a multiplicity of inductors in parallel, and by fixing them with resin so as to form an inductor array, thereby making it possible to divide a power supply. The number of power supply lines is increased by dividing the power supply so as to reduce the level of current in an individual power supply line, so that a high level of current can be supplied to an IC chip. Further, a distance between a power supply and the IC chip can be decreased by incorporating a power supply module into the package board so as to reduce generation of heat and curb a drop in voltage in the power supply line, thereby making it possible to supply a high level of current to the IC chip.

    摘要翻译： 本发明提供了一种与电源集成的小封装板，其能够在实现其电源的低高度的同时向IC提供低电平和高电平的电流。 当铜线的表面涂覆有磁性层时，磁感应器难以饱和，并且电感器因此可以具有足够的电感。 通过并排布置多个电感器，并且通过用树脂固定它们以形成电感器阵列，可以在限制空间内提供多个电感器，从而可以划分电源。 通过分割电源来增加电源线的数量，以便降低单个电源线中的电流水平，从而可以向IC芯片提供高电平的电流。 此外，通过将电源模块并入封装板中可以减小电源和IC芯片之间的距离，以减少热量的产生并且抑制电源线中的电压下降，从而可以供应 电流高达IC芯片。

    Capacitor having adjustable capacitance, and printed wiring board having the same
    9.
    发明授权
    Capacitor having adjustable capacitance, and printed wiring board having the same 有权
    具有可调电容的电容器和具有其的印刷电路板

    公开(公告)号：US07662694B2

    公开(公告)日：2010-02-16

    申请号：US11495668

    申请日：2006-07-31

    申请人： Hajime Sakamoto ,  Takashi Kariya ,  Yasuhiko Mano

    发明人： Hajime Sakamoto ,  Takashi Kariya ,  Yasuhiko Mano

    IPC分类号： H01L21/20 ,  H01L21/02 ,  H01G4/005

    CPC分类号： H01G4/005 ,  H01G2/06 ,  H05K1/162 ,  H05K3/4644 ,  H05K2201/09509 ,  H05K2201/0969 ,  H05K2203/171

    摘要： The capacitance of a capacitor is adjusted by forming openings in one of a pair of electrodes of the capacitor, the openings having different sizes d1, d2, d3, . . . , wherein d1>d2>d3> . . . and being arranged in numbers n1, n2, n3, . . . , respectively; and sequentially filling a necessary number of the openings with an electroconductive material in descending order of the size so as to adjust the capacitance gradually with an increasing degree of precision. The resulting capacitor is mounted to a printed wiring board.

    摘要翻译： 通过在电容器的一对电极中的一个电极中形成开口来调节电容器的电容，开口具有不同的尺寸d1，d2，d3。 。 。 其中d1> d2> d3>。 。 。 并且以数字n1，n2，n3，...排列。 。 。 ， 分别; 并按照大小的降序顺序地用导电材料填充必要数量的开口，以随着精度的增加逐渐调整电容。 所得到的电容器安装到印刷线路板上。