公开(公告)号：US20060033209A1

公开(公告)日：2006-02-16

申请号：US11248887

申请日：2005-10-11

申请人： Junichi Iimura ,  Katsumi Okawa ,  Yasuhiro Koike ,  Hidefumi Saito

发明人： Junichi Iimura ,  Katsumi Okawa ,  Yasuhiro Koike ,  Hidefumi Saito

IPC分类号： H01L23/28

CPC分类号： H05K3/284 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00012

摘要： In a molding process, a hybrid integrated circuit substrate is fixed the position of the substrate in a thickness direction. A leadframe is connected, with an upward inclination, to a hybrid integrated circuit substrate and transported into a mold cavity. By horizontally fixing the leadframe by mold dies, the hybrid integrated circuit substrate inclined upward is urged downward by a pushpin. This can fix the position of the hybrid integrated circuit substrate within the mold cavity and integrally transfer-molded.

摘要翻译： 在成型工序中，将混合集成电路基板固定在厚度方向上的基板的位置。 引线框架向上倾斜地连接到混合集成电路基板并被输送到模腔中。 通过模具水平固定引线框架，向上倾斜的混合集成电路基板被图钉向下推动。 这可以将混合集成电路基板的位置固定在模腔内并整体地转印成型。

公开(公告)号：US06593169B2

公开(公告)日：2003-07-15

申请号：US10183757

申请日：2002-06-27

申请人： Junichi Iimura ,  Katsumi Okawa ,  Yasuhiro Koike ,  Hidefumi Saito

发明人： Junichi Iimura ,  Katsumi Okawa ,  Yasuhiro Koike ,  Hidefumi Saito

IPC分类号： H01L2100

CPC分类号： H01L21/565 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K3/284 ,  H01L2924/00 ,  H01L2924/20754 ,  H01L2224/05599 ,  H01L2924/00012

摘要： In a molding process, a hybrid integrated circuit substrate is positionally fixed in a horizontal direction. By abutting the points, where particularly leads having a spacing kept constant continue with a first connection portion, against guide pins provided on a mold die, a hybrid integrated circuit substrate can be positionally fixed. Because the spacing between the particular leads is not relied upon the number of terminals of the hybrid integrated circuit substrate, the mold can be commonly used where the number of terminals is different.

摘要翻译： 在成型工艺中，混合集成电路基板在水平方向上位置固定。 通过邻接点，其中具有间隔保持恒定的特定引线与第一连接部分相连，抵靠设置在模具上的引导销，混合集成电路基板可以被位置固定。 由于特定引线之间的间隔不依赖于混合集成电路基板的端子数量，所以可以通常使用端子数不同的模具。

公开(公告)号：US06974727B2

公开(公告)日：2005-12-13

申请号：US10183736

申请日：2002-06-27

申请人： Junichi Iimura ,  Katsumi Okawa ,  Yasuhiro Koike ,  Hidefumi Saito

发明人： Junichi Iimura ,  Katsumi Okawa ,  Yasuhiro Koike ,  Hidefumi Saito

IPC分类号： H01L23/28 ,  H01L21/56 ,  H01L23/31 ,  H01L23/433 ,  H05K3/28 ,  H01L21/50

CPC分类号： H05K3/284 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00012

摘要： In a molding process, a hybrid integrated circuit substrate is fixed the position of the substrate in a thickness direction. A leadframe is connected, with an upward inclination, to a hybrid integrated circuit substrate and transported into a mold cavity. By horizontally fixing the leadframe by mold dies, the hybrid integrated circuit substrate inclined upward is urged downward by a pushpin. This can fix the position of the hybrid integrated circuit substrate within the mold cavity and integrally transfer-molded.

摘要翻译： 在成型工序中，将混合集成电路基板固定在厚度方向上的基板的位置。 引线框架向上倾斜地连接到混合集成电路基板并被输送到模腔中。 通过模具水平固定引线框架，向上倾斜的混合集成电路基板被图钉向下推动。 这可以将混合集成电路基板的位置固定在模腔内并整体地转印成型。

公开(公告)号：US06975024B2

公开(公告)日：2005-12-13

申请号：US10183758

申请日：2002-06-27

申请人： Yasuhiro Koike ,  Hidefumi Saito ,  Katsumi Okawa ,  Junichi Iimura

发明人： Yasuhiro Koike ,  Hidefumi Saito ,  Katsumi Okawa ,  Junichi Iimura

IPC分类号： H01L21/56 ,  H01L23/433 ,  H01L23/495 ,  H05K1/05 ,  H05K3/00 ,  H05K3/28 ,  H01L23/02

CPC分类号： H05K3/284 ,  H01L21/565 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/20754 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K1/056 ,  H05K3/0052 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： In a manufacturing method of a hybrid integrated circuit device of the invention, transfer molding is carried put by positioning a curved surface formed in a back surface of the substrate on a lower mold die side and a burr formed in a main surface of the substrate on an upper mold die side. This utilizes the curved surface to inject thermosetting resin in an arrow direction to pour the thermosetting resin through a below of the substrate. There are no broken fragments of burr in a thermosetting resin at the below of the substrate. As a result, a required minimum resin thickness is secured at the below of the substrate, thus realizing a hybrid integrated circuit device having a high voltage resistance, an excellent heat dissipation property and a high product quality.

摘要翻译： 在本发明的混合集成电路装置的制造方法中，通过将形成在基板的背面的弯曲表面定位在下模具侧和将形成在基板的主表面上的毛刺定位在 上模具侧。 这利用弯曲表面沿箭头方向注入热固性树脂以将热固性树脂倒入基底的下面。 在基材的下面的热固性树脂中没有碎裂的碎片。 结果，在基板的下方确保了所需的最小树脂厚度，从而实现了具有高耐电压，优异的散热性能和高产品质量的混合集成电路器件。

公开(公告)号：US07751194B2

公开(公告)日：2010-07-06

申请号：US12239286

申请日：2008-09-26

申请人： Hideyuki Sakamoto ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

发明人： Hideyuki Sakamoto ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

IPC分类号： H05K7/20 ,  H01L23/28

CPC分类号： H05K7/20009 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19105 ,  H05K1/144 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided is a circuit device capable of increasing the packaging density and also suppressing the thermal interference between incorporated circuit elements. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member being arranged in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. In addition, inside the case member, a hollow portion (internal space) which is not filled with a sealing resin is provided, and this hollow portion communicates with the outside through a communicating opening, which is provided by partially opening the case member.

摘要翻译： 提供一种电路装置，其能够增加封装密度并且还抑制所加入的电路元件之间的热干扰。 在混合集成电路装置中，将第一电路基板和第二电路基板结合到壳体部件中，其中第一电路板与第二电路板重叠。 第一电路元件布置在第一电路板的上表面上，第二电路元件布置在第二电路板的上表面上。 另外，在壳体的内部，设置没有填充有密封树脂的中空部（内部空间），该中空部通过将壳体部件打开而设置的连通开口与外部连通。

公开(公告)号：US08102670B2

公开(公告)日：2012-01-24

申请号：US12239407

申请日：2008-09-26

申请人： Hideyuki Sakamoto ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

发明人： Hideyuki Sakamoto ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

IPC分类号： H05K7/14 ,  H05K7/18

CPC分类号： H05K1/144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/3447 ,  H05K7/1432 ,  H05K2201/042 ,  H05K2201/10166 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10689 ,  H05K2201/2018 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided is a circuit device, in which circuit elements incorporated are electrically connected to each other via a lead so as to achieve both of the enhanced functionality and miniaturization. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member in a way that a first circuit board is overlaid with a second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. Leads provided in the hybrid integrated circuit device include a lead connected only to the first circuit element mounted on the first circuit board, a lead connected only to the second circuit element mounted on the second circuit board, and a lead connected to both of the first circuit element and the second circuit element.

摘要翻译： 提供了一种电路装置，其中并入的电路元件经由引线彼此电连接，以便实现增强的功能和小型化两者。 在混合集成电路装置中，第一电路板和第二电路板以第一电路板与第二电路板重叠的方式结合到壳体构件中。 第一电路元件布置在第一电路板的上表面上，第二电路元件布置在第二电路板的上表面上。 在混合集成电路装置中提供的引线包括仅连接到安装在第一电路板上的第一电路元件的引线，仅连接到安装在第二电路板上的第二电路元件的引线，以及连接到第一 电路元件和第二电路元件。

公开(公告)号：US08169784B2

公开(公告)日：2012-05-01

申请号：US12239215

申请日：2008-09-26

申请人： Hideyuki Sakamoto ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

发明人： Hideyuki Sakamoto ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

IPC分类号： H05K7/00

CPC分类号： H01L25/162 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/13055 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： To improve reliability of a circuit module by improving heat release performance and minimizing thermal influence on a device to be mounted, a base substrate having a first substrate mounted thereon is fitted into a lower portion of casing member, and a second substrate is installed in the upper portion of the casing member so that a spaced area can be provided. In addition, a drive device to be installed on the second substrate is positioned off the center of the second substrate.

摘要翻译： 为了提高电路模块的可靠性，通过改善放热性能并使对安装的装置的热影响最小化，将具有安装在其上的第一衬底的基底衬套装配到壳体构件的下部中，并且将第二衬底安装在 壳体部件的上部，从而可以设置间隔开的区域。 此外，安装在第二基板上的驱动装置位于第二基板的中心之外。

公开(公告)号：US20090086442A1

公开(公告)日：2009-04-02

申请号：US12239215

申请日：2008-09-26

申请人： Hideyuki SAKAMOTO ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

发明人： Hideyuki SAKAMOTO ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

IPC分类号： H05K7/00

CPC分类号： H01L25/162 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/13055 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： To improve reliability of a circuit module by improving heat release performance and minimizing thermal influence on a device to be mounted, a base substrate having a first substrate mounted thereon is fitted into a lower portion of casing member, and a second substrate is installed in the upper portion of the casing member so that a spaced area can be provided. In addition, a drive device to be installed on the second substrate is positioned off the center of the second substrate.

摘要翻译： 为了提高电路模块的可靠性，通过改善放热性能并使对安装的装置的热影响最小化，将具有安装在其上的第一衬底的基底衬套装配到壳体构件的下部中，并且将第二衬底安装在 壳体部件的上部，从而可以设置间隔开的区域。 此外，安装在第二基板上的驱动装置位于第二基板的中心之外。

公开(公告)号：US08107255B2

公开(公告)日：2012-01-31

申请号：US12239256

申请日：2008-09-26

申请人： Hideyuki Sakamoto ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

发明人： Hideyuki Sakamoto ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

IPC分类号： H05K1/11 ,  H05K1/14

CPC分类号： H05K1/144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/3447 ,  H05K5/065 ,  H05K2201/042 ,  H05K2201/10318 ,  Y10T29/49146 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided is a circuit device that allows a plurality of circuit boards, which are stacked each other and arranged in a case member, to be sealed with a resin effectively, and a method of manufacturing the same. In a hybrid integrated circuit device, a first circuit board is overlaid with the second circuit board and both of the boards are fitted into the case member. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, an opening is provided in a side wall part of the case member, and an internal space of the case member communicates with the outside through this opening. Accordingly, in the resin sealing step, a sealing resin can be injected into the internal space of the case member from the outside through this opening.

摘要翻译： 本发明提供一种电路装置及其制造方法，其特征在于，能够使由树脂构成的多个电路基板与树脂密封而形成。 在混合集成电路装置中，第一电路板与第二电路板重叠，并且两个板都装配到壳体中。 第一电路元件布置在第一电路板的上表面上，第二电路元件布置在第二电路板的上表面上。 此外，在壳体构件的侧壁部设置有开口，壳体的内部空间通过该开口与外部连通。 因此，在树脂密封工序中，能够通过该开口从外部将密封树脂注入到壳体的内部空间。

公开(公告)号：US08102655B2

公开(公告)日：2012-01-24

申请号：US12837078

申请日：2010-07-15

申请人： Hideyuki Sakamoto ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

发明人： Hideyuki Sakamoto ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

IPC分类号： H05K7/20

CPC分类号： H05K1/144 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/3447 ,  H05K5/065 ,  H05K2201/042 ,  H05K2201/10318 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.

摘要翻译： 提供了能够增加封装密度并防止引入电路元件之间的热干扰的电路装置。 在混合集成电路装置中，第一电路板和第二电路板以第一电路板与第二电路板重叠的方式装配到壳体构件中。 第一电路元件布置在第一电路板的上表面上，第二电路元件布置在第二电路板的上表面上。 此外，在壳体内设置有未填充有密封树脂的中空部。 这样的结构防止作为微型计算机的第二电路元件例如由于在作为功率晶体管的第一电路元件中产生的热而不稳定地运行。