Light emitting diode with tilted plane orientation
    1.
    发明授权
    Light emitting diode with tilted plane orientation 失效
    具有倾斜平面取向的发光二极管

    公开(公告)号:US5923054A

    公开(公告)日:1999-07-13

    申请号:US851272

    申请日:1997-05-05

    CPC分类号: H01L33/16 Y10S438/973

    摘要: In a light-emitting diode, which comprises epitaxial wafer where a gallium phosphide or a gallium phosphide arsenide mixed crystal epitaxial layer is grown on a III-V family compound single crystal substrate having zinc blende type crystal structure, the surface of said substrate has a plane tilted by 5 to 16.degree. from a (100) plane toward �010!, �001!, �0-10! or �00-1!, or a plane having crystallographically equivalent crystal plane orientation to this plane. As a result, it is possible to improve light emitting output and to ensure longer service life.

    摘要翻译: 在包含磷化镓或磷化镓砷混合晶体外延层的外延晶片的发光二极管中,在具有闪锌矿型晶体结构的III-V族复合单晶衬底上生长,所述衬底的表面具有 从(100)面向[010],[001],[0-10]或[00-1]倾斜5〜16°的平面,或具有与该平面相同的晶面取向的平面。 结果,可以提高发光输出并确保更长的使用寿命。

    Method of manufacturing semiconductor epitaxial wafer
    3.
    发明授权
    Method of manufacturing semiconductor epitaxial wafer 失效
    制造半导体外延晶片的方法

    公开(公告)号:US5660628A

    公开(公告)日:1997-08-26

    申请号:US291997

    申请日:1994-08-18

    IPC分类号: C30B25/02

    CPC分类号: C30B25/02 C30B29/40

    摘要: There is provided a method for suppressing generation of cracks or damages on a compound semiconductor epitaxial wafer during an epitaxial growth due to growth of an epitaxial layer on the rear surface at the edge of the epitaxial layer which is located at the upstream side of the flow of the source gas. In manufacturing a semiconductor wafer by growing a single crystal semiconductor epitaxial layer having a zinc blend structure on a single crystal semiconductor substrate having a zinc blend structure, the surface of the single crystal semiconductor substrate has (100) surface orientation having an off angle and a source gas is supplied in the direction of the off angle or in a direction at 30.degree. or less to the direction at 180.degree. thereto.

    摘要翻译: 提供了一种在外延生长期间抑制由于在位于流动的上游侧的外延层的边缘处的外表面上的外延层的生长而导致的外延生长期间的裂纹或损伤的产生的方法 的源气体。 在通过在具有锌掺杂结构的单晶半导体衬底上生长具有锌共混结构的单晶半导体外延层来制造半导体晶片的过程中,单晶半导体衬底的表面具有(100)表面取向具有偏角和 原料气体在偏离角度的方向或者在相对于180°的方向向30度以下的方向供给。

    Epitaxial wafer
    4.
    发明授权
    Epitaxial wafer 失效
    外延晶圆

    公开(公告)号:US4946801A

    公开(公告)日:1990-08-07

    申请号:US270275

    申请日:1988-11-14

    摘要: In an epitaxial wafer comprising of a single crystalline substrate, a p type gallium aluminum arsenide mixed crystalline layer and n type gallium aluminum arsenide mixed crystalline layer having an indirect transition type band structure. The p type gallium aluminum arsenide mixed crystalline layer consists of a gallium aluminum arsenide mixed crystalline layer having a direct transition type band structure, positioned about 3 to 10 .mu.m from the pn junction and a gallium aluminum arsenide mixed crystalline layer having an indirect transition type band structure. The aluminum arsenide mixed crystal ratio in the gallium aluminum arsenide is exponentially and gradually changed in the region between the direct transition type layer and the indirect transition type layer.

    Gallium arsenide phosphide epitaxial wafer and light emitting diode
    5.
    发明授权
    Gallium arsenide phosphide epitaxial wafer and light emitting diode 有权
    砷化镓磷化硅外延片和发光二极管

    公开(公告)号:US06218681B1

    公开(公告)日:2001-04-17

    申请号:US09220446

    申请日:1998-12-24

    申请人: Tadashige Sato

    发明人: Tadashige Sato

    IPC分类号: H01L2715

    CPC分类号: H01L33/305

    摘要: The present invention provides an epitaxial wafer having compound semiconductor epitaxial layer provided on a substrate, a total thickness of a portion of the compound semiconductor epitaxial layers comprises Ga, As and P as constituent elements being not less than 80 &mgr;m and in the epitaxial layer a low carrier concentration region with a carrier concentration of from 0.5 to 9×1015 cm−3 doped with nitrogen being formed.

    摘要翻译: 本发明提供一种具有设置在基板上的化合物半导体外延层的外延晶片,化合物半导体外延层的一部分的总厚度包括Ga,As和P作为构成元素不小于80μm,并且在外延层a 形成了掺杂有氮的载流子浓度为0.5至9×10 15 cm -3的低载流子浓度区域。

    Epitaxial wafer of gallium arsenide phosphide
    6.
    发明授权
    Epitaxial wafer of gallium arsenide phosphide 失效
    砷化镓磷的外延晶片

    公开(公告)号:US5751026A

    公开(公告)日:1998-05-12

    申请号:US801295

    申请日:1997-02-18

    摘要: In an epitaxial wafer of gallium arsenide phosphide, a single crystal substrate is provided thereon with a gallium arsenide phosphide layer with a varying mixed crystal ratio, a gallium arsenide phosphide layer with a constant mixed crystal ratio, and a nitrogen-doped gallium arsenide phosphide layer with a constant mixed crystal ratio. The nitrogen-doped gallium arsenide phosphide layer with a constant mixed crystal ratio has a carrier concentration of 3.times.10.sup.15 cm.sup.-3 or less.

    摘要翻译: 在砷化镓磷化物的外延晶片中,在其上提供具有变化的混晶比的砷化镓磷化物层的单晶衬底,具有恒定混晶比的砷化镓磷化物层和氮掺杂的砷化镓磷化物层 具有恒定的混晶比。 具有恒定混晶比的氮掺杂砷化镓磷化物层的载流子浓度为3×10 15 cm -3以下。