公开(公告)号：US20060033209A1

公开(公告)日：2006-02-16

申请号：US11248887

申请日：2005-10-11

申请人： Junichi Iimura ,  Katsumi Okawa ,  Yasuhiro Koike ,  Hidefumi Saito

发明人： Junichi Iimura ,  Katsumi Okawa ,  Yasuhiro Koike ,  Hidefumi Saito

IPC分类号： H01L23/28

CPC分类号： H05K3/284 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00012

摘要： In a molding process, a hybrid integrated circuit substrate is fixed the position of the substrate in a thickness direction. A leadframe is connected, with an upward inclination, to a hybrid integrated circuit substrate and transported into a mold cavity. By horizontally fixing the leadframe by mold dies, the hybrid integrated circuit substrate inclined upward is urged downward by a pushpin. This can fix the position of the hybrid integrated circuit substrate within the mold cavity and integrally transfer-molded.

摘要翻译： 在成型工序中，将混合集成电路基板固定在厚度方向上的基板的位置。 引线框架向上倾斜地连接到混合集成电路基板并被输送到模腔中。 通过模具水平固定引线框架，向上倾斜的混合集成电路基板被图钉向下推动。 这可以将混合集成电路基板的位置固定在模腔内并整体地转印成型。

公开(公告)号：US06975024B2

公开(公告)日：2005-12-13

申请号：US10183758

申请日：2002-06-27

申请人： Yasuhiro Koike ,  Hidefumi Saito ,  Katsumi Okawa ,  Junichi Iimura

发明人： Yasuhiro Koike ,  Hidefumi Saito ,  Katsumi Okawa ,  Junichi Iimura

IPC分类号： H01L21/56 ,  H01L23/433 ,  H01L23/495 ,  H05K1/05 ,  H05K3/00 ,  H05K3/28 ,  H01L23/02

CPC分类号： H05K3/284 ,  H01L21/565 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/20754 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K1/056 ,  H05K3/0052 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： In a manufacturing method of a hybrid integrated circuit device of the invention, transfer molding is carried put by positioning a curved surface formed in a back surface of the substrate on a lower mold die side and a burr formed in a main surface of the substrate on an upper mold die side. This utilizes the curved surface to inject thermosetting resin in an arrow direction to pour the thermosetting resin through a below of the substrate. There are no broken fragments of burr in a thermosetting resin at the below of the substrate. As a result, a required minimum resin thickness is secured at the below of the substrate, thus realizing a hybrid integrated circuit device having a high voltage resistance, an excellent heat dissipation property and a high product quality.

摘要翻译： 在本发明的混合集成电路装置的制造方法中，通过将形成在基板的背面的弯曲表面定位在下模具侧和将形成在基板的主表面上的毛刺定位在 上模具侧。 这利用弯曲表面沿箭头方向注入热固性树脂以将热固性树脂倒入基底的下面。 在基材的下面的热固性树脂中没有碎裂的碎片。 结果，在基板的下方确保了所需的最小树脂厚度，从而实现了具有高耐电压，优异的散热性能和高产品质量的混合集成电路器件。

公开(公告)号：US06593169B2

公开(公告)日：2003-07-15

申请号：US10183757

申请日：2002-06-27

申请人： Junichi Iimura ,  Katsumi Okawa ,  Yasuhiro Koike ,  Hidefumi Saito

发明人： Junichi Iimura ,  Katsumi Okawa ,  Yasuhiro Koike ,  Hidefumi Saito

IPC分类号： H01L2100

CPC分类号： H01L21/565 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K3/284 ,  H01L2924/00 ,  H01L2924/20754 ,  H01L2224/05599 ,  H01L2924/00012

摘要： In a molding process, a hybrid integrated circuit substrate is positionally fixed in a horizontal direction. By abutting the points, where particularly leads having a spacing kept constant continue with a first connection portion, against guide pins provided on a mold die, a hybrid integrated circuit substrate can be positionally fixed. Because the spacing between the particular leads is not relied upon the number of terminals of the hybrid integrated circuit substrate, the mold can be commonly used where the number of terminals is different.

摘要翻译： 在成型工艺中，混合集成电路基板在水平方向上位置固定。 通过邻接点，其中具有间隔保持恒定的特定引线与第一连接部分相连，抵靠设置在模具上的引导销，混合集成电路基板可以被位置固定。 由于特定引线之间的间隔不依赖于混合集成电路基板的端子数量，所以可以通常使用端子数不同的模具。

公开(公告)号：US06974727B2

公开(公告)日：2005-12-13

申请号：US10183736

申请日：2002-06-27

申请人： Junichi Iimura ,  Katsumi Okawa ,  Yasuhiro Koike ,  Hidefumi Saito

发明人： Junichi Iimura ,  Katsumi Okawa ,  Yasuhiro Koike ,  Hidefumi Saito

IPC分类号： H01L23/28 ,  H01L21/56 ,  H01L23/31 ,  H01L23/433 ,  H05K3/28 ,  H01L21/50

CPC分类号： H05K3/284 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00012

摘要： In a molding process, a hybrid integrated circuit substrate is fixed the position of the substrate in a thickness direction. A leadframe is connected, with an upward inclination, to a hybrid integrated circuit substrate and transported into a mold cavity. By horizontally fixing the leadframe by mold dies, the hybrid integrated circuit substrate inclined upward is urged downward by a pushpin. This can fix the position of the hybrid integrated circuit substrate within the mold cavity and integrally transfer-molded.

摘要翻译： 在成型工序中，将混合集成电路基板固定在厚度方向上的基板的位置。 引线框架向上倾斜地连接到混合集成电路基板并被输送到模腔中。 通过模具水平固定引线框架，向上倾斜的混合集成电路基板被图钉向下推动。 这可以将混合集成电路基板的位置固定在模腔内并整体地转印成型。

公开(公告)号：US07609498B2

公开(公告)日：2009-10-27

申请号：US11533211

申请日：2006-09-19

申请人： Junichi Iimura ,  Katsumi Okawa ,  Yasuhiro Koike ,  Soichi Izutani

发明人： Junichi Iimura ,  Katsumi Okawa ,  Yasuhiro Koike ,  Soichi Izutani

IPC分类号： H02H3/08

CPC分类号： H02H7/1222 ,  H02H3/006

摘要： An inverter circuit overcurrent protection device in which an overcurrent detection resistor (Rs) is incorporated in a hybrid integrated circuit, in which a detection voltage from the overcurrent detection resistor (Rs) is divided by voltage dividing resistors (R1 and R2) and is compared with a reference voltage in an overcurrent detection circuit, for carrying out an overcurrent protection, and an external resistor is connected in series or in parallel with one of the voltage dividing resistors (R1 and R2) to change a division ratio so that the level of overcurrent protection can be adjusted; and an embodiment wherein, in the vicinity of a current detection terminal, a first pad (P1) is connected to a detection voltage from the overcurrent detection resistance, a second pad (P2) is connected to a detection voltage from the amplifier, and a third pad (P3) is connected to the voltage dividing resistors, and a bonding wire (10) is connected between the current detection terminal one of said pads, to select one of a plurality of overcurrent protection devices.

摘要翻译： 一种逆变器电路过电流保护装置，其中过电流检测电阻器（Rs）被并入到混合集成电路中，其中来自过电流检测电阻器（Rs）的检测电压被分压电阻器（R1和R2）分压并被比较 在过电流检测电路中具有参考电压，用于执行过电流保护，并且外部电阻器与一个分压电阻器（R1和R2）串联或并联连接，以改变分压比，使得 过电流保护可调; 以及在电流检测端子附近，从过电流检测电阻将第一焊盘（P1）与检测电压连接的第二焊盘（P2）与放大器的检测电压连接， 第三焊盘（P3）连接到分压电阻器，并且接合线（10）连接在所述焊盘之一的电流检测端子之间，以选择多个过电流保护装置中的一个。

公开(公告)号：US07136269B2

公开(公告)日：2006-11-14

申请号：US10422556

申请日：2003-04-24

申请人： Junichi Iimura ,  Katsumi Okawa ,  Yasuhiro Koike ,  Soichi Izutani

发明人： Junichi Iimura ,  Katsumi Okawa ,  Yasuhiro Koike ,  Soichi Izutani

IPC分类号： H02H3/08

CPC分类号： H02H7/1222 ,  H02H3/006

摘要： An inverter circuit overcurrent protection device in which an overcurrent detection resistor (Rs) is incorporated in a hybrid integrated circuit, in which a detection voltage from the overcurrent detection resistor (Rs) is divided by voltage dividing resistors (R1 and R2) and is compared with a reference voltage in an overcurrent detection circuit, for carrying out an overcurrent protection, and an external resistor is connected in series or in parallel with one of the voltage dividing resistors (R1 and R2) to change a division ratio so that the level of overcurrent protection can be adjusted; and an embodiment wherein, in the vicinity of a current detection terminal, a first pad (P1) is connected to a detection voltage from the overcurrent detection resistance, a second pad (P2) is connected to a detection voltage from the amplifier, and a third pad (P3) is connected to the voltage dividing resistors, and a bonding wire (10) is connected between the current detection terminal one of said pads, to select one of a plurality of overcurrent protection devices.

摘要翻译： 一种逆变器电路过电流保护装置，其中过电流检测电阻器（Rs）被并入混合集成电路中，其中来自过电流检测电阻器（Rs）的检测电压被分压电阻器（R 1> SUB＆gt;和R＆lt; 2＆gt;），并与过电流检测电路中的参考电压进行比较，以实现过电流保护，并且外部电阻器与分压中的一个串联或并联 电阻器（R 1 1和R 2），以改变分频比，从而可以调节过电流保护的电平; 以及在电流检测端子附近，由过电流检测电阻将第一焊盘（P 1）与检测电压连接的第二焊盘（P 2）与放大器的检测电压连接的实施例， 并且第三焊盘（P 3）连接到分压电阻器，并且接合线（10）连接在所述焊盘之一的电流检测端子之间，以选择多个过电流保护装置中的一个。

公开(公告)号：US07075762B2

公开(公告)日：2006-07-11

申请号：US10610739

申请日：2003-06-30

申请人： Junichi Iimura ,  Katsumi Okawa ,  Yasuhiro Koike ,  Soichi Izutani

发明人： Junichi Iimura ,  Katsumi Okawa ,  Yasuhiro Koike ,  Soichi Izutani

IPC分类号： H02H7/00

CPC分类号： H02H7/122 ,  H02H5/041 ,  H02H5/042

摘要： In order to enable overheat protection and overcurrent protection as well as temperature detection of an inverter circuit, an inverter circuit comprises a switching circuit 9 composed of a plurality of switching elements and a control circuit 1 for generating a control signal to be inputted into a drive circuit 2 to control a load, a temperature detecting element 12 for detecting a change in temperature of the inverter circuit is provided in a temperature detection circuit 10, and a temperature detection signal which changes according to a change in temperature of said inverter circuit, an overheat abnormal signal outputted upon a rise in temperature to a predetermined temperature or more, and an overcurrent abnormal signal outputted from an overcurrent protection FET 13 are outputted via one commonly used terminal.

摘要翻译： 为了实现过热保护和过电流保护以及逆变器电路的温度检测，逆变器电路包括由多个开关元件组成的开关电路9和用于产生要输入到驱动器中的控制信号的控制电路1 用于控制负载的电路2，用于检测逆变器电路的温度变化的温度检测元件12设置在温度检测电路10中，并且温度检测信号根据所述逆变器电路的温度变化而变化， 将在温度上升时输出的异常信号过热至预定温度以上，从过电流保护FET13输出的过电流异常信号经由一个常用端子输出。

公开(公告)号：US20070014065A1

公开(公告)日：2007-01-18

申请号：US11533211

申请日：2006-09-19

申请人： Junichi Iimura ,  Katsumi Okawa ,  Yasuhiro Koike ,  Soichi Izutani

发明人： Junichi Iimura ,  Katsumi Okawa ,  Yasuhiro Koike ,  Soichi Izutani

IPC分类号： H02H3/08

CPC分类号： H02H7/1222 ,  H02H3/006

摘要： An inverter circuit overcurrent protection device in which an overcurrent detection resistor (Rs) is incorporated in a hybrid integrated circuit, in which a detection voltage from the overcurrent detection resistor (Rs) is divided by voltage dividing resistors (R1 and R2) and is compared with a reference voltage in an overcurrent detection circuit, for carrying out an overcurrent protection, and an external resistor is connected in series or in parallel with one of the voltage dividing resistors (R1 and R2) to change a division ratio so that the level of overcurrent protection can be adjusted; and an embodiment wherein, in the vicinity of a current detection terminal, a first pad (P1) is connected to a detection voltage from the overcurrent detection resistance, a second pad (P2) is connected to a detection voltage from the amplifier, and a third pad (P3) is connected to the voltage dividing resistors, and a bonding wire (10) is connected between the current detection terminal one of said pads, to select one of a plurality of overcurrent protection devices.

摘要翻译： 一种逆变器电路过电流保护装置，其中过电流检测电阻器（Rs）被并入混合集成电路中，其中来自过电流检测电阻器（Rs）的检测电压被分压电阻器（R 1> SUB＆gt;和R＆lt; 2＆gt;），并与过电流检测电路中的参考电压进行比较，以实现过电流保护，并且外部电阻器与分压中的一个串联或并联 电阻器（R 1 1和R 2），以改变分频比，从而可以调节过电流保护的电平; 以及在电流检测端子附近，由过电流检测电阻将第一焊盘（P 1）与检测电压连接的第二焊盘（P 2）与放大器的检测电压连接的实施例， 并且第三焊盘（P 3）连接到分压电阻器，并且接合线（10）连接在所述焊盘之一的电流检测端子之间，以选择多个过电流保护装置中的一个。

公开(公告)号：US20090011548A1

公开(公告)日：2009-01-08

申请号：US12182519

申请日：2008-07-30

申请人： Junichi Iimura ,  Yasuhiro Koike ,  Soichi Izutani

发明人： Junichi Iimura ,  Yasuhiro Koike ,  Soichi Izutani

IPC分类号： H01L21/60

CPC分类号： H01L21/481 ,  H01L23/49575 ,  H01L24/97 ,  H01L25/16 ,  H01L25/165 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K1/056 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/3405 ,  H05K2201/094 ,  H05K2201/09781 ,  H05K2201/1034 ,  H05K2201/10924 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00

摘要： A method of manufacturing a hybrid integrated circuit device of the present invention includes the steps of preparing a lead frame which constituted by units each having a plurality of leads, and fixing a circuit substrate on each unit of the lead frame by fixing pads which are formed on the surface of the circuit substrate to the leads, where a space between a first pad which is formed at an end edge of the circuit substrate and a second pad which is adjacent to the first pad is set narrower than a space between the pads themselves.

摘要翻译： 制造本发明的混合集成电路器件的方法包括以下步骤：制备由具有多个引线的单元构成的引线框架，以及通过形成的固定焊盘将电路基板固定在引线框架的每个单元上 在电路基板的与引线相关的表面上，形成在电路基板的端部边缘的第一焊盘与第一焊盘相邻的第二焊盘之间的空间被设定为比焊盘本身之间的空间窄 。

公开(公告)号：US08338234B2

公开(公告)日：2012-12-25

申请号：US12182519

申请日：2008-07-30

申请人： Junichi Iimura ,  Yasuhiro Koike ,  Soichi Izutani

发明人： Junichi Iimura ,  Yasuhiro Koike ,  Soichi Izutani

IPC分类号： H01L21/00

CPC分类号： H01L21/481 ,  H01L23/49575 ,  H01L24/97 ,  H01L25/16 ,  H01L25/165 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K1/056 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/3405 ,  H05K2201/094 ,  H05K2201/09781 ,  H05K2201/1034 ,  H05K2201/10924 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00

摘要： A method of manufacturing a hybrid integrated circuit device of the present invention includes the steps of preparing a lead frame which constituted by units each having a plurality of leads, and fixing a circuit substrate on each unit of the lead frame by fixing pads which are formed on the surface of the circuit substrate to the leads, where a space between a first pad which is formed at an end edge of the circuit substrate and a second pad which is adjacent to the first pad is set narrower than a space between the pads themselves.

摘要翻译： 制造本发明的混合集成电路器件的方法包括以下步骤：制备由具有多个引线的单元构成的引线框架，以及通过形成的固定焊盘将电路基板固定在引线框架的每个单元上 在电路基板的与引线相关的表面上，形成在电路基板的端部边缘的第一焊盘与第一焊盘相邻的第二焊盘之间的空间被设定为比焊盘本身之间的空间窄 。